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HP BladeSystem Blade Switch Product End-Of-Life Disassembly Instructions
HP BladeSystem Blade Switch Product End-Of-Life Disassembly Instructions

HP BladeSystem Blade Switch Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
Notes
With a surface greater than 10 sq cm
All types including standard alkaline
and lithium coin or button style
batteries
For example, mercury in lamps, display
backlights, scanner lamps, switches,
batteries
Includes background illuminated
displays with gas discharge lamps
Include the cartridges, print heads,
tubes, vent chambers, and service
stations.
Quantity of items
included in product
2 (system bd,
daughter bd)
1 (underside of
daughter board)
2

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Summary of Contents for HP BladeSystem Blade Switch

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1 Flat blade, torx (T15) screwdriver Torx: T-15 Description #2 3/16-inch nut driver Description #3...
  • Page 3 FIGURE 1: Switch FIGURE 2: Lever that secures daughter board to system board FIGURE 3: Daughter board retaining clips FIGURE 4: Daughter board battery location hex nuts FIGURE 5: Daughter board battery FIGURE 6: System board screws...