HP OMEN X Disassembly Instructions Manual page 2

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on a curve foam, soft and clean surface.
2. Remove the Stand and Base ASSY.
3. Remove Rear Cover
4. Remove Connectors on main board
5. Remove the hinge
6. Remove tape around main frame
7. Remove the Ambient light board
8. Remove the the screws and the Light bar connector
9. Remove screws and deco..
10. remove screws around middle bezel and middle bezle
11. Remove the mainboard connect pin to panel
12. Remove screws and get out main board from main frame
13. Take off pins and shielding case
14. remove those PCBA on rear cover
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Tool Size (if
applicable)
1#