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Toshiba Semiconductor Handling Manual page 7

Toshiba semiconductor handling guide

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3.2
Storage
3.2.1
General Storage
Avoid storage locations where devices will be exposed to moisture or direct sunlight
Follow the instructions printed on the device cartons regarding
transportation and storage.
The storage area temperature should be kept within a
temperature range of 5°C to 35°C, and relative humidity
should be maintained at between 45% and 75%.
Do not store devices in the presence of harmful (especially
corrosive) gases, or in dusty conditions.
Use storage areas where there is minimal temperature
fluctuation. Rapid temperature changes can cause moisture to form on stored devices, resulting
in lead oxidation or corrosion. As a result, the solderability of the leads will be degraded.
When repacking devices, use anti-static containers.
Do not allow external forces or loads to be applied to devices while they are in storage.
If devices have been stored for more than two years, their electrical characteristics should be
tested and their leads should be tested for ease of soldering before they are used.
99
[6] Handling Guide
Temperature:
Humidity:

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