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Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
Name / Model #1 HP LA1951g LCD Monitor
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
EL-MF877-00
Template Revision A
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in product
4
0
2
1
0
0
1
4
0
0
0
0
0
0
Page 1

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Summary of Contents for HP LA1*51g Series

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 SCREW DRIVER(PHILLIPS HEAD) Description #2 Description #3 Description #4...
  • Page 3 HP- LA1x51g Disassembly Process...
  • Page 4 External Electric Cables Dissecting Process USB Cable Power Cable 2.Dissecting To Complete. 1.Remove Cable From Display Head.
  • Page 5 Remove Stand Base From Display 1.Take Screw(*4)From Stand & Remove Stand Base 2.Take Screw(*4)From Rear Cover. Form Display.
  • Page 6 Remove Front &Rear Cover From Display Head 1.Both Hands Upwardly Pull Up. 3. Remove Front Cover. 2. Toward the arrowhead , take the KEPC board from the Front Cover.
  • Page 7 Remove Mainframe &Panel 1.Remove Connector off from KEPC board. 2.Take Screw(*2)From Mainframe. 3.Take Screw(*2)From Mainframe. 4.Remove the Conductive Tape from the Mainframe.
  • Page 8 Remove Mainframe &Panel 1. Toward the arrowhead ,Remove the 2.Remove Connector off from Power board. sheet iron from Mainframe. 4.Remove the panel. 3.Remove connector off from Panel.
  • Page 9 Take Screw off From Power Bd & Main Bd & USB Bd & Remove Mainframe 2.Remove the Conductive Tape from the 1.Remove Insulator Sheet off from Mainframe. Mainframe. 3.Remove the Conductive Tape from the Mainframe.
  • Page 10 Take Screw off From Power Bd & Main Bd & USB Bd & Remove Mainframe 1.Take screw(*4) off from Mainboard. 2.Take screw(*1) off from Mainboard. 3.Take Mainboard off from Mainframe. 4.Remove Connector off from Mainboard...
  • Page 11 Take Screw off From Power Bd & Main Bd & USB Bd & Remove Mainframe 1.Take screw(*2) off from USB board. 2.Take USB board off from Mainframe. 3.Remove Connector off from USB board...
  • Page 12 Take Screw off From Power Bd & Main Bd & USB Bd & Remove Mainframe 1.Take screw(*5) off from Power board. 2.Take Power board off from Mainframe. 3.Dissecting to complete.
  • Page 13 Remove Stand&Base Cover From Stand&Base 1. Press down the Stand , push up the Hinge 1.Take screw(*4) off from Stand&Base. Cover and remove it. 4. Dissecting to complete. 3. Pull off the limit buckle.
  • Page 14 Remove Stand&Base Cover From Stand&Base 1. Remove the Front Stand Cover. 2. Toward the arrowhead , pull over Rear Stand Cover. 3.Take screw(*4) off from Rear Stand Cover.
  • Page 15 Remove Stand&Base Cover From Stand&Base 1.Use tools, let the rubber melt, and remove 1.Turn VESA , and remove Front Stand VESA Cover. Cover. 3.Take screw(*1) off ,and remove Rear Stand 4.Dissecting To Complete. Cover.
  • Page 16 Remove Stand&Base Cover From Stand&Base 1. Pull Rear Hinge Cover, and remove it. 2. Remove Front Hinge Cover. 3.Dissecting To Complete.
  • Page 17 Remove Stand&Base Cover From Stand&Base 3.Take screw(*7) off ,and remove Base Trim 1. Remove Base foot. Cover. 3.Dissecting To Complete.
  • Page 18 Remove Stand&Base Cover From Stand&Base 1.Take screw(*3) off ,and remove Base 2.Dissecting To Complete. Cover.

This manual is also suitable for:

La1951g