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HCD-DZ200
Q Q
5-13. PRINTED WIRING BOARD – MAIN BOARD (SIDE A) –
3 7 6 3 1 5 1 5 0
A
B
C
D
T E
L
1 3 9 4 2 2 9 6 5 1 3
E
A
DMB10
BOARD
CN4501
(Page 27)
F
F
I/O BOARD
CN601
(Page 46)
G
C
DMB10
BOARD
CN302
(Page 27)
H
DMB10
BOARD
CN106
(Page 27)
w w w
HCD-DZ200
• See page 21 for Circuit Boards Location.
1
2
3
IC106
IC105
IC503
IC110
IC109
1
2
R716
6
7
E
IC509
11
E3, AUS
10
D
R793
2
1
R639
E
x
a o
.
i
http://www.xiaoyu163.com
:Uses unleaded solder.
4
5
6
IC104
IC103
IC102
IC101
IC303
Q
Q
3
7
1
3
5
4
C119
IC108
IC305
R334
C356
R330
R331
R335
R340
4
1
IC301
5
8
R339
R337 R341
R333
R332
C357
R624
4
3
5
1
IC511
u 1 6 3
y
for PROGRAM WRITER
34
34
http://www.xiaoyu163.com
2
4
8
9
9
7
8
9
E
E
6
3
1
5
1
5
0
8
9
m
c o
C436
.
22
2
8
9
9
• Semiconductor
Location
Ref. No.
Location
D503
H-4
D914
F-8
D915
F-8
D923
H-8
D925
H-8
D932
D-7
IC101
D-6
IC102
D-5
IC103
D-4
IC104
D-4
IC105
D-3
IC106
D-2
IC108
E-5
IC109
E-4
IC110
E-3
IC301
E-6
IC303
D-6
IC305
E-5
IC503
E-2
IC509
H-3
IC511
H-4
2
4
9
8
2
9
9
Q506
H-4
Q507
G-3
Q943
D-7
Q947
D-7
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