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LG W3000 Service Manual

Gsm phone
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GSM Phone
SERVICE MANUAL
MODEL : W3000
P/N : XXXXX
JUNE, 2002

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Summary of Contents for LG W3000

  • Page 1 GSM Phone SERVICE MANUAL MODEL : W3000 P/N : XXXXX JUNE, 2002...

  • Page 2: Table Of Contents

    Table Of Contents 3.10 Display and Interfaces ......28 1. INTRODUCTION ........3.11 Keypad Switches and Scanning ..29 1.1 Purpose ..........4 3.12 Microphone ......... 30 1.2 Regulatory Information ......4 3.13 Earpiece ..........31 A. Security ..........4 3.14 Hands-free Interface ......
  • Page 3 7. BLOCK DIAGRAM ......106 12. AUTO CALIBRATION ....121 7.1 Main Board ........106 12.1 Overview ........121 7.2 FPCB ..........107 12.2 Requirements ....... 121 7.3 RF ............ 107 12.3 Menu and settings ......121 12.4 AGC ..........123 8.
  • Page 4 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.0 This manual provides the information necessary to install, program, operate and maintain the W3000. - 3 -...

  • Page 5: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of the phones. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

  • Page 6: Notice Of Radiated Emissions

    1. INTRODUCTION E. Notice of Radiated Emissions The phones comply with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 7: Abbreviations

    Global System for Mobile Communications IPUI International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode W3000 LG GSM Phone LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop...
  • Page 8 1. INTRODUCTION Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol - 7 -...

  • Page 9: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 850 mAh Standard Battery Size: 45.1 64.75 7.95mm Weight: 20g AVG TCVR Current GSM , EGSM: 260mA, DCS: 210mA (Tx Max Level) Stand by Current < 4 mA Talk time Up to 3hours 30minutes (GSM TX Level 7) Stand by time Up to 250hours (Paging Period: 9, RSSI: -85 dBm)

  • Page 10: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification TX: 890 + n 0.2 MHz RX: 935 + n 0.2 MHz (n = 1 ~ 124) EGSM Frequency Band TX: 890 + (n – 1024) 0.2 MHz RX: 935 + (n – 1024) 0.2 MHz (n = 975 ~ 1024) TX: 1710 + (n –...
  • Page 11 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800 1,800 ~ 3,000 3,000 ~ 6,000 Output RF Spectrum 6,000 (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~...
  • Page 12 2. PERFORMANCE Item Description Specification GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio BER (Class II) < 2.439% @-100 dBm RX Level Report Accuracy 3 dB 8 3 dB Frequency (Hz) Max.(dB) Min.(dB) Sending Response 1,000 2,000 3,000 3,400...
  • Page 13 2. PERFORMANCE Item Description Specification ≤ 30 ppm 32.768KHz tolerance Full power < 243 mA (GSM, EGSM) ; < 209 mA (DCS) Power Consumption Standby - Normal < 4 mA (Max. power) GSM/ Level 7 (Battery Capacity 850mA): Up to 180 Min Talk Time GSM/ Level 12 (Battery Capacity 850mA): Up to 300 Min Under conditions, Up to 250hours:...

  • Page 14: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The RF parts consists of a transmitter part, a receiver part, a synthesizer part, a voltage supply part, a VCTCXO part. And the main RF Chipset CX74017[U441]is a single-chip dual-band transceiver for the extended global system for mobile communication[E-GSM900MHz]/Digital communication system[DCS1800MHz] voice and data transfer applications.

  • Page 15: Rf Front End

    3. TECHNICAL BRIEF A. RF front end RF front end consists of Antenna Switch(FL405), dual band LNAs integrated in transceiver(U441). The Received RF signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch.

  • Page 16: Transmitter Part

    3. TECHNICAL BRIEF 3.3 Transmitter Part The Transmitter part contains CX74017 active parts, PAM and Antenna Switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop block(OPLL) including down- converter, phase detector, loop filter and dual band transmit VCO which can operate at either final RF output frequency.

  • Page 17: Opll

    3. TECHNICAL BRIEF B. OPLL The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating signal. The IF signal goes via external passive bandpass filter to one port of the phase detector. The other side of the phase detector input is LO signal.

  • Page 18: Power Amplifier

    3. TECHNICAL BRIEF The counter and mode settings of the synthesizer are also programmed via 3-wire interface. Figure 3-3. Synthesizer Block diagram D. Power Amplifier The RF3110[U416] is a Dual band amplifier for E-GSM(880 to 915MHz) and DCS1800(1710 to 1785MHz). The efficiency of module is the 50% at nominal output power for E-GSM and the 45% for DCS1800.

  • Page 19: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.4 13 MHz Clock The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the CX74017 RF Main Chip, BB Analog chip-set (AD6521), and Digital (AD6522). Figure 3-4.
  • Page 20 3. TECHNICAL BRIEF 3.6 Testing Set-up and Checking Signals A. Received RF Level and Checks This section shows the typical RF levels expected throughout the receiver path. A block diagram showing the locations of the RF measurement points and levels is shown in Fig. 3-11. Receiver Testing Set-up To check the receiver the following conditions have to be set: On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm at either:...
  • Page 21 3. TECHNICAL BRIEF Testing Transmitter Using a suitable high frequency probe measure the RF levels at the relevant points shown in Fig. 3- 9, 10. and compare your measurements with those shown in the diagram. If there are any major difference between the readings taken and those indicated then further investigation of that particular point will be required.
  • Page 22 3. TECHNICAL BRIEF RF components (Component Side) CN303 FL405 FL406 U416 U441 U414 X401 U413 Figure 3-6. RF components (Component Side). Reference Description Reference Description U441 RF Main Chipset FL406 Dual SAW Filter CN303 Mobile S/W X401 VCTCXO FL405 Ant. S/W U414 U416 U413...
  • Page 23 3. TECHNICAL BRIEF Test point of Rx Levels Figure 3-7. Test point of Rx Levels. - 22 -...
  • Page 24 3. TECHNICAL BRIEF Test point of TX Levels Figure 3-8. Test point of TX Levels(1). - 23 -...
  • Page 25 3. TECHNICAL BRIEF Control signal test points (1) U448 U444 TXRAMP(R401) TXPA(R404) 2.85V TXQN TXIN TXQN TXIN 13MHz 2V7_VCTCXO TXQP TXIP TXQP TXIP CLock Figure 3-9. Control signal test points (1). - 24 -...
  • Page 26 3. TECHNICAL BRIEF Control signal test points (2) TP404(RXEN) TP409(LE) TP408(Clock) TP407(Data) Figure 3-10. Control signal test points (2). - 25 -...
  • Page 27 3. TECHNICAL BRIEF Figure 3-11. Transmitter & Receiver RF Levels - 26 -...
  • Page 28 3. TECHNICAL BRIEF Figure 3-12. Regulator Output (RF2V8). Figure 3-13. VCTCXO Power Supply (2V7_VTCXO). - 27 -...
  • Page 29 3. TECHNICAL BRIEF Figure 3-14. 13MHz Clock. Figure 3-15. Control Signal of FEM in Rx mode (GSM,DCS both). - 28 -...
  • Page 30 3. TECHNICAL BRIEF Figure 3-16. Control Signal of FEM in GSM TX mode. Figure 3-17. Control Signal of FEM in DCS TX mode. - 29 -...
  • Page 31 3. TECHNICAL BRIEF Figure 3-18. LE, Clcok, Data. Figure 3-19. TXEN, TARAMP, TXPA. - 30 -...
  • Page 32 3. TECHNICAL BRIEF Figure 3-20. TX IQ Signal. TXIP TXQN Figure 3-21. RX IQ Signal. - 31 -...

  • Page 33: Digital Main Processor

    3. TECHNICAL BRIEF 3.7 Digital Main Processor The AD6522 is an ADI designed processor. Figure 3-22. Top level block diagram of the AD6522 internal architecture. BUS Arbitration Subsystem It is to work as a cross point for data accesses between the three main busses. EBUS is for external accesses, primarily from Flash memory for code and data.
  • Page 34 3. TECHNICAL BRIEF MCU subsystem It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access control module. The maximum clock frequency for the ARM7TDMI is 39MHz at 2.45V The main clock is 13MHz and it is provided by VCTCXO. The Clock & BS(Bus Select) generator make internal clock by multiplying the main clock by 1X, 1.5X, 2X and 3X The boot ROM contains MCU code for basic communication between the ARM and one of the serial ports in the Universal System Connector subsystem.
  • Page 35 3. TECHNICAL BRIEF Interconnection with external devices RTC block interface Countered by external X-TAL(32.768KHz) LCD module interface Description LCD_MAIN_CS LCD chip enable LCD_RES This pin resets LCD module This pin determines whether the data to LCD module is display data or control LCD_RS data _WR,_RD...
  • Page 36 3. TECHNICAL BRIEF Figure 3-23. System interconnection of AD6522 external interfaces - 35 -...

  • Page 37: Analog Main Processor

    3. TECHNICAL BRIEF 3.8 Analog Main Processor Baseband Transmit/ Receive section This section generates I/Q inputs/outputs modulated GMSK signals in accordance with GSM 05.05 Phase 2 specifications. The transmit path consist of a GMSK modulator and two high speed DACs with output reconstruction filters.
  • Page 38 3. TECHNICAL BRIEF AD6521 MCLK Dual-Mode Voiceband B aseband Code c JTAG Interface MCLKEN RESET for ICO ITXP I TRANSMIT INTERP FILTER ITXN BSDI QTXP Q TRANSMIT FILTER QTXN BSIFS GMSK MOD BSAEBAND 32 x 10 bit TXON SERIAL 10 bit RAMPDAC RAMP RAM FILTER...

  • Page 39: Power Management

    3. TECHNICAL BRIEF 3.9 Power management Figure 3-25 LDO block Description VSIM 2.86 V (is provided to SIM card) VCORE 2.45 V (is provided to the AD6522 & AD6521’s digital core) VRTC 2.45 V (is provided to the RTC and Backup Battery) 2.45 V (is provided to the AD6521 I/O and used as microphone bias) VTCXO 2.715 V (is provided to VCTCXO)
  • Page 40 3. TECHNICAL BRIEF Power up sequence logic The ADP3408 controls power on sequence If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. Reset is generated and send to the AD6522 Battery charging block(the phones use Li-Ion battery only.) Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware.

  • Page 41: Memories

    3. TECHNICAL BRIEF 3.10 Memories 32M flash memory + 8M SRAM 16 bit parallel data bus ADD01 ~ ADD21. RF Calibration data are stored in Flash Figure 3-26 3.11 Display and Interface The phones have one LCD. There are the control output LCD_MAIN_CS which is derived from AD6522, this acts as the chip select enable for the LCD.

  • Page 42: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.12 Keypad Switches and Scanning The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 19 switches, connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power s witch (KB310), which is connected independently.

  • Page 43: Microphone

    3. TECHNICAL BRIEF 3.13 Microphone The audio signal is passed to VINNORP and VINNORN pins of AD6522. The voltage supply 2V45_VAN is output from ADP3408, and is a bias voltage for both the VINNOR (through R101) and VINAUX (through R112) lines. The VINNOR or VINAUX signal is then A/D converted by the Voiceband ADC part of AD6521.
  • Page 44 3. TECHNICAL BRIEF 3.14 Earpiece & Handsfree The earpiece is driven directly from AD6521 VOUTNORP and VOUTNORN pins and the gain is controlled by the PGA (Programmable Gain Amplifier) in an AD6521. The audio out (VOUTAUXP & VOUTAUXN) to the hands-free kit consists of a pair of differential signals from AD6521 auxiliary outputs, which are tracked down the board to carkit connector(CN302) at the base of the handset.

  • Page 45: Headset Jack Interface

    3. TECHNICAL BRIEF Figure 3-30 3.15 Headset Jack Interface Headset Jack has the single-end structure in both audio in and out. The audio out to the headset jack is used only one line(VOUTAUXP) which can be connected to the HEADSET_SPK_P or HFK_SPK_P by the analog switch(U305).

  • Page 46: Key Back-Light Illumination

    3. TECHNICAL BRIEF 3.16 Key Back-light Illumination In key back-light illumination, there are 6 White LEDs in Board, which are driven by KEY_BACKLIGHT line from AD6522. Figure 3-31. Key Back-light Illumination. - 45 -...

  • Page 47: Speaker & Midi Ic

    3. TECHNICAL BRIEF 3.17 Speaker & MIDI IC The phones don’t use buzzer. Instead use loud speaker and Melody IC which support handsfree function and various melody sound. • Melody IC control 5 GPIO is assigned to control melody IC. Melody data is transferred to melody IC and played by loud phone.
  • Page 48 3. TECHNICAL BRIEF MA-3 is a synthesizer LSI for mobile phones that realize advanced game sounds. This LSI has a built-in speaker amplifier, and thus, is an ideal device for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are replayed by a synthesizer. The synthesizer section adopts “stereophonic hybrid synthesizer system”...

  • Page 49: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Components CN303 FL405 FL406 U416 U441 U414 X401 U413 RF Components Reference Description Reference Description U441 RF Main Chipset FL406 Dual SAW Filter CN303 Mobile S/W X401 VCTCXO FL405 Ant. S/W U414 U416 U413 Inverter IC...
  • Page 50 4. TROUBLE SHOOTING 4.2 Rx Trouble RX Check Area Now See next Page to see How to check each parts - 49 -...
  • Page 51 4. TROUBLE SHOOTING 4-2-1 Checking Regulator Circuit U414. 1 U414. 6 - 50 -...
  • Page 52 4. TROUBLE SHOOTING 4-2-2 Checking VCTCXO Circuit X401. 4 X401. 3 Graph 4-1. VCTCXO 13MHz Graph 4-2. VCTCXO 2.7V - 51 -...
  • Page 53 4. TROUBLE SHOOTING 4-2-3 Checking Control Signal - 52 -...
  • Page 54 4. TROUBLE SHOOTING 4-2-4 Checking Ant SW & Mobile SW CN303 PIN 2 CN303 PIN 1 L420 L421 C448 C444 FL405 ANT SW EGSM TX DCS TX EGSM, DCS RX Table 4-1. ANT SW Control Logic - 53 -...
  • Page 55 4. TROUBLE SHOOTING Graph 4-4. ANT SW Control GSM. DCS RX Mode RXEN DCSSEL High GSMSEL TXPA Graph 4-5. Control Signal for GSM RX Mode ANT SW GSMSEL DCSSEL TXPA EGSM TX DCS TX EGSM RX DCS RX Graph 4-6. Control Signal for DCS Rx Mode - 54 -...
  • Page 56 4. TROUBLE SHOOTING 4-2-5 Checking Saw Filter Circuit FL406.3 FL406.5 FL406.7 FL406.1 - 55 -...

  • Page 57: Checking Rx Iq

    4. TROUBLE SHOOTING 2-6 Checking RX IQ RXIN RXQN RXIP RXQP Graph 4-7. RX IQ Signal Graph 4-8. RX I Signal (Extended) - 56 -...

  • Page 58: Tx Trouble

    4. TROUBLE SHOOTING 4.3 Tx Trouble - 57 -...

  • Page 59: Checking Regulator Circuit

    4. TROUBLE SHOOTING 4-3-1 Checking Regulator Circuit • If you already Check this point while checking RX part, You can Skip this Test U414. 1 U414. 2 U414. 6 - 58 -...

  • Page 60: Checking Vctcxo Circuit

    4. TROUBLE SHOOTING 4-3-2 Checking VCTCXO Circuit • If you already Check this point while checking RX part, You can Skip this Test X401.4 X401.3 Graph 4-9. VCTCXO 13MHz Graph 4-10. VCTCXO 2.7V - 59 -...

  • Page 61: Checking Control Signal

    4. TROUBLE SHOOTING 4-3-3 Checking Control Signal Graph 4-11. RF Control Signal Graph 4-12. TXEN, TXRAMP, TXPA TP 409(LE) TP404 (RXEN) TXEN (TP402) TXRAMP (R401) TXPA TP408(Clock) TP407(Data) (R404) - 60 -...
  • Page 62 4. TROUBLE SHOOTING 4-3-4 Checking TX IQ Graph 4-13. TX IQ Signal - 61 -...
  • Page 63 4. TROUBLE SHOOTING 4-3-5 Checking RF TX Level R406 L419 R401 L409 R403 L408 R404 R405 L417 R414 U441 U416 - 62 -...
  • Page 64 4. TROUBLE SHOOTING 4-3-6 Checking Ant SW & Mobile SW CN303.2 FL405 CN303.1 FL405.5 C448 C444 FL405.3 Table 4-2. ANT SW Control Logic - 63 -...
  • Page 65 4. TROUBLE SHOOTING High High Graph 4-14. ANT SW Control Graph 4-15. ANT SW Control DCS TX Mode GSM TX Mode TXEN TXEN DCSSEL High DCSSEL GSMSEL High GSMSEL TXPA TXPA High High Graph 4-16. Control signal for Graph 4-17. Control signal for DCS TX Mode GSM TX Mode Table 4-3.
  • Page 66 4. TROUBLE SHOOTING 4-3-7 Receiver and Transmitter RF Level - 65 -...
  • Page 67 4. TROUBLE SHOOTING 4-3-8 Receiver RF Level Figure 4-1. Test Points of Rx Level - 66 -...
  • Page 68 4. TROUBLE SHOOTING 4-3-9 Transmitter RF Level Figure 4-2. Test Points of Tx Level - 67 -...
  • Page 69 4. TROUBLE SHOOTING 4-3-10 Test Points for RF Components U448 U444 TXRAMP (R401) TXPA (R404) RF 2.85V TXQN TXIN RXIN RXQN 13 MHz Clock 2V7_VCTCXO TXQP TXIP RXIP RXQP Figure 4-3. Test Points for RF components - 68 -...
  • Page 70 4. TROUBLE SHOOTING 4-3-11 Test Points for RF Components\ TP404(RXEN) TP407(PLL_Data) TP404(PLL_LE) TP408(Clock) Figure 4-4. Test Points for RF components (Keypad Side/Lower) - 69 -...

  • Page 71: Power On Trouble

    4. TROUBLE SHOOTING 4.4 Power On Trouble SETTING : Connect PIF, and set remote switch off at PIF. - 70 -...
  • Page 72 4. TROUBLE SHOOTING • Test) U101 (PMIC) Check!! POWER-ON KEY signal input These powers should be necessary to power on. This signal should go HIGH when the power-on procedure is completed. Pin 22 (2V45_VCORE) Pin 25 (2V7_VTCXO) Pin 21 (2V8_VMEM) PMIC(U101) Pin 6 (2V45_VRTC) Pin 2 (POWERKEY)

  • Page 73: Charging Trouble

    4. TROUBLE SHOOTING 4.5 Charging Trouble SETTING : Connect the battery and the charging adaptor(TA) to the phone. - 72 -...
  • Page 74 4. TROUBLE SHOOTING • Test) Q102 & D101 Check!! R106 Q102 charging current will flow into this direction. D101 - 73 -...

  • Page 75: Lcd Trouble

    4. TROUBLE SHOOTING 4.6 LCD Trouble - 74 -...
  • Page 76 4. TROUBLE SHOOTING • Test ) CN304 Check!! CN304 A) Check the connection between LCD & Main board B) Check the soldering of LCD & Main board C) Replace LCD module - 75 -...

  • Page 77: Receiver Trouble

    4. TROUBLE SHOOTING 4.7 Receiver Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode - 76 -...
  • Page 78 4. TROUBLE SHOOTING • The Receiver part Circuit Diagram FL301 V307 - 77 -...

  • Page 79: Speaker Trouble

    4. TROUBLE SHOOTING 4.8 Speaker Trouble SETTING : Connect PIF to the phone, and Power on. Enter The engineering mode, and set “Melody on” at Buzzer of BB test menu. - 78 -...
  • Page 80 4. TROUBLE SHOOTING • Test) Speaker Check!! J302 U203 U303(melody IC) - 79 -...
  • Page 81 4. TROUBLE SHOOTING The Melody IC & Speaker part Circuit Digram The Power for analog part of the melody IC Circuit diagram The Power for analog part of the melody IC The voltage is 3.3V Melody IC part Circuit diagram These 4 components make up the analog amplified stage of melody.

  • Page 82: Mic Trouble

    4. TROUBLE SHOOTING 4.9 Mic. Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode. - 81 -...
  • Page 83 4. TROUBLE SHOOTING R101 C114 MIC101 R105, R107, C120, C124 L101, L102 The signal flow of the microphone The voltage at this MIC activating to U103. point goes to almost signal : Mic is 0V when the mic is activated when this activated.
  • Page 84 4. TROUBLE SHOOTING C114 R104 R101 L101 C124 R107, R105 C120 L102 Q101 - 83 -...

  • Page 85: Vibrator Trouble

    4. TROUBLE SHOOTING 4.10 Vibrator Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode Connect PIF to the phone, and Power on. Enter The engineering mode, and set 'Vibrator on' at Vibration of BB test menu. - 84 -...
  • Page 86 4. TROUBLE SHOOTING R222 Q203 D302 CN201 When the vibrator works, the signal at this point goes to 2.8V When the vibrator works, the current flow this direction. When the vibrator works, the signal at this point goes to 0V - 85 -...

  • Page 87: Backlight Trouble

    4. TROUBLE SHOOTING 4.11 Backlight LED Trouble SETTING : Connect PIF to the phone, and power on. Enter engineering mode, and set “Backlight on” in “at” “BB test-Backlight” menu - 86 -...
  • Page 88 4. TROUBLE SHOOTING • Test) D302~D313/Diode & Q201 Check!! R213 Q201 R212 A) Check the diode LD309~LD313. B) Check the current through Q201. - 87 -...

  • Page 89: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.12 SIM Detect Trouble SETTING : Insert the SIM into J101. Connect PIF to the phone, and power on. - 88 -...
  • Page 90 4. TROUBLE SHOOTING • Test) SIM Connector Check!! - 89 -...

  • Page 91: Earphone Trouble

    4. TROUBLE SHOOTING 4.13 Earphone Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode. - 90 -...
  • Page 92 4. TROUBLE SHOOTING - 91 -...
  • Page 93 4. TROUBLE SHOOTING U306 U305 U308 - 92 -...
  • Page 94 4. TROUBLE SHOOTING C145 C170 J301 R334 R307 - 93 -...
  • Page 95 4. TROUBLE SHOOTING - 94 -...

  • Page 96: Hfk Trouble

    4. TROUBLE SHOOTING 4.14 HFK Trouble SETTING : After initializing GSM test equipment, Connect PIF to the phone, and power on. - 95 -...
  • Page 97 4. TROUBLE SHOOTING - 96 -...
  • Page 98 4. TROUBLE SHOOTING RA201 CN302 U308 U306 U305 CN302 RA201 - 97 -...

  • Page 99: Assembly Instruction

    5. DISASSEMBLY AND ASSEMBLY INSTRUCTION 5. DISASSEMBLY AND ASSEMBLY INSTRUCTION 5.1 Disassembly 1. Remove the battery, as shown below. Figure 5-1. Removing the Battery 2. Open the cap earphonejack first and push the hook. Then, hold and twist the Front cover. Figure 5-2.
  • Page 100 5. DISASSEMBLY AND ASSEMBLY INSTRUCTION 3. Carefully remove the screws, then lift up the both end side of the Cover guide as shown below. Figure 5-3. Disassembly of the Cover guide. 4. Detach the rest components as shown below. Figure 5-4. Disassembly of the rest components - 99 -...
  • Page 101 5. DISASSEMBLY AND ASSEMBLY INSTRUCTION 5. Detach the Speaker as shown below to unlock PCB. Figure 5-5. Removing PCB & Antenna 6. Use a tweezers to remove the Battery locker. Figure 5-6. Removing the Battery locker - 100 -...
  • Page 102 5. DISASSEMBLY AND ASSEMBLY INSTRUCTION 5.2 Assembly 7. Carefully insert the Speaker into PCB as shown below. Black line of Speaker must be above . Figure 5-7. Assembly of PCB & Antenna 8. Attach the Speaker and Receiver properly, then assemble the rest components. Figure 5-8.
  • Page 103 5. DISASSEMBLY AND ASSEMBLY INSTRUCTION 9. Assemble the Rear cover, PCB and Cover guide. Then, attach screws. Figure 5-9. Assembly of the Rear cover, PCB and Cover guide - 102 -...
  • Page 104 5. DISASSEMBLY AND ASSEMBLY INSTRUCTION 10. Insert the hooks at the bottom of the Front cover into the Rear cover .Then, assemble the Front cover and Rear cover as shown below. Firure 5-10. Assembly of the Front cover and Rear cover - 103 -...

  • Page 105: Download

    6. DOWNLOAD AND CALIBRATION 6. DOWNLOAD AND CALIBRATION 6.1 Download Fig. 6-1 and 6-2 illustrate a download set-up. Figure 6-1. Download Setup 1. Download procedure Access flash loader program in PC. Select source code you want to download. Don’t check OWCD AND VERIFY in flash loader window. Push start button in flash loader window.
  • Page 106 6. DOWNLOAD AND CALIBRATION 2. Connect TA to the Datakit and phone have a battery a. VBAT < 3.2V Don’t download to the phone. b. VBAT 3.2 V Connect Datakit to the phone. 3. Download method when battery under 3.2 voltage First : Remove battery in the phone Second : Connect TA to the Datakit Third : Connect phone to the Datakit.
  • Page 107 6. DOWNLOAD AND CALIBRATION 6.2 Calibration A. Equipment List Equipment for Calibration Type / Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIB interface card HP-GPIB Agilent Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium II class above 300MHz...
  • Page 108 6. DOWNLOAD AND CALIBRATION Figure 6-4. The top view of Test Jig. C. Test Jig Operation Power Supply usually 4.0V DC Adaptor 9.5V, 500mA Table 6-2. Jig Power. Switch Number Name Description Switch 1 RPWRON In ON state, phone is awaked. Switch 2 HF_DETECT Turn on for AUDIO TEST...
  • Page 109 6. DOWNLOAD AND CALIBRATION Switch Number Name Description Switch 1 RPWRON In ON state, phone is awaked. Switch 2 HF_DETECT Turn on for AUDIO TEST Switch 3 Power Supply Power is provided for phone from Power Supply Switch 4 D.C power Power is provided for phone from DC adaptor.

  • Page 110: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM Figure 7-1. block diagram - 109 -...
  • Page 111 NOTE - 110 -...

  • Page 112: Circuit Diagram

    100K Sheets F_CE _ROMCS MODEL 0.1u W3000 07/24 F_VCC1 2V8_VMEM Designer CH HWANG S_VCC1 2002 F_VCCQ Checked DRAWING MAIN NAME Approved NC10 NC11 DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 111 -...
  • Page 113 CN201 Sheets MODEL W3000 07/24 Designer CH HWANG 2002 R212 KEY_BACKLIGHT 1.5K Checked DRAWING MEMORY & MMI R223 Q203 NAME VIBRATOR Approved 2SC5585 DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 112 -...

  • Page 114: Midi

    Sheet/ Sheets MODEL HFK_SPK_N W3000 07/24 C331 MAX4624 ACTIVE Designer CH HWANG 0.1u 2002 MAX4624EUT-T HEADSET_EN NC(4) NC(6) Checked DRAWING MIDI NAME Approved DRAWING Iss. Notice No. Date Name V1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 113 -...
  • Page 115 CH HWANG 2002 U414 Checked VSYNTHEN DRAWING TEMPSENSE _ERR RF Circuit C458 R430 NAME C459 2.2u Approved 10uF ADP3330 2012 2012 C460 470p DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 114 -...

  • Page 116: Pcb Layout

    9. PCB LAYOUT 9. PCB LAYOUT - 115 -...
  • Page 117 9. PCB LAYOUT - 116 -...

  • Page 118: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
  • Page 119 10. ENGINEERING MODE E. ADC (Analog to Digital Converter) [1-5] This displays the value of each ADC. • MVBAT ADC (Main Voltage Battery ADC) [1-5-1] • AUX ADC (Auxiliary ADC) [1-5-2] • TEMPER ADC(Temperature ADC) [1-5-3] F. BATTERY [1-6] • Bat Cal [1-6-1] : This displays the value of Battery Calibration.

  • Page 120: Rf Test [Menu 2]

    10. ENGINEERING MODE 10.2 RF Test [MENU 2] Radio Frequency Test A. SAR Test [2-1] This menu is to test the Specific Absorption Rate. • SAR Test On [2-1-1] : Phone continuously process TX only. Call-setup equipment is not required. •...

  • Page 121: Trace Option [Menu 4]

    10. ENGINEERING MODE 10.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 10.5 Call Timer [MENU 5] A. All calls [5-1] This displays total conversation time. User cannot reset this value. B.

  • Page 122: Stand Alone Test

    11. STAND ALONE TEST 11. STAND ALONE TEST 11.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test- this is to see if the transmitter of the phones is activating normally B.

  • Page 123: Means Of Test

    11. STAND ALONE TEST 11.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. After setting them all above, press Start button of Signal. - 122 -...

  • Page 124: Auto Calibration

    12. AUTO CALIBRATION 12. AUTO CALIBRATION 12.1 Overview AutoCal (Auto Calibration) is the PC side calibration tool that perform Rx and Tx calibration with Agilent 8960 or other equipment. AutoCal generate calibration data by communicating with phone and measuring equipment and write it into calibration data block of flash memory in GSM phone. 12.2 Requirements •...
  • Page 125 12. AUTO CALIBRATION • Connection © Connect to phone : Connect to the phone which you want to measure. This procedure checks whether the PC is connected to “Ag8960” or not. If not connected to “Ag8960” try to connect to “Ag8960”. After that it performs sync. procedure with phone.

  • Page 126: Agc

    12. AUTO CALIBRATION 12.4 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.

  • Page 127: Exploded View & Replacement Part List

    13. EXPLODED VIEW & REPLACEMENT PART LIST 13. EXPLODED VIEW & REPLACEMENT PART LIST 13.1 Exploded View - 126 -...
  • Page 128 COVER,GUIDE MCJL0000701 ACGL00 COVER ASSY,GUIDE ACGL0000101 SURY00 RECEIVER SURY0005601 ASSY ,113 dB,32 ohm,13*4.7 ,Receiver SUMY00 MICROPHONE SUMY0004601 ASSY ,-40 dB,6*1.5 ,W3000 MIC ABGA00 BUTTON ASSY,DIAL ABGA0000601 ADCA00 DOME ASSY,METAL ADCA0007801 SVLM00 LCD MODULE SVLM0003801 128*64 ,34.8*30.55*4.4(t) ,D/IC: S6B0723TB-01(SSE),LED B/L(BLUE) SAFY00...

  • Page 129: Accessories

    Specification Color MHBY00 HANDSTRAP MHBY0001101 Neck Strap 400mm (CDMA,common use) SGDY00 DATA CABLE SGDY0003003 LG-510W/G510 ,CABLE W/O POWER BULK SGEY00 EAR PHONE/EAR MIKE SET SGEY0002901 G7000,G5200 Common use, 3P EAR MIC SSAD00 ADAPTOR,AC-DC SSAD0007803 100-240V ,50 Hz,5.2 V,850 mA,GOST ,...

  • Page 130: Replacement Part List

    Neck Strap 400mm (CDMA,common use) SBPL00 BATTERY PACK,LI-ION SBPL0065801 Please refer to ‘Exploded View’ SGDY00 DATA CABLE SGDY0003003 LG-510W/G510 ,CABLE W/O POWER BULK SGEY00 EAR PHONE/EAR MIKE SET SGEY0002901 G7000,G5200 Common use, 3P EAR MIC SSAD00 ADAPTOR,AC-DC SSAD0007803 100-240V ,50 Hz,5.2 V,850 mA,GOST ,...
  • Page 131 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part No. Specification Color Remark C105 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C106 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C107 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C108 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C109 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C110 CAP,CERAMIC,CHIP ECCH0000163...
  • Page 132 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part No. Specification Color Remark C166 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C167 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP C170 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C201 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 133 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part No. Specification Color Remark C329 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C330 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C331 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C333 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 134 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part No. Specification Color Remark C455 CAP,CERAMIC,CHIP ECCH0000379 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP C456 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C457 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C458 CAP,CERAMIC,CHIP ECCH0000379 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP C459 CAP,CERAMIC,CHIP ECCH0003401...
  • Page 135 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part No. Specification Color Remark R104 RES,CHIP ERHY0000248 2.4K ohm,1/16W,J,1005,R/TP R105 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R106 RES,CHIP ERHY0001103 0.33 ohm,1/4W ,F ,2012 ,R/TP R107 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R108 RES,CHIP ERHY0000118 3K ohm,1/16W,F,1005,R/TP...
  • Page 136 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part No. Specification Color Remark R239 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R240 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R241 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R242 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R243 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R244 RES,CHIP ERHY0000241...
  • Page 137 RA201 RES,ARRAY,R ERNR0000401 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP SPFY00 PCB,MAIN SPFY0037103 FR-4 ,0.95 mm,MULTI-8 ,Ver 1.1 W3000,WAP U101 EUSY0100401 TSSOP ,28 PIN,R/TP , GSM POWER MANAGEMENT SYSTEM U103 EUSY0100701 64 BALL LFBGA / MINI-BGA ,64 PIN,R/TP ,...

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