Printed Wiring Boards -Mic/Headphone Section - Sony HCD-GZR9D Service Manual

7-20. PRINTED WIRING BOARDS – MIC/HEADPHONE Section –
1 2
A
MIC BOARD
B
C
D
E
F
RV853
G
H
RV853
ECHO LEVEL
I
HCD-GZR7D/GZR8D/GZR9D
• See page 42 for Circuit Boards Location.
3 4 5
(Page 58)
MAIN BOARD
CN101
G
9 1
CN852
JW818
C888
JW816
R888
R887
JW815
R889
C889
C882
R886
R881
C881
R880
R882
JW826
R884
C885
R883
C886
R885
C879
JW813
JR816 C887
JR801
JR809
RV852
RV851
RV852
RV851
MIC 2 LEVEL
MIC 1 LEVEL
• : Uses unleaded solder.
6 7 8
R892
R891
JW812
C869
R872
D851
R873
C868
JW810
C857
JW809
JR814
JR806
JR805
JR807
C856
R861
JR802
JW807 JW806
JW801 JW802
C880
JR804
ET851
J852
MIC 2
63 63
9 10 11
HEADPHONE BOARD
LP852
R890
JR811
R871
ET852
R870
C863
R869
R868
R860
R823
JR815
13
(13)
1-876-037-
J851
MIC 1
HCD-GZR7D/GZR8D/GZR9D
Ver. 1.1
12 13 14
LP801
R824
W802
C822
13
1-876-036- (13)
J803
PHONES