HP 10500 Series Disassembly Instructions page 2

Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on part 1,then remove part 1;
2. Unscrew the screws on guiding set 2,then remove guiding set 2;
3. Remove shielding finger 3 from panel 8;
4. Remove film 4 from panel 8;
5. Unscrew the screws on heatsink 6,then remove heatsink 6 from pcb 7;
6. Remove heatsink 5 from pcb 7;
7. Unscrew the screws on PCB 7,then remove PCB 7 from bottom panel 8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.3 Material of the facility built
Facility Components
1
2
3
4
5
6
EL-MF877-00
Template Revision B
Figure1 Treatments to the product
Material Weight(g)
Fe 48
Zn 32
Be-Cu 2.7
PC 9.2
Al 10.5
Al 225
Weight Selective treatment for
percentage materials and components
1.67%
1.11%
0.09%
0.32%
0.37%
7.84%
Tool Size (if
applicable)
2#
Details
Fe recycling
Zn recycling
Cu recycling
Pla
recycling
Al recycling
Al recycling
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