Table of Contents

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TABLE OF CONTENTS

1.
GENERAL
Step 2 ............................................................................... 3
Step 3 ............................................................................... 4
Making calls .................................................................... 5
Receiving calls ................................................................ 6
Speed dialing ................................................................... 7
Setting the ringer type ..................................................... 8
Switching the phones during a call ................................. 9
Talking between the handset and
the base phone (Intercom) .............................................. 10
Having a three-way conference ...................................... 11
Mounting the base phone on a wall ................................ 11
2.
.......................................................... 12
3.
3-1. Base Unit ......................................................................... 14
3-2. Handset ............................................................................ 15
4.
4-1. Base Unit Section ............................................................ 16
4-2. Handset Section ............................................................... 17
5.
5-1. Block Diagram - BASE UNIT Section - ....................... 19
5-2. Block Diagram - HANDSET Section - ......................... 21
Schematic Diagrams ....................................................... 23
- BASE MAIN Board (Side A) - ................................... 25
- BASE MAIN Board (Side B) - ................................... 27
5-6. Schematic Diagram
- BASE MAIN Section (1/2) - ....................................... 29
5-7. Schematic Diagram
- BASE MAIN Section (2/2) - ....................................... 31
- BASE KEY Section - .................................................. 33
- BASE KEY Section - .................................................. 34
5-10. Schematic Diagram
- HAND MAIN Section - .............................................. 35
- HAND MAIN Section - .............................................. 37
- SHEET SWITCH Section - ......................................... 39
5-13. IC Pin Function Description ........................................... 43
6.
7.
................................................. 45
.................................. 47
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
- 2 -

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