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LG L601i Service Manual

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Service Manual
L601i
Date: October, 2006 / Issue 1.0

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Summary of Contents for LG L601i

  • Page 1 Service Manual L601i Date: October, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    9.1 Configuration of HOT KIMCHI .....147 3.9. External memory interface ....39 9.2 How to use HOT KIMCHI.....150 3.10. H/W Sub System.........40 3.11 LG-L601i(Nausicaa) Main features ..63 10. EXPLODED VIEW & REPLACEMENT PART LIST ..153 4. TROUBLE SHOOTING ....68 10.1 EXPLODED VIEW ......153 4.1 RF Component........68...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape Clamshell Folder Size 94 x 50 x 18mm Weight 93 g (with 860 mAh Battery) Power 3.7V normal, 860 mAh Li-Polymer Over 140 Min (WCDMA, Tx=10dBm, Voice Call) Talk Time Over 90 Min (WCDMA, Tx=10dBm, Video Call) (with 860mAh) Over 200 Min (GSM, Tx=29dBm, Voice)

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ. Unit TA Power Available power * CLA : 12 ~ 24 V(DC)
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Maximum Output Power Class 3 : +24dBm(+1/-3dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by (Static) Stand by(Dynamic) Voice Call 380hrs 250hrs 140 Min 90 Min WCDMA (auto mode) (auto mode) (Tx=10 dBm) (Tx=10 dBm) (DRX=2.56) (DRX=2.56) Stand By (Static) Voice Call 260 hrs/260 hrs 200 Min (auto mode) (Tx=Max) (Paging period =5) (Stand by and Voice Call Test Condition : LCD backlight Off)

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -4 ± 3 dB Receiving Loudness Rating (RLR) -15 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Sending Distortion (SD) Refer to Table 30.3 Receiving Distortion (RD)

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Normal Charging Current : 600 mA • Normal Battery Capacity : 860 mAh • Charging Time : Max 3 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. RF TECHNICAL BRIEF 3.1 General Description The L601i supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of L601i is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
  • Page 18 3. TECHNICAL BRIEF L601i power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode L601i’s receiver functions are split between the two RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
  • Page 20 3. TECHNICAL BRIEF The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections.
  • Page 21 3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250A IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 23 3. TECHNICAL BRIEF The amplifier output drives the RF port of the quadrature RF-to-baseband downconverter. The down- converted baseband outputs are routed to low-pass filters (one I and one Q) having pass-band and stop-band characteristics suitable for DSWCDMA processing. The filter outputs are buffered and passed on to the MSM6250A IC for further processing.
  • Page 24 The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in L601i is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 25: Lo Phase-Locked Loop

    3. TECHNICAL BRIEF 3.4 LO Phase-locked Loop Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be considered by handset designers. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne 6250-IIseries chipset while requiring minimal off-chip design effort.
  • Page 26 3. TECHNICAL BRIEF The UMTS VCO signal is routed internally within the RTR6250 IC to the N-counter, closing the feedback path that allows the loop to lock. The VCO output drives LO generation and distribution circuits (within the RFR6250 IC) to create the necessary LO signals for Rx quadrature down-converter for either UMTS band.

  • Page 27: Off-Chip Rf Components

    A UMTS duplexer splits a single operating band into receive and transmit paths.Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the L601i typical losses: UMTS Tx = 1.5 dB, UMTS Rx = 2.3 dB.
  • Page 28 Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The L601i uses National Semiconductor LMV225TLX power detector IC. In Figure 3.5.5-1, R1 is set to 1.8kΩ resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power.
  • Page 29 3. TECHNICAL BRIEF Figure 3.5.5-1 Block diagram of LMV225TLX Typical Application Figure 3.5.5-2 Power detector response, Vout vs PA output power 3.5.6 Dual band GSM power amplifier (U102) The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
  • Page 30 3. TECHNICAL BRIEF RF input and output ports of the SKY77328 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes handset standby time.
  • Page 31 3. TECHNICAL BRIEF Since the RTR6250 TX_VCO_FB pin presents fairly high impedance, an external terminating resistor is required (R123, 51 Ω). A series capacitor (82 pF) AC couples the feedback signal into the RTR6250 3.5.8 UMTS Rx RF filter (FL101) An RF filter is located between the UMTS LNA and mixer.

  • Page 32: Digital Baseband(Dbb/Msm6250A)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital BaseBand(DBB/MSM6250A) 3.6.1 General Description A. Features(MSM6250A) • The ARM926EJ-S microprocessor can operate at up to 180 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...

  • Page 33: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture Dual LCD (2.2 inch) 900/1800/ 1900 Camera Q_VCO 1.3M PCS1900_Rx USIM DCS1800_Rx RTR6250 GSM900_Rx 7-color LED Stereo Head UMTS Phone 2100 MIDI Mono MSM6250A Analog Acoustic Speaker VCTCXO Coupler HDET SDRAM NAND Flash RFR6250E IRDA BATT PM665...
  • Page 34 3. TECHNICAL BRIEF 3.7.1. Block Diagram(MSM6250A) HK ADC USB I/F 19.2M UART General Purpose GSM/ UMTS GPRS NAND & Processor SDRAM Tx/Rx I/Q Tx/Rx I/F SBI for PM6650 Stereo Speaker VOCODER CODEC Receiver SBI for RF IC USIM J-TAG I/F Controller Figure.

  • Page 35: Subsystem(Msm6250A)

    3. TECHNICAL BRIEF 3.8. Subsystem(MSM6250A) 3.8.1. ARM Microprocessor Subsystem The MSM6250A device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650-2 devices.
  • Page 36 3. TECHNICAL BRIEF 3.8.6. Wideband CODEC The MSM6250A device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output.
  • Page 37 3. TECHNICAL BRIEF 3.8.10. UART There are three UARTs in the MSM6250A ASIC: • UART1 for data • UART2 (can be used for USIM interface) • UART3 (can be used for PM SBI interface) 3.8.11. USB The MSM6250A device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces.

  • Page 38: External Memory Interface

    3. TECHNICAL BRIEF 3.9. External memory interface A. MSM6250A The MSM6250A have two external memory interfaces with arbitration for the multi-layer AHB system and memory controllers. The EBI1 bus is a high performance bus that supports a wide variety of memories.

  • Page 39: H/W Sub System

    3. TECHNICAL BRIEF 3.10. H/W Sub System 3.10.1. RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6250A controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PAON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for T/Rx of RF •...
  • Page 40 3. TECHNICAL BRIEF B. RFR6250(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. the others • GSM_PA_BAND : DCS/GSM Band Selection of Power Amp • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA TX Power Amp Enable •...
  • Page 41 3. TECHNICAL BRIEF 3.10.2. MSM Sub System 3.10.2.1. SIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx USIM CLK VREG_USIM 2.85V USIM CLK USIM Reset...
  • Page 42 3. TECHNICAL BRIEF 3.10.2.2. USB The MSM6250A device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6250A was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0.
  • Page 43 3. TECHNICAL BRIEF 3.10.2.3. HKADC(House Keeping ADC) The MSM6250A device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250A device has six analog input pins which are multiplexed to the input of the internal HKADC.
  • Page 44 3. TECHNICAL BRIEF 3.10.3. Power Block 3.10.3.1. General MSM6250A, included RF, is fully covered by PM6650-2(Qualcomm PMIC). PM6650-2 cover the power of MSM6250A, MSM memory, RF block, Bluetooth, Trans flash, USIM and TCXO. Major power components are : PM6650-2(U403) : Phone power supply QST4(Q400) : External charger supply switching SI3493DV(Q401) : Main Battery charging control BH28FB1WHFV(U401) : LCD Power supply...
  • Page 45 3. TECHNICAL BRIEF Figure. PM6650-2 Functional Block Diagram - 46 -...
  • Page 46 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 3.47V~3.28V 3.72V~3.66V 3.65V~3.48V 4.2V~3.81V 3.80V~3.73V 5~0 (%) 46~26 (%) 25~5 (%) 100~68 (%) 67~47 (%) L601i Battery Bar Display - 47 -...
  • Page 47 3. TECHNICAL BRIEF 3.10.3.3.1. Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT).
  • Page 48 3. TECHNICAL BRIEF 3.10.3.3.2. Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. 3.10.3.3.3.
  • Page 49 3. TECHNICAL BRIEF 3.10.4. Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW_N to PMIC(PM6650-2) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 HOT1 HOT2 HOT3 MENU Side key ROW0 (VT) (INBOX)
  • Page 50 3. TECHNICAL BRIEF VREG_MSMP_2.7V HOT1 HOT2 HOT3 MENU MENU KEY_ROW(0) LEFT LEFT KEY_ROW(1) RIGHT RIGHT KEY_ROW(2) KEY_ROW(3) HOT4 HOT5 KEY_COL(0) HOT4 HOT5 KEY_ROW(4) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4) SIDE_KEY CN600 KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) 100ohm R633 KEY_COL(5) Figure Keypad Circuit - 51 -...
  • Page 51 3. TECHNICAL BRIEF 3.10.5 Camera Interface L601i Installed a 1.3M Pixel CMOS SXGA Camera. Below figures show the camera board to board connector and camera I/F signal. (CAM EMI Filter : 7.5pF & 10 ohm) CONNECTOR CN500 CAM_DATA(7) INOUT_B4 INOUT_A4...
  • Page 52 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (FX12B-24P- 04SV). Its interface is dedicated camera interface port in MSM6250A. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 53 3. TECHNICAL BRIEF 3.10.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U601 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to MSM6250A GPIO80. FOLDER_SENSE R600 VREG_MSMP_2.7V...
  • Page 54 3. TECHNICAL BRIEF 3.10.7. IRDA & UART COMMUNICATION CAM_SENSE detects the Camera Direction (front or back) AE13 EBI2_ADD[17] AA13 EBI2_ADD[16] EBI2_ADD[15] EBI2_ADD[14] AC12 EBI2_ADD[13] AA12 EBI2_ADD[12] AF11 EBI2_ADD[11] AE11 EBI2_ADD[10] EBI2_ADD[9] AC11 EBI2_ADD[8] AA11 EBI2_ADD[7] EBI2_ADD[6] AC10 EBI2_ADD[5] EBI2_ADD[4] AA10 EBI2_ADD[3] EBI2_ADD[2] EBI2_ADD[1]...
  • Page 55 3. TECHNICAL BRIEF 3.10.8. 7-color LED Indicator MSM6250A BLK BT_CLK_GPIO[25] BT_SBST_GPIO[24] B_LED_EN BT_SBCK_GPIO[23] BT_SBDT_GPIO[22] G_LED_EN BT_TX_RN_N_GPIO[21] R_LED_EN BT_DATA_GPIO[20] 7-color LED S/W TR LED Indicator => TO FPC Q600 DTC114EE R_LED_EN Q601 UMH9NTN - 56 -...
  • Page 56 3. TECHNICAL BRIEF 3.10.9. LCD Module Vibrator MAIN Receiver Back LOUD SPK Light MODULE LOUD SPK Figure. LCD Module Block Diagram MAIN LCD MODULE SUB LCD MODULE 260K Color TFT 65K Color TFT 176 * 220 Pixel (260K Color support) 96 * 96 Pixel BD663472(Source driver) &...
  • Page 57 3. TECHNICAL BRIEF 3.10.10.1. Display & LCD FPC Interface LCD module is connected to Main board with 50-pin BtoB connector (CN501_AXK8L50125BG) and Speaker, Receiver, Vibrator are connected by soldering the leads to pads in LCD FPCB module. The LCD is controlled by 16-bit EBI2 in MSM6250A 1 : NC (SUBLCD_CS_N) 26 : V_BACK_UP : BACK UP BATTERY VOLTAGE 2 : VREG_LCD_2.8V : LCD Power...
  • Page 58 3. TECHNICAL BRIEF 3.10.11. Audio and Sound 3.10.11.1. Overview of Audio & Sound path Head Set Jack Head_Set MSM6250A (U201) Folder FPCB Mono Speaker Module Connector Head Set Head_set MIC Jack Figure Audio & Sound Path Block Diagram - 59 -...
  • Page 59 3. TECHNICAL BRIEF 3.10.11.2. Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250A).
  • Page 60 3. TECHNICAL BRIEF MSM6250 BLK MIC_Feedback MICFBP MICINN 180K MICOUTP C202 0.1u 0.1u C203 R202 470K C227 R205 Close to MSM 180K MICOUTN 0.1u C225 0.1u C226 R207 MICINP MICFBN Head Set Jack BLK Ear jack VREG_MSMP_2.7V HSEJ-10S-05 CN502 2.2K R505 MICBIAS C511...
  • Page 61 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS SP0102BE3 MIC1N C520 22n C521 22n MIC1P U501 Audio Amp for loud Speaker Audio AMP +VPWR HB-1M1005-600JT U502 TPA2010D1YZF FB502 C524 R521 => Speaker PVDD C525 R523 R524 HPH_L SPK_RCV- SPK_AMP_EN _SHDN SPK_RCV+ LOW: SHDN 8200p...

  • Page 62: Lg-L601I(Nausicaa) Main Features

    3. TECHNICAL BRIEF 3.11 LG-L601i(Nausicaa) Main features 1. LG-L601i Main features - Folder Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode - Dual color Wide View Angle LCD 2.2” QCIF (176x220), 262K TFT LCD, Sub LCD 1.17” (96x96) 65K - 1.3M Pixel CMOS SXGA Camera...
  • Page 63 3. TECHNICAL BRIEF 2. LG-L601i Main Components LCD & Folder Assy 1.3M Camera Module MAIN Bottom Side - 64 -...
  • Page 64 3. TECHNICAL BRIEF 2-1. Main Top Side Hall sensor Volume Side key Camera hot side key Key LED Reference Description Reference Description Volume Side Key U601 HALL EFFECT SWITCH CN600 Volume Side Key - 65 -...
  • Page 65 3. TECHNICAL BRIEF 2-2. Main Bottom Side U500:Backlight & flash driver CN500:24 pins camera connector GSM TX VCO GSM power amp RTR6250 RFR6250 (switch module) U400:Camera Dual LDO (2.7V/1.8V) WCDMA Duplexer VCTCXO WCDMA MSM6250A Power amp Memory PM6650 X-tal Oscillator - 66 -...
  • Page 66 3. TECHNICAL BRIEF 2-2. Main Bottom Side(continued) Design COMPONENT CN300 CONNECTOR,BOARD TO CN501 CONNECTOR,BOARD TO CN500 CONNECTOR,BOARD TO CN502 CONN,JACK/PLUG,EARPH CN400 CONNECTOR,I/O J300 CONN,SOCKET SW100 CONN,RF SWITCH CN401 CONNECTOR,ETC U106 RF POWER DETECTOR U101 RTR6250D U100 SPDT SWITCH U300 1G NAND+512M SDRAM U401 CMOS LDO 2.8V U500...

  • Page 67: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component ANT 100,101,102 SW100 U102 U103 FL508 U101 FL509 U106 X100 U107 U606 ANT500 RF component (Bottom) Reference Description Reference Description X100 VCTCXO(19.2MHz) U106 HDET IC U107 WCDMA Receiver IC(RFR6250) FL509 WCDMA Duplexer U101 GSM/WCDMA Transceiver IC U606...

  • Page 68: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH 19.2MHz(C177) VREG_MSMA_2.6V MSM6250 VREG_TCXO_2.85V D401 VREG_MSMC_1.2V PM6650 VREG_MSME_1.8V 19.2MHz(R410) 32.768KHz VREG_MSMP_2.7V - 69 -...
  • Page 69 4. TROUBLE SHOOTING GSM Tx PATH GSM Rx PATH DCS/PCS Tx PATH DCS Rx PATH GSM/DCS/PCS Rx Common path PCS Rx PATH - 70 -...

  • Page 70: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX part, GSM part and BB part. - 71 -...
  • Page 71 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) C159 1000p VREG_TCXO_2.85V C166 C167 1000p 0.1u 19.2MHz X100 R129 TRK_LO_ADJ VCONT 100ohm TG-5001LA-19.2MHz C172 C173 0.01u 1000p C177 100p...
  • Page 72 4. TROUBLE SHOOTING Check TP1 VCC of TCXO ≥ 2.8V Check PMIC Check TP2 TRK_LO_AD ≥ ≥ 3V Voltage 0V Check MSM Check TP3,4,5 With scilloscope Check soldering ≥ ≥ 3V Voltage 0V and components VCXO is OK Check other part - 73 -...

  • Page 73: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block LMSP54MA-543 TP 1. VREG_RFRX_0_2.85V ANT_SEL0 ANT_SEL1 ANT_SEL2 Antenna Switch Block(Bottom) ANT101 ANT102 VREG_RFRX_0_2.85V ANT100 U100 AC_T_N OUT2 VCONT SW100 R100 OUT1 R643 C100 C102 L504 KMS-507 UPG2010TB-E3 C106 C104 C101 RF_OUT FL508 LMSP54MA-543 GSM900_RX1...
  • Page 74 4. TROUBLE SHOOTING Mode ANT_SEL0 ANT_SEL1 ANT_SEL2 EGSM TX High High DCS/PCS TX High EGSM RX High DCS RX High High PCS RX High UMTS High High High Logic Table of the Antenna Switch - 75 -...
  • Page 75 4. TROUBLE SHOOTING Checking Switch Block power source Check Soldering of ANT_SEL0, 1, 2 High Level Check VCC 2.5V < Voltgae < 3.0V TP1 VREG_RFRX_0_2.85V Check the Llogic in eaah mode - 76 -...

  • Page 76: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block START 1. Check VCXO 19.2MHz 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 4. Check PAM Block 5. Check RF Rx Level 6. Re-download SW & CAL. - 77 -...
  • Page 77 4. TROUBLE SHOOTING 4.5.1 Checking VCXO Block Refer to 3.3 4.5.2 Checking Ant. SW module Refer to 3.4 4.5.3 Checking RF TX Level Test Point (RF TX Level) ANT101 ANT102 VREG_RFRX_0_2.85V ANT100 U100 AC_T_N OUT2 VCONT SW100 R100 OUT1 R643 C100 C102 L504...
  • Page 78 4. TROUBLE SHOOTING WCDMA +VPWR AWT6277R U606 C164 GND5 Close to Pin 1 Close to pin 10 3.3nH VCC2 VCC1 2.2p GND4 RFIN RFOUT GND1 R128 PA_R0 R637 GND3 VMODE C169 GND2 VREF C171 C168 TR100 KRX102E PA_ON COUP C174 0.01u VREG_RFTX_2.85V HDET...
  • Page 79 4. TROUBLE SHOOTING 4.5.4 Checking PAM Block • PAM control signal PA_ON : WCDMA Tx Power Detect IC(HDET) Enable TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control TX_AGC_ADJ PA_ON PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) PAM IN/OUT Signal PAM_OUT PAM_IN...
  • Page 80 4. TROUBLE SHOOTING 4.5.5 Check RF Rx Level Bias1 Test Point (RF Rx Level) ANT101 ANT102 VREG_RFRX_0_2.85V ANT100 U100 OUT2 VCONT AC_T_N C158 22p IMT_RX_P SW100 R100 OUT1 L123 R643 C100 C102 L504 1.5nH KMS-507 UPG2010TB-E3 FL101 C106 C104 C162 R125 C163 0.1u...
  • Page 81 4. TROUBLE SHOOTING Set the Phone Rx is ON Check bias1 Check bias block Over 2V ? soldering Check TP1 Check RF s/w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Duplexer Signal exist? Check TP4 Check RFR6250 Signal exist? Change the board - 82 -...

  • Page 82: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6 Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re-download SW & CAL. - 83 -...
  • Page 83 4. TROUBLE SHOOTING 4.6.1 Checking VCO Block Test Point (TXVCO Level) MQW5V0C869M U103 FB100 R114 VREG_RFTX_2.85V R115 R116 100ohm GSM_TX_VCO_0_EN_N OUT_GSM R117 100ohm GSM_TX_VCO_1_EN_N OUT_DCSPCS GND5 GND1 VREG_MSMP_2.7V GND6 GND2 GND7 GND3 GND8 GND4 VREG_RFTX_2.85V R123 Schematic of RF TXVCO - 84 -...
  • Page 84 4. TROUBLE SHOOTING START Check TP1 Check RTR6250 0.5V < TP1 < 2.5V Check TP2, TP3 If GSM TP2=High , TP3=Low Check Soldering If DCS/PCS TP2=Low , TP3=High & MSM6250A Check TP4 Check PMIC(U403) 2.8V < TP4 < 3.0V Check TP5, TP6 Check Soldering of 0dBm <...
  • Page 85 4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 3.4 4.6.3 Checking RF Tx level Test Point (RF Tx Level) ANT101 ANT102 VREG_RFRX_0_2.85V ANT100 U100 OUT2 VCONT AC_T_N SW100 R100 OUT1 R643 C100 C102 L504 KMS-507 UPG2010TB-E3 C106 C104 C101 RF_OUT...
  • Page 86 4. TROUBLE SHOOTING START Check TP1 GSM/DCS/PCS If GSM over 31dBm ? Tx is Ok If DCS/PCS over 28dBm ? Check other part Check ANT.SW Check TP2, TP3 Check ANT. SW If TP2 over 29dBm ? Module (U100) (FL508 Module(FL508) If TP3 over 25dBm ? Refer to chapter 3.4 Refer to chapter 3.4...
  • Page 87 4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.
  • Page 88 4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block PCS.RX DCS.RX EGSM.R Test Point (RF Rx Level) L101 1930-1990 MHz L102 2.2nH L506 C109 PCS.RX 1000p L106 2.2nH L109 VREG_RFTX_2.8 L110 5.6nH VREG_RFTX_2.85V 1805-1880 MHz DCS.RX L112 18nH C121 1000p L115 18nH 925-960 MHz L120...
  • Page 89 4. TROUBLE SHOOTING Set the Phone Rx is ON Check Resoldering soldering Check Change FEM & buffer FEM & buffer Change the board - 90 -...

  • Page 90: Power On Trouble

    4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.7 Power ON Trouble Power On sequence of L601i is : PWR(END) key press -> PM_ON_SW_N go to low(D601),PM6650-2 KPDPWR_N pin(24) -> PM6650- 2 Power Up -> VREG_MSMC_1.2V(L404), VREG_MSME_1.8V(L405), VREG_MSMP_2.7V(R411), VREG_MSMA_2.6V(R409), VREG_TCXO_2.85V(C404) power up and system reset assert to MSM ->...
  • Page 91 4. TROUBLE SHOOTING 19.2MHz(C177) VREG_MSMA_2.6V MSM6250 VREG_TCXO_2.85V D401 VREG_MSMC_1.2V PM6650 VREG_MSME_1.8V 19.2MHz(R410) 32.768KHz VREG_MSMP_2.7V - 92 -...

  • Page 92: Usb Trouble

    4. TROUBLE SHOOTING 4.8 USB Trouble USB Initial sequence of L601i is : USB connected to L601i -> USB_VBUS(Q602 Pin_4) go to 5V -> USB_D+(U402 Pin_1) go to 3.3V -> 48M Crystal on -> USB_DATA(TP_210) is triggered -> USB work. Start...

  • Page 93: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.9 SIM Detect Trouble USB Initial sequence of L601i is : VREG_USIM_2.85V(C432 of PM6650-2) go to 3.0V -> USIM_CLK,USIM_RST,USIM_DATA triggered -> USIM IF work(Schematic and place are refer to SIM technical brief) Start Re-insert the SIM card...

  • Page 94: Key Sense Trouble

    4. TROUBLE SHOOTING 4.10 Key Sense Trouble Key Sense sequence of L601i is : Default condition ROW(0-4) is 2.7V -> Press the key -> Corresponding row(x) and col(x) go to 0V -> Key sensing Start Change the side key Work well?

  • Page 95: Camera Trouble

    4. TROUBLE SHOOTING 4.11 Camera Trouble Camera control signals are generated by MSM6250A and directly connected with MSM6250A. Start Check the camera conn. and reconnect the camera Camera is OK? Check VREG_CAM_2.7V, Change the U400 VREG_CAM_1.8V Check the DSP_CLK Change the Main board (FB500) Change the camera Camera is OK?

  • Page 96: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.12 Main LCD Trouble Main LCD control signals are generated by MSM6250A. Those signal’s path are : MSM6250A -> MAIN B’d -> CN602 -> LCD FPCB and LCD Module - 97 -...
  • Page 97 4. TROUBLE SHOOTING LCD Control data flow LCD Module 40 pin LCD connector FPCB for LCD Module CN501(50pin LCD connector) - 98 -...

  • Page 98: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.13 Folder ON/OFF Trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event -> Flip(U601 pin 1) is triggered(Open : about 2.6V, Close : 0V) -> MSM6250A Sense the Folder Flip Event. Sensing signal is directly connected to MSM6250A. Start Check the magnet in Insert the magnet...

  • Page 99: Camera Direction Change Trouble

    4. TROUBLE SHOOTING 4.14 Camera Direction Change Trouble Camera direction change is worked as below : Camera preview start -> Pushing hot1-key -> MSM6250A Sense the camera Direction Event. Hot1-key sensing signal is directly connected to MSM6250A by pull-up register(R607). Start ushsing hot1-key Camera direction change Event for p...

  • Page 100: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.15 Audio Trouble Shooting 4.15.1 Receiver Path Voice Receiver path as below: MSM6250A Ear1ON/Ear1OP -> U605(Speaker/receiver switch) -> CN501(b’d to b’d connector) -> MAIN FPCB(b’d to b’d connector) -> Speaker Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Hear the tone to the receiver The sine wave appear at...
  • Page 101 4. TROUBLE SHOOTING CN501(Connect) R525,R526(receiver signal serial resistor) U605 (Analog switch) Speaker Main FPCB Speaker soldering point - 102 -...
  • Page 102 4. TROUBLE SHOOTING 4.15.2 Voice and Sound Path for Head_set Voice and Multimedia Sound path for Head_Set as below: MSM6250A HPH_R, HPH_L -> C512, C513 -> R506, R507 -> CN502 headset Jack pin 4,5 Start Connect the phone to network Equipment and setup call Setup 1KHz tone out And insert head_Set...
  • Page 103 4. TROUBLE SHOOTING Ear jack VREG_MSMP_2.7V HSEJ-10S-05 CN502 2.2K R505 MICBIAS C511 MIC2P C512 EAR_SENSE_N R506 HPH_R R507 HPH_L STEREO_DET_N C513 R508 VREG_MSMP_2.7V UART_RX_EAR UART_TX_EAR R509 Ear_sense_n pin R506, R507 - 104 -...
  • Page 104 4. TROUBLE SHOOTING 4.15.3 Loud Speaker path(voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6250A HPL_L -> R523 -> C525 -> R524 -> U502(AMP) -> CN501 -> MAIN FPCB(b’d to b’d connector) -> Speaker Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Set phone with speaker Phone mode...
  • Page 105 4. TROUBLE SHOOTING Audio AMP 22 and 23 pin of CN501 - 106 -...
  • Page 106 4. TROUBLE SHOOTING 4.15.4 Microphone for Main MIC Main Microphone path as below: MIC -> C528,C529 -> MSM6250A -> MIC feed back gain logic -> MSM internal CODEC MICBIAS SP0102BE3 C227 MIC1N C520 22n C521 22n Close to MSM MIC1P U501 Start Make a call...
  • Page 107 4. TROUBLE SHOOTING MICBIAS SP0102BE3 MIC1N C520 22n C521 22n MIC1P U501 - 108 -...
  • Page 108 4. TROUBLE SHOOTING 4.15.5 Microphone for Head_Set MIC for Head_Set path as below: Insert Headset -> EAR_SENSE_N(pin3) go 0V -> MSM6250A sense Head_Set insertion -> MIC signal go to MSM Ear jack VREG_MSMP_2.7V HSEJ-10S-05 CN502 2.2K R505 MICBIAS C511 MIC2P C512 EAR_SENSE_N R506...
  • Page 109 4. TROUBLE SHOOTING Ear_sense_n pin R506, R507 R505 - 110 -...

  • Page 110: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.16 Charger Trouble Shooting Charging Current Flow +5V_PWR (5.4V) Q400 QST4 Pass control Tr (ON) TA Charging control CHG_CNT_N ICHARGE Charging current sensing ICHARGEOUT +VPWR 4.2~4.25V Q401 SI3493DV-E3 VBATT Main Battery Battery charging BATT_FET_N control Charging Procedure - Connecting TA - Control the charging current by PM6650 IC using USB_CNT_N or CHG_CNT_N signal - Charging Current flows into the battery by control BATT_FET_N...
  • Page 111 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA voltage 5.4V? Change TA cable Check the Q400,Q401 Charging OK? Change the board - 112 -...
  • Page 112 4. TROUBLE SHOOTING Q401 Q400 VBAT T - 113 -...

  • Page 113: Download

    LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is desinged to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG USB modem driver(Ver 1.0 or later) is installed. 5.2 Downloading Procedure 1) Connecting to PC Connect the phone to your desktop PC using the USB cable and run the LGMDP application.
  • Page 114 5. DOWNLOAD The status “Ready” is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. - 115 -...
  • Page 115 5. DOWNLOAD Function Description 1) Image Folder indicates location where all image files are placed. 2) Image files to be downloaded. 3) NV Default: Uploading nv2 file for special use. 4) NV Backup/Restore: NV Backup/Restore always have to be done. Store and Backup the Calibration data 5) Display Binary Info: Displaying popup window for image information.
  • Page 116 5. DOWNLOAD 2) Choosing image files Select the image folder, where all the image files are located, by clicking on the “Browse...” button. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) Select the path, where AMSS Modem Image file is located by clicking on the “Browse...”...
  • Page 117 5. DOWNLOAD Click on the “START” button to download. All User data will be kept after upgrading. Be careful to use other options. - 118 -...
  • Page 118 5. DOWNLOAD 3) Downloading This is whole process for downloading. You will see snapshots for each step in the succeeding slides. Download Start (NV Backup) (NV Restore) Erase MEDIA directory Reset Download MEDIA Erase MODULE directory Download MODULE (Erase EFS) Reset Download MODEM Download End...
  • Page 119 5. DOWNLOAD • This message box informs that a new file for NV backup will be created in the mentioned local directory as shown. • NV backup in progress. • Erasing the existing directories and files before the Module Image is downloaded. •...
  • Page 120 5. DOWNLOAD • Rebooting and waiting for a while • Performing NV restore • Erasing the existing directories and files before downloading the Media Image • Download of Media image in progress - 121 -...
  • Page 121 5. DOWNLOAD • Download of Module image in progress • Download process has completed successfully - 122 -...

  • Page 122: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 1) MEDIA Erasing error Snapshot showing the “MEDIA Erasing error” before downloading the Media Image. Next slide shows the remedial procedure to adopt. - 123 -...
  • Page 123 5. DOWNLOAD Reboot the phone and then try to download only the Media and Module images again. Both Media and Moule Image have to be downloaded at the same time. - 124 -...
  • Page 124 5. DOWNLOAD 2) NV Restore error Snapshot showing the “NV Restore error”. Next slide shows the remedial procedure to adopt. Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) - 125 -...
  • Page 125 5. DOWNLOAD Click on “X” button to use another function. - 126 -...
  • Page 126 5. DOWNLOAD 3) NV Restore error Click on “NV Restore”. A list of NV Backup files(*.nv2) will be shown. These files were saved everytime NV Backup option was selected. The name is based on the time when NV Backup was done. Select the appropriate file and click on “Restore”.

  • Page 127: Caution

    5. DOWNLOAD Snapshot showing the error, Reading the NV file and restore NV. 5.4 Caution 1) Not recommended that multi-downloading using the USB hub. 2) Recommendsed that the Module and Media Image have to be downloaded at the same time. - 128 -...

  • Page 128: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block Fig 2.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 129 -...
  • Page 129 6. BLOCK DIAGRAM Block Ref. Name Part Name Function Comment Common U101 RTR6250 RF Transceiver IC SW100 KMS507 Test Connector Calibration, etc FL508 LMSP54MA-543 Front End Module X100 TG5001LA-19.2MHz VCTCXO 19.2MHz WCDMA FL509 SAYDT1G95AF0B00R05 Duplexer FL101 B7827 RX SAW Filter U107 RFR6250 RF Receiver IC...

  • Page 130: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram L601i Interface Diagram - 131 -...
  • Page 131 6. BLOCK DIAGRAM Main RF signal (black) GSM TX : GSM Tx RF signal GSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS TX : UMTS Tx RF signal UMTS RX : UMTS Rx RF signal...
  • Page 132 6. BLOCK DIAGRAM *Top Side - 133 -...
  • Page 133 6. BLOCK DIAGRAM *Bottom Side - 134 -...

  • Page 134: Circuit Diagram

    C195 27nH Sheets VDDA2 GRX_QP GRX_QM MODEL Designer 06/29/2006 VREG_RFRX_1_2.85V Checked RX_QM DRAWING C196 C197 R139 RX_QP 0.1u R140 C198 Approved RX_IM 3300 C199 (PPS) 0.01u 3.9n RX_IP 470p 0.1u 100p DRAWING LG Electronics Inc. Rev_1.0 LG(42)-A-5505-10:01 - 135 -...
  • Page 135 EBI2_ADD[7] BT_DATA_GPIO[20] R_LED_EN EBI2_ADD[6] AC10 EBI2_ADD[5] EBI2_ADD[4] AA10 EBI2_ADD[3] EBI2_ADD[2] EBI2_ADD[1] C247 0.1u Section Date Sign & Name Sheet/ Sheets MODEL Designer 06/29/2006 Checked DRAWING MSM6250A NAME Approved DRAWING LG Electronics Inc. Rev_1.0 LG(42)-A-5505-10:01 LG Electronics Inc. - 136 -...
  • Page 136 NC85 NC25 NC86 NC26 NC87 NC27 NC88 NC28 NC89 NC29 NC90 Section Date Sign & Name Sheet/ Sheets MODEL 06/29/2006 Designer Checked DRAWING MEMORY & SIM NAME Approved DRAWING LG Electronics Inc. Rev_1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 137 -...
  • Page 137 USB_VBUS USB_VBUS_IN VBATT ENZY0014301 HSBC-3P-23 PS_HOLD VBAT_SENSE BATT_FET_N C444 Section Date Sign & Name Sheet/ Sheets MODEL Designer 06/29/2006 Checked DRAWING PMIC & LDO & I/O NAME Approved DRAWING Rev_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 138 -...
  • Page 138 R519 Checked HPH_L DRAWING SPK_RCV- SPK_RCV+ COM2 RCV- CAM & LCD & AUDIO R525 NAME SPK_AMP_EN _SHDN SPK_RCV+ RCV+ COM1 Approved LOW: SHDN R520 8200p RCV_EN C526 C527 DRAWING Rev_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 139 -...
  • Page 139 KEY_ROW(1) KYBD_BACKLIGHT KEY_COL(4) KEY_ROW(2) 100ohm R633 KEY_COL(3) KEY_COL(5) KEY_COL(2) KEY_COL(1) KEY_COL(0) Section Date Sign & Name Sheet/ Sheets MODEL Designer 06/29/2006 Checked DRAWING KEY & OTHER NAME Approved DRAWING Rev_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 140 -...
  • Page 140 VA108 VA109 EVLC14S02050 EVLC14S02050 EVLC14S02050 VISION MARK TP100 TP101 TP102 TP103 Section Date Sign & Name Sheet/ Sheets MODEL L601I 12/23 Designer 2005 Checked DRAWING LCD_FPCB NAME Approved DRAWING LG Electronics Inc. Rev_A LGIC(42)-A-5505-10:01 LG Electronics Inc. - 141 -...

  • Page 141: Pcb Layout

    8. PCB LAYOUT - 142 -...
  • Page 142 8. PCB LAYOUT - 143 -...
  • Page 143 8. PCB LAYOUT - 144 -...
  • Page 144 8. PCB LAYOUT - 145 -...
  • Page 145 - 146 -...

  • Page 146: Calibration & Rf Auto Test Program

    9. Calibration & RF Auto Test Program 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory CM_GSM_3G Common dll_serialat LG_CL_009.dll At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV6275.dll Diag_NV.dll DLL_E5515CD.DLL DLL_PwrControlD.dll Dll_SerialATD.dll LG_CL_009.dll PwrSupply_Cmd.xml L601i Debug Auto L601i CalAuto L601i : Directory : File - 147 -...
  • Page 147 9. Calibration & RF Auto Test Program Hot_Kimchi Debug image ComLMPLib_11.dll Dll_EzLooksMQ_004.dll GuiTk115d.dll HK_25.exe ijl11.dll SBCmd.xml ShieldBox_DllD.dll Model L601i LG_RfTest_E5515C_106.dll AutoSetup_100.xml Cal_Setup_Test.xml dacTable.cfg Ezlooks.xml LG_RfCal_Q3G6250_009.dll Procedure_U300_101.xml : Directory script_auto_002.xml : File script_cal_001.xml Spec_U300_100.xml - 148 -...
  • Page 148 9. Calibration & RF Auto Test Program (Win98)MFCD DLL COPY.bat (Win2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.DLL MFCD42D.DLL MFCN42D.DLL MFCO42D.DLL MSVCP60D.DLL MSVCRTD.DLL Vsflex7L.ocx vsflex7l_ocx_regist.bat Result Auto L601i L601i CalAuto L601i image result.bmp LG_UI_Ad6500_002.dll : Directory LG_UI_EmU400_001.dll : File LG_UI_Qu6250_003.dll LG_UI_Qu6275_003.dll - 149 -...

  • Page 149: How To Use Hot Kimchi

    9. Calibration & RF Auto Test Program 9.2. How to use HOT KIMCHI * Flow 1. Click “Logic Operation” of “SETTING” menu bar 2. Select “UART Port” that PC can communicate with the phone 3. Select “LOGIC MODE” that you want - Logic Mode ->...
  • Page 150 9. Calibration & RF Auto Test Program Click "Start" Select "L601i" * Flow 4. Select the model name “L601i” 5. Click “Start” button - 151 -...
  • Page 151 - 152 -...

  • Page 152: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 22 23 77 26 27 29 30 31 32 34 35 15 16 17 19 20 21 10 11 12 13 63 64 65 66 43 44 59 60 55 56 57 58 67 68 70 71 72 73 74 - 153 -...
  • Page 153 - 154 -...

  • Page 154: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT,FOLDER TIFF0014501 Black DEEP AAAY00 ADDITION AAAY0177201...
  • Page 155 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MDAE00 DECO,FOLDER(UPPER) MDAE0036001 MOLD, PMMA HI855M, , , , , Black MCJJ00 COVER,FOLDER(UPPER) MCJJ0042901 MOLD, PC LUPOY SC-1004ML, , , , , Black DARK MDAM00 DECO,WINDOW(SUB) MDAM0007401 PRESS, STS, , , , ,...
  • Page 156 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MPBT00 PAD,CAMERA MPBT0028801 COMPLEX, (empty), , , , , Color Without MWAE00 WINDOW,CAMERA MWAE0016801 MOLD, PC LUPOY SC-1004ML, , , , , Color AWAB00 WINDOW ASSY,LCD AWAB0022701 MAIN...
  • Page 157 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MLAB00 LABEL,A/S MLAB0002701 COMPLEX, (empty), , , , , Color Without MLAB01 LABEL,A/S MLAB0002801 COMPLEX, (empty), , , , , Color Without MLAC00 LABEL,BARCODE MLAC0006501 COMPLEX, (empty), , , , , Color...

  • Page 158: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark CMOS ,MEGA ,1.3M, OVT(OV9655) 1/4", 8*7.95*5.9t, SVCY00 CAMERA SVCY0011501...
  • Page 159 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark PCB ASSY,MAIN,SMT SAFC00 SAFC0072601 BOTTOM C100 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C102 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C105 CAP,CHIP,MAKER ECZH0000841...
  • Page 160 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C143 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C144 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C145 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C146 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C148 CAP,CHIP,MAKER ECZH0000813...
  • Page 161 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C181 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C182 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C183 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C184 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 162 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C216 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C217 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C218 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C219 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C220 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C221 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 163 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C302 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C303 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C304 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C305 CAP,CHIP,MAKER ECZH0004402...
  • Page 164 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C425 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C426 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C427 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C428 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 165 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C513 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP C514 CAP,TANTAL,CHIP ECTH0004801 10 uF,6.3V ,M ,STD ,1608 ,R/TP C515 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C516 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 166 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , D400 DIODE,SWITCHING EDSY0011901 IR=30uA(VR=10V) EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , D401 DIODE,SWITCHING EDSY0011901 IR=30uA(VR=10V) EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , D402 DIODE,SWITCHING EDSY0011901...
  • Page 167 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 1950 MHz,2140 MHz,1.5 dB,2.3 dB,45 dB,35 FL509 DUPLEXER,IMT SDMY0001002 dB,3.8*3.8*1.1 ,SMD ,SAW J300 CONN,SOCKET ENSY0001602 6 PIN,ETC ,5 IRECTIONAL ,2.54 mm,K(GC200) L101 INDUCTOR,CHIP ELCH0005020 1 nH,S ,1005 ,R/TP , L102 INDUCTOR,CHIP ELCH0004721...
  • Page 168 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L501 INDUCTOR,CHIP ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE L502 INDUCTOR,CHIP ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE L503 INDUCTOR,CHIP ELCH0001034 3.3 nH,S ,1005 ,R/TP ,PBFREE L505 INDUCTOR,CHIP ELCH0005005...
  • Page 169 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R130 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP R131 RES,CHIP ERHY0000104 49.9 ohm,1/16W,F,1005,R/TP R132 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP R133 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP R135 RES,CHIP,MAKER ERHZ0000318...
  • Page 170 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R402 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R403 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R404 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R405 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP...
  • Page 171 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R519 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R520 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R521 RES,CHIP,MAKER ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP R523 RES,CHIP ERHY0003201 1000 ohm,1/16W ,F ,1005 ,R/TP...
  • Page 172 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz, U103 EXSC0009201 1710MHz ~ 1910MHz, 14pin COUPLER,RF -18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~ U105 SCDY0003403 DIRECTIONAL 1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP 4-Bump micro SMD ,4 PIN,R/TP ,RF POWER DETECTOR U106 EUSY0186101...
  • Page 173 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA507 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA600 VARISTOR SEVY0000702 14 V,10% ,SMD , VA601 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA602 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA603...
  • Page 174 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark BLUE ,1608 ,R/TP , ,; ,BLUE ,2.7~3.1 ,5mA , , ,62mW LD608 DIODE,LED,CHIP EDLH0008502 ,[empty] ,[empty] ,2P BLUE ,1608 ,R/TP , ,; ,BLUE ,2.7~3.1 ,5mA , , ,62mW LD609 DIODE,LED,CHIP EDLH0008502...

  • Page 175: Accessory

    SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,860 mAh,1 CELL,PRISMATIC ,LG-L601i BATTERY PACK,LI- SBPP00 SBPP0017101 BATTERY(I/P), NTT, Pb-Free , , , , ,PRISMATIC , , ,SILVER , POLYMER - 176 -...
  • Page 176 Note...
  • Page 177 Note...

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