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HP EliteDesk 705 G1 Disassembly Instructions Manual

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 705 G1 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
Yes
All types including standard alkaline and lithium coin
or button style batteries Yes
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Liteon 240W EPA92 PSU
YES
Include the cartridges, print heads, tubes, vent
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
5
1
Page 1

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Summary of Contents for HP EliteDesk 705 G1

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2: Tool Description

    including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 Figure1 Remove the Access Panel Figure2 Rotate the driver cage from the hook on slide rail Figure3 Disconnect SATA cables from MB Figure4 Disconnect the FIO cables from MB Figure5 Disconnect Speaker cable from MB Figure6 Disconnect ODD/HDD PSU cables from MB EL-MF877-00 Page 3 Template Revision B...
  • Page 4 Figure7 Disconnect MB PSU cable from MB Figure8 Disconnect other PSU cables from MB Figure9 Disconnect CPU Power cable from MB Figure10 Disconnect HDD Power cable from MB Figure11 Disconnect SATA cable from HDD Figure12 Remove the cables from chassis clips EL-MF877-00 Page 4 Template Revision B...
  • Page 5 Figure13 Press the HDD’s latch on HDD cage Figure14 Remove the HDD from cage Figure15 Press the ODD’s latch on ODD cage Figure16 Remove the ODD from cage Figure17 Remove the Heatsink PSU cable from MB Figure18 Rotate the Fan duct and remove it from chassis EL-MF877-00 Page 5 Template Revision B...
  • Page 6 Figure19 Loose the screws and remove Heat sink Figure20 Loose the screws and remove heatsink fan Figure21 Separate the fan from CPU heatsink Figure22 Rotate the handle and open it up Figure23 Remove the CPU from the board Figure24 Remove the Memory card from the board EL-MF877-00 Page 6 Template Revision B...
  • Page 7 Figure25 Remove the battery from the system board Figure26 Loose the screws of MB from board Figure27 Remove MB from chassis Figure28 Remove front bezel from chassis Figure29 Loose the screw of FIO and remove it Figure30 Loose the screws of Speaker and remove them EL-MF877-00 Page 7 Template Revision B...
  • Page 8 Figure31 Remove the holder of LED power cable from Figure32 Remove Front IO cable chassis Figure33 Press the PSU’s latch on chassis Figure34 Remove the PSU from chassis Figure35 Remove screws from top Figure36 Remove screw for bottom EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 9 Figure37 Remove the screws and open case Figure38 Disconnect the cable-wire from product Figure39 When removed only PCBA left Figure40 Remove Ele-Cap from PCBA Figure 41 Show Ele-Cap on PCBA EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...