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LG G1610 Service Manual

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Service Manual
G1610
Date : February 2005 / Issue 1.0
P/N : MMBD0045701

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Summary of Contents for LG G1610

  • Page 1 Service Manual G1610 Date : February 2005 / Issue 1.0 P/N : MMBD0045701...

  • Page 2: Table Of Contents

    Table Of Contents 5. DISASSEMBLY INSTRUCTION ..69 1.INTRODUCTION ........2 1.1 Purpose ............2 6. DOWNLOAD AND CALIBRATION .. 75 1.2 Regulatory Information ........2 6.1 Download ..........75 1.3 Abbreviations ..........4 6.2 Calibration ..........82 2. PERFORMANCE ........ 6 7. BLOCK DIAGRAM ......85 2.1 H/W Feature ..........6 2.2 Technical Specification .......7 8.

  • Page 3: Introduction

    1. INTRODUCTION 1.INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of G1610. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your...
  • Page 4 1. INTRODUCTION F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. H.

  • Page 5: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Rate CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrostatic Discharge FPCB Flexible Printed Circuit Board...
  • Page 6 1. INTRODUCTION Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM STMR Side Tone Masking Rating Travel Adapter Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol - 5 -...

  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 950 mAh Standard Battery Size: 35.00 x 53.45 x 5.7mm Weight: 30.00g Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.

  • Page 8: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 –30 –33 –60 600~ <1,200 –60 1,200~ <1,800 –60 1,800~ <3,000 –63 3,000~ <6,000 –65 Output RF Spectrum 6,000 –71 (due to modulation) Offset from Carrier (kHz).
  • Page 9 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 –30 –33 –60 600~ <1,200 –60 1,200~ <1,800 –60 1,800~ <3,000 –63 3,000~ <6,000 –65 Output RF Spectrum 6,000 –71 (due to modulation) Offset from Carrier (kHz). Max.
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM BER (Class II) < 2.439% @–102 dBm Bit Error Rate BER (Class II) < 2.439% @–100 dBm RX Level Report Accuracy 3 dB 3 dB Frequency (Hz) Max.(dB) Min.(dB) –12 – – –12 Sending Response 1,000 –6...
  • Page 11 2. PERFORMANCE Item Description Specification At least 80 dB under below conditions: Ringer Volume 1. Ringer set as ringer. 2. Test distance set as 50 cm. CC Charge : < 500 mA Charge Current Trickle Charge : < 60 mA Antenna Bar Number Power –85 dBm ~...

  • Page 12: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4205-BM, U401) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular handsets and wireless data modems.
  • Page 13 3. TECHNICAL BRIEF (1) Receiver Part The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional superheterodyne architectures. A.
  • Page 14 3. TECHNICAL BRIEF Figure 3-2 Block Diagram of Receiver part of SI4205 B. Intermediate frequency (IF) and Demodulation A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes.
  • Page 15 3. TECHNICAL BRIEF (2) Transmitter part The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
  • Page 16 3. TECHNICAL BRIEF (3) Frequency Synthesizer Figure 3-4 Block Diagram of Frequency Synthesizer part of SI4205 The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs.

  • Page 17: Power Amplifier Module (Rf3133, U400)

    3. TECHNICAL BRIEF 3.2 Power Amplifier Module (RF3133, U400) The RF3133 is a high-power, high-efficiency power amplifier module with integrated power control. The device is self-contained with 50ߟ input and output terminals. The power control function is also incorporated, eliminating the need for directional couplers, detector diodes, power control ASICs and other power control cir- cuitry;...

  • Page 18: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.3 13 MHz Clock The 13 MHz clock(X400) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band chipset (U101, AD6521), digital base band chipset (U100, AD6525), and MIDI (U200) chipset.

  • Page 19: Digital Main Processor (Ad6525, U100)

    3. TECHNICAL BRIEF 3.5 Digital Main Processor (AD6525, U100) (1) Architecture Overview AD6525 Serial Link Subsystem (VBC) DSP BUS EBUS PBUS RBUS SBUS Subsystem Subsystem ® (ARM7TDMI RF-Control Figure 3-8 Block Diagram of the AD6525 Internal Architecture The internal architecture of AD6525 is shown in Figure 3-8. AD6525 regroups three main subsystems connected together through a dynamic and flexible communication bys network.
  • Page 20 3. TECHNICAL BRIEF AD6525 GSM-PROCESSOR JTAGEN KEYPADCOL[4:0] KEYPAD TCK, TMS KEYPADROW[4:0] JTAG Matrix TDI, TDO Backlight BACKLIGHT0 JTAGE, HSL, GPIO Universal Service light USCTX/RX/CLK BACKLIGHT1 System Generic Serial port A Connector Generic Serial port B (USC) Generic Serial port D ROMCS FLASH ADD[23:0]...
  • Page 21 3. TECHNICAL BRIEF (2) Interconnection with external devices A. RTC Block Interface Countered by external crystal oscillator (MC-146, X100). The X-tal oscillates 32.768 KHz. B. LCD Module Interface Controlled by LCD_CS, LCD_RES, ADD1, WR, DATA[0:15], LCD_DIM, and LCD_ID. Table 3-3 LCD module interface Description LCD_CS LCD driver chip enable.
  • Page 22 3. TECHNICAL BRIEF D. SIM Interface The AD6525 check status periodically in call mode if SIM card is inserted or not, but the AD6525 don't check in deep sleep mode. Interface signals are SIM_DATAOP, SIM_CLK, SIM_RST, SIM_EN Table 3-5 SIM interface Description This pin receives and sends data to SIM card.

  • Page 23: Analog Main Processor (Ad6521, U101)

    3. TECHNICAL BRIEF 3.6 Analog Main Processor (AD6521, U101) (1) Block Diagram TDO TMS TCK AVDD DVDD AGND DGND MCLK JTAG INTERFACE MCLKEN RESET ITXP I TRANSMIT ALTER ITXN B SDI GMSK QTXP Q TRANSMIT B SIFS ALTER QTXN TXON 32x10-BIT 10-BIT RAMP RAM...
  • Page 24 3. TECHNICAL BRIEF (2) BB Transmit Section This section generates in-phase and quadrature BB modulated GMSK signals (BT = 0.3) in accordance with GSM 05.05 Phase 2 specifications. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter.
  • Page 25 3. TECHNICAL BRIEF 2V55_VAN 1V8_VCORE 2V8_VMEM 1V8_VCORE R104 100K C106 C107 C123 ITXP TXIP ITXN TXIN QTXN TXQN QTXP TXQP IRXP TXIP RXON IRXN RXIN TXON QRXP RXQP QRXN RXQN 2V8_VMEM MCLK MCLKEN RESET AFCDAC ARSM TX...RAMP ATSM REF CAP ASDO ASDI RAMPDAC...

  • Page 26: Power Management Ic (Adp3522, U301)

    3. TECHNICAL BRIEF 3.7 Power Management IC (ADP3522, U301) Block Diagram VBAT VRTCIN VBAT2 SIMVSEL ADP3522 SIM LDO VSEL VBAT VSIM VREF DEEP DISCHARGED 110K UVLO DGND UVLO PWRONKEY DIGITAL COR E LDO ROWX OVER TEMP SHUTD OWN VBAT VCORE VREF PWRONIN DGND...

  • Page 27: Power On Sequence

    3. TECHNICAL BRIEF Power on sequence If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. REFOUT is also enabled, Reset signal is generated and send to the AD6525. LDO block There are 6 LDOs in the ADP3522.

  • Page 28: Memory (U300)

    3. TECHNICAL BRIEF 3.8 Memory (U300) The memory is consists of 128Mbit Nor Flash Memory and 32Mbit Pseudo SRAM. It has 16 bit parallel data bus and 22 bit address. Software, RF calibration data, audio parameters and battery calibration data are stored in the Flash memory.

  • Page 29: Lcd And Lcd Backlight

    3. TECHNICAL BRIEF 3.9 LCD and LCD Backlight (1) LCD Features Display Mode : Transmissive 65K Color STN LCD Color Depth : 32(Red) * 64(Green) * 32(Blue) = 65K Color Resolution : 128 * RGB * 128 dots for Color display Interface : 80-series MPU interface Data bus : 16 bit Parallel interface Duty ratio : 1/96 Duty for Color display...

  • Page 30: Keypad Switches And Key Backlight Illumination

    3. TECHNICAL BRIEF 3.10 Keypad Switches and Key Backlight Illumination (1) Keypad Switches The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 21 switches (KB500-KB522), connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power switch (KB500), which is connected independently.

  • Page 31: Microphone

    3. TECHNICAL BRIEF (2) Key Backlight Illumination There are 6 blue LEDs for key backlight illumination which are driven by KEY_BACKLIGHT signal from AD6525. VBAT KEY BACKLIGHT C319 C320 C321 C322 C323 C324 VCHARGE VBAT U302 MAX4599EXT-T R312 KEY_BACKLIGHT C318 0.1u R316 RPWRON...

  • Page 32: Dual Mode Speaker And Midi Ic

    3. TECHNICAL BRIEF 3.12 Dual Mode Speaker and MIDI IC (1) Dual Mode Speaker There is a control signal (SPK_RCV_EN) which is for enabling receiver or speaker because one dual mode speaker is used for both receiver and speaker. The signal is produced by AD6525 and controls the analog switch (U201).
  • Page 33 3. TECHNICAL BRIEF (2) MIDI IC (YMU759B, U200) The phone uses melody IC which makes the robust joyful melody sounds. 6 signals (MIDI_RST, ADD0, RD, MIDI_CS, WR, MIDI_INT) from AD6525 are used to control the melody IC. Melody data (DATA[8:15]) is transferred to melody IC and played by the dual mode speaker. External 3.3V LDO (U202) is used for the MIDI chip because the maximum output current of analog amplifier in melody IC is 300mA.

  • Page 34: Headset Jack Interface

    3. TECHNICAL BRIEF 3.13 Headset Jack Interface 3-pole type ear-mic jack which has three electrodes such as Receiver+, Mic+, and GND. This type usually supports only single-ended configuration (VOUTAUXP for headset speaker and VINAUXP for headset mic) in the audio path. There are two control signals for jack interface.

  • Page 35: Bluetooth Section Description

    3. TECHNICAL BRIEF 3.14 Bluetooth Section Description VDD_CORE VDD_REG_IN VDD_IO 1.8V 2.2V~4.2V 1.8~3.6V ABM-450-2CSP UART Regulator Digital Logic ANTENNA INTERFACE TX_RX(A) BC03-CSP TX_RX(B) Balun 4Mbit EEPROM 16MHz Memory X-Tal Figure 3-21 Bluetooth Module Block Diagram 1. General description ARM-450-2CSP(M1) is a Bluetooth module. The Bluetooth system consists of a radio section and a baseband link control section.

  • Page 36: General Description

    3. TECHNICAL BRIEF 2V8_VBT 1 T N 3 4 6 2V8_VBT D E E G N I L601 1.5nH u 1 . 2 0 6 O I _ N I _ 5 O I C _ T 5 5 6 4 O I X T _ M _ I...

  • Page 37: Rf Components

    4. TROBULE SHOOTING 4.1 RF Components SW400 FL400 FL401 FL402 U402 U401 U400 X400 Figure 4-1 Table 4-1 Reference Description Reference Description Mobile Switch Power Amplifier Module SW400 U400 FL400 Antenna Switch U401 Transceiver FL401 Saw Filter for GSM U402 Saw Filter for DCS VCTCXO FL402...

  • Page 38: Trouble Shooting

    4. TROUBLE SHOOTING 4.2 RX Trouble START HP8922 : Test mode 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting O O s s c c i i l l l l o o s s c c o o p p e e setting 1.
  • Page 39 4. TROBULE SHOOTING 4.2.1 Checking Regulator Circuit U402.5 U402.3 Figure 4-3 Check Pin 3. Changing the Board Check Pin 5. Pin3. High ? RF 2.85V O.K? Regulator Circuit is OK Replace U402 See next Page to check VCTCXO VBAT MIC5255-2.85BM5 U402 R418 CLKON R419...
  • Page 40 4. TROUBLE SHOOTING 4.2.2 Checking VCTCXO Circuit Figure 4-4 X400.3 X400.4 VCTCXO Circuit is OK Check Pin 3. See next Page to check 13 MHz O.K? ? Refer to Graph 4-2 ANT SW & Mobile SW Changing X400 Check Pin 4. 2.75V OK? ? Refer to Graph 4-3 Check U301, PMIC...
  • Page 41 4. TROBULE SHOOTING 4.2.3 Checking PLL Control Signal S_DATA (TP404) S_CLK (TP403) S_EN (TP402) PDNB (TP401) Figure 4-5 Download the SW Check TP 401. Level is High? Check TP 402, 403, 404. Check if there is Download the SW Similar? Any Major Difference ? Refer to Graph 4-5 Control Signal is OK...
  • Page 42 4. TROUBLE SHOOTING 4.2.4 Checking Antenna Switch & Moblie Switch SW400.ANT SW400 KMS-507 SW400.RF C410 SHS-C090DR FL400 FL400.10 FL400.1 GND1 GND2 EGSM_TX GND3 DCS_TX L405 (VC1) GND4 GND5 L404 GND6 EGSM_RX GND7 DCS_RX (VC2) ANT_SW2 Figure 4-6 C430 C431 For these 2 test case, No Call connection is needed ANT_SW1 C433...

  • Page 43: Checking Saw Filter

    4. TROBULE SHOOTING 4.2.5 Checking SAW Filter C420 C422 G1 O1 L402 FL401 EFCH942MTCA7 G2 O2 27nH C423 C425 L403 G1 O1 FL401 EFCH1842MTCA7 7.5nH G2 O2 C426 GPO 11 FL401 FL402 Figure 4-7 Check RF Level of Changing Saw Filter Input FL401.1 : ~ -61dBm C422 for GSM For GSM : FL401.1...

  • Page 44: Checking Rx Iq

    4. TROUBLE SHOOTING 4.2.6 Checking RX IQ C417,C419 RXQP C417 RXQN RXIP C419 RXIN Figure 4-8 Check C417, C419. Check if there is Replace U401 Similar? Any Major Difference ? Refer to Graph 4-6 Redownload the Software And calibrate Graph 4-6 - 43 -...

  • Page 45: Tx Trouble

    4. TROBULE SHOOTING 4.3 TX Trouble START HP8922 : Test mode 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting 1. Check Regulator Circuit 2. Check VCTCXO Circuit 3. Check Control Signals 4. Check TX IQ Figure 4-9 5.
  • Page 46 4. TROUBLE SHOOTING 4.3.1 Checking Regulator Circuit U402.5 U402.3 Figure 4-10 Check Pin 3. Check Pin 5. Changing the Board RF 2.85V O.K? Pin3. High ? Regulator Circuit is OK Replace U402 See next Page to check VCTCXO VBAT MIC5255-2.85BM5 U402 R418 CLKON R419...
  • Page 47 4. TROBULE SHOOTING 4.3.2 Checking VCTCXO Circuit Figure 4-11 X400.3 X400.4 VCTCXO Circuit is OK Check Pin 3. 13 MHz O.K? See next Page to check ? Refer to Graph 4-8 ANT SW & Mobile SW Changing X400 Check Pin 4. 2.75V OK? ? Refer to Graph 4-9 Check U301, PMIC...
  • Page 48 4. TROUBLE SHOOTING 4.3.3 Checking PLL Control Signal S_DATA (TP404) S_CLK (TP403) S_EN (TP402) PDNB (TP401) Figure 4-12 Download the SW Check TP 401. Level is High? Check TP 402, 403, 404. Check if there is Download the SW Similar? Any Major Difference ? Refer to Graph 4-11 Control Signal is OK...

  • Page 49: Checking Tx Iq

    4. TROBULE SHOOTING 4.3.4 Checking TX IQ C421,C424 C421 TXIN TXQP C424 TXQ N Figure 4-13 Check C421, C424. Check if there is Replace U401 Similar? Any Major Difference ? Refer to Graph 4-12 Redownload the Software And calibrate Graph 4-12 - 48 -...

  • Page 50: Checking Pam Control Signal

    4. TROUBLE SHOOTING 4.3.5 Checking PAM Control Signal T T X X _ _ R R A A M M P P ( ( R R 4 4 0 0 1 1 ) ) P P A A _ _ E E N N ( ( R R 4 4 0 0 2 2 ) ) Figure 4-14 Check TX_RAMP and PA_EN Check if there is...
  • Page 51 4. TROBULE SHOOTING 4.3.6 Checking Antenna Switch & Mobile Switch SW400.ANT SW400 KMS-507 SW400.RF FL400.5 FL400.3 C410 SHS-C090DR FL400 L405 (VC1) GND1 GND2 EGSM_TX L404 GND3 DCS_TX GND4 (VC2) GND5 GND6 EGSM_RX GND7 DCS_RX Figure 4-15 ANT_SW2 C430 C431 For the test, TX Stand alone Mode is needed.
  • Page 52 4. TROUBLE SHOOTING (VC1) (VC1) (VC2) (VC2) Graph 4-14 DCS TX (VC1) (VC1) (VC2) (VC2) Graph 4-15 EGSM TX - 51 -...

  • Page 53: Power On Trouble

    4. TROBULE SHOOTING 4.4 Power On Trouble SETTING : Connect PIF, and se t remote switch off at PIF * Refer to Figure 16 START Check Battery Voltage Charge or Change Battery > 3.35V ? Push power-on key Check the contact of power-key and check the level change or dome switch.
  • Page 54 4. TROUBLE SHOOTING U301.21 U301.20 1V8_VCORE 2V8_VMEM U301.25 2V75_VTCXO U301.29 RPWRON U301.30 POWERKEY Figure 4-16 U301.3 2V0_VRTC VBAT PMIC VSIM VCHARGE 1V8_VCORE 2V55_VAN 2V75_VTCXO 2V8_VMEM 2VO_VRTC VBAT 2V8_VMEM - 53 -...

  • Page 55: Charging Trouble

    4. TROUBLE SHOOTING 4.5 Charging Trouble 4.5 Charging Trouble SETTING : Connect the battery (3.4 ~ 4V) and the charging adaptor(TA) to the phone START Charging Connector(CN601) Re-solder CN601. well-soldered? The charging adaptor(TA) is out of order. Voltage at Pin 7 of U301 Change the charging adaptor.
  • Page 56 4. TROUBLE SHOOTING R300 Q300 D300 Figure 4-17 VCHARGE Charging current direction C302 (2012) VBAT CUS02 D300 TPCF8102 Q300 - 55 -...

  • Page 57: Lcd Trouble

    4. TROUBLE SHOOTING 4.6 LCD Trouble. 4.6 LCD Trouble C C N N 6 6 0 0 0 0 Figure 4-18 U600.9 U600 (LCD_DIM) Figure 4-19 START PIF Power On Reassemble LCD module with Is the connection of LCD LCD connector module with LCD connector on PCB OK? Not OK...

  • Page 58: Receiver Trouble

    4. TROUBLE SHOOTING 4.7 Receiver Trouble 4.7 Receiver Trouble R206 U201 U201 MAX4684EUB R206 C207 CN200 R207 C210 R207 R209 Figure 4-20 START Check the signal level of Check the soldering Replace the Main board. RCVP & RCVN at R206, R207. Are R206 &...

  • Page 59: Speaker Trouble

    4. TROUBLE SHOOTING 4.8 Speaker Trouble 4.8 Speaker Trouble SETTING: Connect PIF to the phone, and Power on. Enter The engineering mode, and set “Melody on” at Buzzer of BB test Menu START Replace U202 Voltage across C235 Check the soldering of ( Melody IC = 3.3 V? U202...
  • Page 60 4. TROUBLE SHOOTING R236 U201 R234 R209 U200 R202 C235 Figure 4-21 3VS_VMEH 3V3_VMIDI Figure 4-21 Figure 4-21 - 59 -...

  • Page 61: Mic Trouble

    4. TROUBLE SHOOTING 4.9 MIC Trouble 4.9 MIC Trouble R R 2 2 11 C C 2 2 1 1 7 7 R2 2 1 1 4 4 C C 2 2 5 5 0 0 M M I I C C 2 2 0 0 0 0 C C 2 2 2 2 2 2 C 2 2 2 2 1 1 Figure 4-22...

  • Page 62: Vibrator Trouble

    4. TROUBLE SHOOTING 4.10 Vibrator Trouble 4.10 Vibrator Trouble SETTING: After initialize Agilent 8960, Test in EGSM, connect PIF to the phone, and Power on. Enter The engineering mode, and set “Vibrator on”at Vibration of BB test menu START Is the voltage at pin 3 of Check the soldering of Re-solder R501 Q500 near 0V?
  • Page 63 4. TROUBLE SHOOTING R R 5 5 0 0 0 0 C C N N 5 5 0 0 0 0 Q Q 5 5 0 0 0 0 R R 5 5 0 0 1 1 Figure 4-24 VBAT CN500 C504 0500...

  • Page 64: Key Backlight Led Trouble

    4. TROUBLE SHOOTING 4.11 Key Backlight LED Trouble 4.11 Key Backlight LED Trouble SETTING: Connect PIF to the phone, and power on. Enter engineering mode, and set “Backlight on” at “BB test-Backlight” menu START PIF Power On Check the soldering of Is the voltage level at Pin1 at R313,R315 O301 about 1.2V?

  • Page 65: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.12 SIM Detect Trouble 4.12 SIM Detect Trouble Setting : Insert the SIM into J301. Connect PIF to the phone, and power ON START Does the SIM supports Change the SIM. Our phone supports 3V SIM only. Voltage at pin 1 of Voltage at pin 18 of Replace U301.

  • Page 66: Ear Jack Trouble

    4. TROUBLE SHOOTING 4.13 Ear Jack Trouble 4.13 Ear Jack Trouble SETTING : After Initialize Agilent 8960, Test in EGSM, DCS Mode START Inset the earphone to the phone Check the Check the Does the audio profile of the Replace voltage at pin1 of soldering U204 soldering J200...
  • Page 67 4. TROUBLE SHOOTING U U 2 2 0 0 4 4 . . 1 1 J J 2 2 0 0 0 0 U U 2 2 0 0 4 4 Figure 4-28 U U 2 2 0 0 3 3 C C 2 2 2 2 4 4 C C 2 2 2 2 8 8 C C 2 2 2 2 7 7...

  • Page 68: Bluetooth Trouble

    4. TROUBLE SHOOTING 4.13 Bluetooth Trouble 4.14 Bluetooth Trouble U U 1 1 0 0 0 0 R R 6 6 6 6 6 6 U U 6 6 0 0 3 3 U U 6 6 0 0 2 2 M M 1 1 R R 6 6 4 4 3 3 R R 6 6 6 6 4 4...
  • Page 69 4. TROUBLE SHOOTING Bluetooth Power on BLUE_ Is BLUE_RST signal shape similar Replace U100 to Fig.1 during powering on Bluetooth? BT_EN at Replace U100 2V8_VBT at C663=2.8V? 2V8_VBT at C663=2.8V? R660=2.8V? Check 2V8_VBT Replace (U603) PCB pattern Figure 4-32 Blue_RST Figure 4-32 Blue_RST Bluetooth Power off...

  • Page 70: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION Figure 5-1 Figure 5-2 - 69-...
  • Page 71 5. DISASSEMBLY INSTRUCTION Figure 5-3 Figure 5-4 - 70 -...
  • Page 72 5. DISASSEMBLY INSTRUCTION Figure 5-5 - 71 -...
  • Page 73 5. DISASSEMBLY INSTRUCTION Figure 5-6 Figure 5-7 - 72 -...
  • Page 74 5. DISASSEMBLY INSTRUCTION Figure 5-8 Figure 5-9 - 73 -...
  • Page 75 5. DISASSEMBLY INSTRUCTION Figure 5-10 - 74 -...

  • Page 76: Download And Calibration

    6. DOWNLOAD AND CALIBRATION 6. DOWNLOAD AND CALIBRATION 6.1 Download A. Download Setup Figure 6-1 describes Download setup UART Figure 6-1 Download Setup - 75 -...
  • Page 77 6. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Access Flash loader program in PC and select Erase. (Don’t check OWCD) 1. Select Erase 2. Check 3. Don t Check OWCD 2. Press Start and Wait until Erase is completed. 1. Press Start and Wait - 73 -...
  • Page 78 6. DOWNLOAD AND CALIBRATION 3. Change Address and Size (Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again (Alchemy 8W8Cerase) 1. Change Address and Size 3. Press Start and 2. Don t Check OWCD Wait 4.
  • Page 79 6. DOWNLOAD AND CALIBRATION 5. Choose software 5. Choose software 1. Select File 2. Press Open 6. Wait until converting from MOT to BIF is completed (Don t check OWCD) 6. Wait until converting from MOT to BIF is completed (Don’t check OWCD) 2.
  • Page 80 6. DOWNLOAD AND CALIBRATION 7. Press Start and Power on the phone using JIG remote Power on (Switch 1) 8. Wait until Sending Block is completed 8. Wait until Sending Block is completed - 79 -...
  • Page 81 6. DOWNLOAD AND CALIBRATION 9. Press Write to start Download and press Key to choose software (CodeData.mot) 10. Choose software 10. Choose software - 80 -...
  • Page 82 6. DOWNLOAD AND CALIBRATION 11. Wait until Sending Block is completed 1. Wait Until Sending Block is completed - 81 -...

  • Page 83: Calibration

    6. DOWNLOAD AND CALIBRATION 6.2 Calibration A. Equipment List Table 6-1 Calibration Equipment List Equipment for Calibration Type/Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIB interface card HP-GPIB Agilent Calibration &...
  • Page 84 6. DOWNLOAD AND CALIBRATION Figure 6-3 The top view of Test JIG C. Test Jig Operation Table 6-2 Calibration Equipment List Power Source Description Power Supply usually 4.0V Travel Adaptor Use TA, name is TA-20G (24pin) Table 6-3 Calibration Equipment List Switch Number Name Description...
  • Page 85 6. DOWNLOAD AND CALIBRATION 1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3 rd , 4 th of DIP SW ON state always 4.

  • Page 86: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM Power supply - 85 -...
  • Page 87 - 86 -...

  • Page 88: Circuit Diagram

    8. CIRCUIT DIAGRAM 8. CIRCUIT DIAGRAM & - 87 -...
  • Page 89 8. CIRCUIT DIAGRAM 8. CIRCUIT DIAGRAM & - 88 -...
  • Page 90 8. CIRCUIT DIAGRAM 8. CIRCUIT DIAGRAM & - 89 -...
  • Page 91 8. CIRCUIT DIAGRAM 8. CIRCUIT DIAGRAM & - 90 -...
  • Page 92 8. CIRCUIT DIAGRAM 8. CIRCUIT DIAGRAM & - 91 -...
  • Page 93 8. CIRCUIT DIAGRAM 8. CIRCUIT DIAGRAM & - 92 -...

  • Page 94: Pcb Layout

    9. PCB LAYOUT 9. PCB LAYOUT - 93 -...
  • Page 95 9. PCB LAYOUT 9. PCB LAYOUT - 94 -...

  • Page 96: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
  • Page 97 10. ENGINEERING MODE F. BATTERY [1-6] • Bat Cal [1-6-1] : This displays the value of Battery Calibration. The following menus are displayed in order; BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT • TEMP Cal [1-6-2] : This displays the value of Temperature Calibration. The following menus are displayed in order;...

  • Page 98: Rf Test [Menu 2]

    10. ENGINEERING MODE 10.2 RF Test [MENU 2] Radio Frequency Test A. SAR Test [2-1] This menu is to test the Specific Absorption Rate. • SAR Test On [2-1-1] : Phone continuously process TX only. Call-setup equipment is not required. •...

  • Page 99: Trace Option [Menu 4]

    10. ENGINEERING MODE 10.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 10.5 Call Timer [MENU 5] A. All calls [5-1] This displays total conversation time. User cannot reset this value. B.

  • Page 100: Stand Alone Test

    11. STAND ALONE TEST 11. STAND ALONE TEST 11.1 What’s the Standalone Test? Set the Phone to Perform only Tx or Rx mode for monitoring performance of Tx part or Rx part only. 1. Normal Call 2. Standalone • During Rx Standalone •...

  • Page 101: Standalone Test Equipment Setup

    11. STAND ALONE TEST 11.2 Standalone Test Equipment Setup GSM Test Equipment Power Supply RS-232 Cable Phone - 100 -...

  • Page 102: Hw Test : Software For Standalone Test Setup

    11. STAND ALONE TEST 11.3 HW Test : Software for Standalone Test Setup Rx Standalone Test setting Block Tx Standalone Test setting Block Connect, Test Start Signal Flow window - 101 -...

  • Page 103: Tx Stand Alone Test Setting

    11. STAND ALONE TEST 11.4 Tx Stand alone Test Setting 1. Setting the Test Equipment as ‘Test Mode-BCH’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : BCH For HP8922 Operating mode : Test Mode 2.
  • Page 104 11. STAND ALONE TEST Tx Stand alone Test Setting 3. Select Tx 4. Select ARFCN For GSM : 62CH For DCS : 700CH 5. Select Tx Power Level For GSM : 5 For DCS : 0 7. Press Start 6. Press Connect - 103 - - 99 -...

  • Page 105: Rx Stand Alone Test Setting

    11. STAND ALONE TEST 11.5 Rx Stand alone Test Setting 1. Setting the Test Equipment as ‘CW MODE’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : CW For HP8922 Operating mode : CW Generator 2.
  • Page 106 11. STAND ALONE TEST Rx Stand alone Test Setting 3. Select Rx 4. Select Gain Control Index 17 fr Both Band 5. Press Connect 6. Press Start - 105 -...

  • Page 107: Auto Calibration

    12. AUTO CALIBRATION 12. AUTO CALIBRATION 12.1 Overview AutoCal (Auto Calibration) is the PC side calibration tool that performs Rx and Tx calibrationwith Agilent 8960 or other equipment. AutoCal generates calibration data by communicating with- phone and measuring equipment and writes it into calibration data block of flash memory inGSM phone.

  • Page 108: Equipment Setup

    12. AUTO CALIBRATION 12.3 Equipment Setup Figure 12-1 Equipment Setup - 107 -...

  • Page 109: Agc For Rx

    12. AUTO CALIBRATION 12.4 AGC fr RX Setting the AGC Gain to make same Rx Power fed into the Base Band Part REgardless of Antenna Input level. Part X (Input Level)+G (Gain)=Y 12.5 APC for TX To make Tx Power Level transmitted properly following the information of Base Station. Example) GSM Power Level 6 Mobile...

  • Page 110: Adc

    12. AUTO CALIBRATION 12.6 ADC This procedure is for battery calibration.You can get mainBatteryConfigTable and temperatureConfigTable. 12.7 How to do calibration A. Connect cable between phone and serial port of PC. B. Connect Agilent 8960 equipment, programmable power supply, and phone. C.
  • Page 111 12. AUTO CALIBRATION - 110 -...

  • Page 112: Exploded View & Replacement Part List

    13. EXPLODED VIEW & REPLACEMENT PART LIST 13. EXPLODED VIEW & REPLACEMENT 13.1 Exploded View • • • • • • • • • • <Parts List of Exploded View> • • • • • • • • • • •...
  • Page 113 13. EXPLODED VIEW & REPLACEMENT PART LIST - 112 -...

  • Page 114: Replacement Parts

    Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark GSM,BAR/FILP TGSM0030001 G1610 RUSRD AAAY00 ADDITION AAAY0062485 Blue Dark MCJA00 COVER,BATTERY MCJA0006404 Blue APEY00 PHONE...

  • Page 115: Main Component

    SBOM standard on GCSC. <Main Component> Location Level Description Part Number Specification Color Remark SAFY00 PCB ASSY,MAIN SAFY0119601 G1610 BAR 900/1800MHz SAFA00 PCB ASSY,MAIN,AUTO SAFA0046101 G1610 BAR 900/1800MHz ANT1 ANTENNA,MOBILE,FIXED SNMF0008702 0 ,0 dB,CF 3880MHz ,3216 1.2T ,BLUETOOTH CHIP CONN,JACK/PLUG, BAT100 ENJE0003001...
  • Page 116 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C217 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C219 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C220 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C221 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 117 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C313 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C314 CAP,CERAMIC,CHIP ECCH0000280 0.22 uF,10V ,K ,X7R ,HD ,1608 ,R/TP C315 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C317 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 118 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C428 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP C429 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C430 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C431 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C432 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C433 CAP,CERAMIC,CHIP ECCH0000171...
  • Page 119 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C625 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C626 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C627 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C628 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C630 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C631 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 120 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R111 RES,CHIP ERHY0000163 220K ohm,1/16W,F,1005,R/TP R112 RES,CHIP ERHY0000106 100 ohm,1/16W,F,1005,R/TP R113 RES,CHIP ERHY0000163 220K ohm,1/16W,F,1005,R/TP R114 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R115 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R206 RES,CHIP ERHY0000202...
  • Page 121 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R303 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R304 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R305 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R306 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R307 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R308 RES,CHIP ERHY0000213...
  • Page 122 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R303 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R304 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R305 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R306 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R307 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R308 RES,CHIP ERHY0000213...
  • Page 123 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R505 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R506 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R507 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R508 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R509 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R510 RES,CHIP ERHY0000237...
  • Page 124 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R630 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R632 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R633 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R634 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R636 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R637 RES,CHIP ERHY0000213...
  • Page 125 13. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark TSOP JW12 ,12 PIN,R/TP ,Charge Pump For 4 White LED U600 EUSY0178201 Driver U602 EUSY0227901 SON5-P-0.35(fSV) ,5 PIN,R/TP ,2-INPUT AND GATE HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT U603 EUSY0223002 CONTROL / 2.8V...

  • Page 126: Accessory

    Remark MHBY00 HANDSTRAP MHBY0000404 Hand Strap 135mm Black 3.7 V,950 mAh,1 CELL,PRISMATIC ,C310,T510 SBPL00 BATTERY PACK,LI-ION SBPL0072126 Silver INNERPACK BATTERY 100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST ,EU SSAD00 ADAPTOR,AC-DC SSAD0007828 PLUG(24P),STD WSYY00 SOFTWARE WSYY0190401 G1610 P16-07-ESV009-Dec 08 2004 - 125 -...

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