LG U300 Service Manual
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LG U300 Service Manual

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Service Manual
U300/U300C
Date: June, 2006 / Issue 1.0

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Summary of Contents for LG U300

  • Page 1 Service Manual U300/U300C Date: June, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    3.8 Subsystem(MSM6250A) ......37 8. pcb layout ........150 3.9 External memory interface .....40 3.10 H/W Sub System........51 9. Calibration ........155 3.11 U300 (TWEETY) Main features ...64 9.1 HOT KIMCHI........155 9.2 How to use HOT KIMCHI.....156 4. TROUBLE SHOOTING ....70 4.1. RF Component........70 10.
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Folder Handset Size 96 X 49.7 X 21.9 mm Weight 93 g (with 800mAh Battery) Power 4.0V normal, 800 mAh Li-Polymer Talk Time Over 175 min (WCDMA, Tx=12 dBm, Voice) (with 800mAh) Over 220 min (GSM, Tx=Max, Voice) Standby Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 4.0 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V] -20 ~ +60 °C Operation Temp -20 ~ +70 °C Storage Temp Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ.
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Maximum Output Power Class3: +24dBm(+1/-3dB) Class 4 : +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*:additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5%(>-20dBm)
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by(BT Off condition) Voice Call Under 4.0 mA Under 355 mA Under 480mA WCDMA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) Under 3.6 mA (Paging=9period) Under 285 mA Under 5.3 mA (Tx=Max) (@Bluetooth Connected, Paging=9period) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Off) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification ± Sending Loudness Rating (SLR) 3 dB ± 3 dB Receiving Loudness Rating (RLR) ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Idle Noise-Sending (INS) -64 dBm0p Under -47 dBPA Idle Noise-Receiving (INR)

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 600 mA • Normal Battery Capacity : 800 mAh • Charging Time : Max 3 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The U300 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSKmodulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of U300 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).
  • Page 18 3. TECHNICAL BRIEF U300 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode U300’s receiver functions are split between the two RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
  • Page 20 3. TECHNICAL BRIEF The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections.
  • Page 21 3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250A IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.
  • Page 22 3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.

  • Page 23: Wcdma Mode

    3. TECHNICAL BRIEF 3.3 WCDMA Mode 3.3.1 Receiver The UMTS duplexer receiver output is routed to LNA circuits within the RFR6250 IC. The LNA gain is dynamically controlled by the MSM6250A IC to cover full receiver dynamic range and to save current consumption. The UMTS LNA output is routed to the down conversion mixer inputs, in the RFR6250 IC, through a band selection filter that transforms a single-ended 50-Ω...
  • Page 24 3. TECHNICAL BRIEF Figure 3.3.1-1 RFR6250 IC functional block diagram - 25 -...
  • Page 25 The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in U300 is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 26: Lo Phase-Locked Loop

    AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in U300). The 27 pF capacitor should be used to ACcouple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
  • Page 27 3. TECHNICAL BRIEF Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked.

  • Page 28: Off-Chip Rf Components

    A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: - Insertion loss . this component is also in the receive and transmit paths; In the U300 typical losses: UMTS Tx = 1.3 dB, UMTS Rx = 1.7 dB.
  • Page 29 3. TECHNICAL BRIEF - Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances.
  • Page 30 This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the U300. 3.5.5 Dual band GSM power amplifier (U102) The RF3166 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range.
  • Page 31 3. TECHNICAL BRIEF 3.5.6 GSM transmit VCO (U103) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 32 The MSM6250A includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.5.12-1 shows the bluetooth system architecture in the U300. Figure 3.5.9-1 Bluetooth system architecture - 33 -...

  • Page 33: Digital Baseband (Dbb/Msm6250A)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband (DBB/MSM6250A) 3.6.1 General Description A. Features (MSM6250A) • The ARM926EJ-S microprocessor can operate at up to 180 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...

  • Page 34: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture USIM PM6650-2 Receptacle Receptacle BLUETOOTH GSM TX SPEAKER Quadband Quad TX VCO RECEIVER GSM RX SP7T 900/1800/1900 RTR6250 RX FILTER MSM6250A JACK(12pin) WCDMA TX 1.3M UMTS CAMERA UMTS FILTER MAIN WCDMA RX UMTS FILTER SDRAM + RFR6250 NAND...
  • Page 35 3. TECHNICAL BRIEF 3.7.1 Block Diagram (MSM6250A) HK ADC USB I/F 19.2M UART General Purpose GSM/ UMTS GPRS NAND & Processor SDRAM Tx/Rx I/Q Tx/Rx I/F SBI for PM6650 Speaker VOCODER CODEC Receiver SBI for RF IC USIM J-TAG I/F Controller Figure.

  • Page 36: Subsystem(Msm6250A)

    3. TECHNICAL BRIEF 3.8 Subsystem(MSM6250A) 3.8.1 ARM Microprocessor Subsystem The MSM6250A device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650-2 devices.
  • Page 37 3. TECHNICAL BRIEF 3.8.4 RF Interface The RF interface communicates with the mobile station’s external RF and analog baseband circuits. Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference. 3.8.5 Serial Bus Interface (SBI) The MSM6250A device’s SBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6250, RFR6200, RFL6200, and PM6650 ASICs.
  • Page 38 3. TECHNICAL BRIEF 3.8.9 General-Purpose Input/Output Interface The MSM6250A device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and UART interface. 3.8.10 General-Purpose Input/Output Interface The MSM6275 device has general-purpose bidirectional input/output pins.

  • Page 39: External Memory Interface

    • 1-CS(Chip Select) are used Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY90009800COGG Toshiba 35 ns/Bytes 50 ns/Bytes SDRAM TY90009800COGG Toshiba 107 ns/4Double Word 53 ns/4Double Word Table External memory interface for U300 - 40 -...
  • Page 40 3. TECHNICAL BRIEF 3.10 H/W Sub System 3.10.1 RF Interface A. RTR6250 (WCDMA_Tx, GSM_Tx/Rx) MSM6250A controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PAON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for T/Rx of RF •...
  • Page 41 3. TECHNICAL BRIEF B. RFR6250(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. the others • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset D. the others • GSM_PA_BAND : DCS/GSM Band Selection of Power Amp •...
  • Page 42 3. TECHNICAL BRIEF 3.10.2 MSM Sub System 3.10.2.1. SIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_RST_N: USIM Reset • USIM_DATA : USIM Data T/Rx USIM CLK VREG_USIM 2.85V USIM CLK USIM Reset...
  • Page 43 Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6250A. U300’s USB interface uses the PM6650-2 internal logic for USB Transceiver.
  • Page 44 3. TECHNICAL BRIEF 3.10.2.4. HKADC(House Keeping ADC) The MSM6250A device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250A device has six analog input pins which are multiplexed to the input of the internal HKADC. Figure.
  • Page 45 3. TECHNICAL BRIEF 3.10.3 Power Block 3.10.3.1. General MSM6250A, included RF, is fully covered by PM6650-2(Qualcomm PMIC). PM6650-2 cover the power of MSM6250A, MSM memory, RF block, Bluetooth, Trans flash, USIM and TCXO. Major power components are : PM6650-2(U401) : Phone power supply BH28FB1WHFV(U400) : LCD Power supply QST4(Q400,Q401) : External charger supply switching SI3493DV(Q402) : Main Battery charging control...
  • Page 46 3. TECHNICAL BRIEF Figure. PM6650-2 Functional Block Diagram - 47 -...
  • Page 47 3. TECHNICAL BRIEF 3.10.3.3. Charging control A programmable charging block in PM6650-2 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not.
  • Page 48 3. TECHNICAL BRIEF 3.10.3.3.1. Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
  • Page 49 3. TECHNICAL BRIEF 3.10.3.3.2. Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. 3.10.3.3.3.

  • Page 50: H/W Sub System

    3. TECHNICAL BRIEF 3.10.4. Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. °ÆEND’ Key is connected On_SW to PMIC(PM6650-2) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 ROW0 HOT1(VT) HOT2(H3G) HOT3(MENU) CLR (Clear) FUNC_1 Side Key(camera) ROW1...
  • Page 51 3. TECHNICAL BRIEF 3.10.5. Camera Interface U300 Installed a 1.3M Pixel CMOS Camera. Below figure show the camera board to board connector and camera I/F signal. HB-1M1005-600JT CAM_MCLK FB500 VA500 EVLC18S02015 CONNECTOR R500 2.2K VREG_MSMP_2.7V I2C_SCL CN500 14-5602-024-000-829 VA501 R502 2.2K...
  • Page 52 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (AXK7L24227). Its interface is dedicated camera interface port in MSM6250A. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 53 3. TECHNICAL BRIEF 3.10.6 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the halleffect switch, the voltage at pin1 of U600 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to MSM6250A GPIO80.
  • Page 54 3. TECHNICAL BRIEF 3.10.7 Camera Direction Detection CAM_SENSE detects the Camera Direction (front or back) CAM_HALL_IC U501 TK60012BM5 VREG_MSMP_2.7V IO_VDD GND1 GND2 CAM_SENSE C518 Figure Camera Direction Detection - 55 -...
  • Page 55 3. TECHNICAL BRIEF 3.10.8 Keypad Light There is Backlight LED on Top side in board backlight circuit, which is driven by KYPD_BACKLIGHT line from PM6650-2. Key Pad backlight controlled by PM6650-2. Figure. Backlight LED - 56 -...
  • Page 56 3. TECHNICAL BRIEF 3.10.9 LCD Module Vibrator MAIN Receiver Back LOUD SPK Light MODULE LOUD SPK Figure. LCD Module Block Diagram MAIN LCD MODULE SUB LCD MODULE 260K Color TFT 65K Color TFT 176 * 220 Pixel (260K Color support) 96 * 96 Pixel HD66784(RENESAS) Graphic Controller Driver Main &...
  • Page 57 3. TECHNICAL BRIEF 3.10.9.1. Display & LCD FPC Interface LCD module is connected to Main board with 50-pin BtoB connector (CN600_AXT450164) and Speaker, Receiver, Vibrator are connected by soldering the leads to pads in LCD FPCB module. The LCD is controlled by 16-bit EBI2 in MSM6250A. 1 : NC 26 : KEY_ROW(3) : MOD_KEY 2 : VCC_2.8V : LCD Power...
  • Page 58 3. TECHNICAL BRIEF 3.10.10 Audio and Sound 3.10.10.1. Overview of Audio & Sound path Head SUB bíd Conn. Jack Head_Set LCD Conn Module Receiver MSM6250A (U201) LCD Conn Module Mono Speaker Head SUB bíd Head_set MIC Conn. Jack Figure. Audio & Sound Path Block Diagram - 59 -...
  • Page 59 3. TECHNICAL BRIEF 3.10.10.2. Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250A).
  • Page 60 3. TECHNICAL BRIEF MSM6250A Block MIC_Feedback MIC2N C201 MIC2P C202 AUDIO Near to MSM MICFBP MICINN C204 0.1u C205 0.1u R202 MICOUTP 180K C206 0.015u R204 470K C216 0.015u Near to MSM C217 0.1u C218 0.1u R207 MICOUTN 180K MICINP MICFBN Head Set Jack Block VREG_MSMP_2.7V...
  • Page 61 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS C519 C526 SP0102BE3 U502 C527 MIC1N C528 MIC1P C534 C535 Audio Amp for loud Speaker R624 RCV- Audio AMP R623 RCV+ R524 R525 C539 L500 R621 C537 0.1uF C538 R527 3.9K MID_SPK- COM2 SPK+ L501...
  • Page 62 3. TECHNICAL BRIEF 3.10.11 Trans Flash MSM6250A BLK BT_CLK BT_CLK_GPIO[25] BT_SBST BT_SBST_GPIO[24] BT_SBCK BT_SBCK_GPIO[23] BT_SBDT BT_SBDT_GPIO[22] BT_TX_RX_N BT_TX_RN_N_GPIO[21] BT_DATA BT_DATA_GPIO[20] BLUETOOTH C251 0.1u USIM PMIC MicroSD CAMERA Trans Flash BLK T-FLASH SOCKET <= from PM6650-2 VREG_MMC_3.0V R900 S900 500873-0802 DAT2_RSV CD_DAT3_CS MMC_CD CMD_DI...

  • Page 63: U300 (Tweety) Main Features

    3. TECHNICAL BRIEF 3.11 U300 (TWEETY) Main features 1. LG-U900(HERCULES) Main features - Folder Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Tri-mode - Dual LCD (Main: 260K color TFT, Sub: mono STN) - 1.3M Pixel CMOS VGA Camera - φ17 mono speaker...
  • Page 64 3. TECHNICAL BRIEF 2. U300 Main Components SUB Top Side MAIN Bottom Side MAIN Top Side SUB Bottom Side 1.3M Camera Module U300 LCD & Folder Assy. Stereo Headset - 65 -...
  • Page 65 3. TECHNICAL BRIEF 2.1. Main Top Side U402 U504 U503 U600 U501 CN600 Dome Sheet Reference Description Reference Description U402 TCXO BT Buffer U504 Audio Amplifier U600 Folder close(Flip) detection IC U503 Analog Switch U501 Camera Rotation Sensor Dome Sheet CN600 Volume Side Key, Camera hot side key...
  • Page 66 3. TECHNICAL BRIEF 2.2. Main Bottom Side CN501 CN602 CN500 CN601 U500 X200 U401 U201 X400 U401 J300 X100 CN502 U103 U105 U101 U102 FL104 Q400,Q401 U100 U502 Q402 IS100 CN503 U104 U403 - 67 -...
  • Page 67 3. TECHNICAL BRIEF 2.2. Main Bottom Side (continued) Reference Description Reference Description CN501 Headset connector (female) U403 Antenna CN500 Camera Connector CN602 LCD Module Connector CN601 Board to Board Connector U500 Charge Pump with LDO USB Crystal U401 512M NAND + 512M SDRAM X200 X400 Sleep crystal(32.768KHz)
  • Page 68 3. TECHNICAL BRIEF 2-3. SUB Bottom Side ANT900 S900 U900 BAT900 U901 2-4. SUB Top Side CN900 Reference Description Reference Description S900 Trans Flash Socket ANT900 Bluetooth Antenna U900 TVS for Trans flash data signal BAT900 Back Up battery U901 Bluetooth Module CN900 20 pin connector for MAIN PCB...

  • Page 69: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1. RF Component FL104 X100 U105 U104 IS100 SW100 U101 U100 ANT100 ANT102 U103 U102 RF component (Bottom) Reference Description Reference Description X100 VCTCXO(19.2MHz) FL104 WCDMA Duplexer U105 WCDMA Receiver IC(RFR6250) U104 WCDMA PAM U101 GSM/WCDMA Transceiver IC IS100...

  • Page 70: Signal Path

    4. TROUBLE SHOOTING 4.2. SIGNAL PATH WCDMA Tx PATH WCDMA Rx PATH GSM Tx PATH DCS/PCS Tx PATH GSM Rx PATH DCS Rx PATH PCS Rx PATH - 71 -...

  • Page 71: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX part, GSM part and BB part. - 72 -...
  • Page 72 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) C152 1000p C161 X100 TCXO_PM 100p DSA321SC-19.2M R128 TRK_LO_ADJ VCONT TCXO_BT_IN VREG_TCXO_2.85V C162 0.01u C163 C164 19.2MHz 1000p 0.1u C167...
  • Page 73 4. TROUBLE SHOOTING Check TP1 VCC of VCXO ≥ 2.8V Check PMIC Check TP2 TRK_LO_ADJ ≥ ≥ 3V Voltage 0V Check MSM Check TP3,4,5 With Oscilloscope Check soldering ≥ ≥ 3V Voltage 0V and components VCXO is OK Check other part - 74 -...

  • Page 74: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block ANT_SEL0 ANT_SEL2 ANT_SEL1 VREG_RFRX_0_2.85V Antenna Switch Block(Bottom) L101 VREG_RFRX_0_2.85V 7.5nH C102 C103 0.1u R101 ANT_SEL0 R102 ANT_SEL1 R103 ANT_SEL2 GND6 GND1 GND5 U100 GND4 GND2 CXG1190AEQ Schematic of the Antenna Switch Block - 75 -...
  • Page 75 4. TROUBLE SHOOTING Logic Table of the Antenna Switch Mode ANT_SEL0 ANT_SEL1 ANT_SEL2 EGSM TX High High EGSM RX High DCS/PCS TX High DCS RX High High PCS RX High UMTS High High Checking Switch Block power source - 76 -...

  • Page 76: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block - 77 -...
  • Page 77 4. TROUBLE SHOOTING - 78 -...
  • Page 78 4. TROUBLE SHOOTING 4.5.1. Checking VCXO Block Refer to 3.3 4.5.2. Checking Ant. SW module Refer to 3.4 4.5.3. Checking RF TX Level Test Point (RF TX Level) - 79 -...
  • Page 79 4. TROUBLE SHOOTING ANT100 ANT101 ANT102 L101 VREG_RFRX_0_2.85V 7.5nH SW100 C102 C103 C199 0.1u 6.8p KMS-512 C101 L104 0.75p 8.2nH R101 ANT_SEL0 C106 R102 ANT_SEL1 R103 ANT_SEL2 GND6 GND1 GND5 U100 GND4 GND2 CXG1190AEQ C151 RF5198 C150 SMPY0009601 1000p C153 L124 4.7u VREG_W_PA...
  • Page 80 4. TROUBLE SHOOTING For testing, Max power output is needed. Set the Phone Tx is ON and PDM is 450 Check TP1 RF Tx Level is OK Over 21dBm ? Check TP2 Check FEM Over 19dBm ? Check TP3 Check Duplexer Over 16dBm ? Check TP4 Check PAM Block...
  • Page 81 4. TROUBLE SHOOTING 4.5.4. Checking PAM Block PAM IN/OUT Signal PAM_IN PAM_OUT PAM OUT must be over 16dBm PAM IN must be over -5dBm - 82 -...
  • Page 82 4. TROUBLE SHOOTING 4.5.5. Check RF Rx Level Test Point (RF Rx Level) - 83 -...
  • Page 83 4. TROUBLE SHOOTING ANT100 ANT101 ANT102 L101 VREG_RFRX_0_2.85V 7.5nH SW100 C102 C103 C199 L128 0.1u 6.8p KMS-512 C101 L104 4.7nH 0.75p 8.2nH FL105 R101 L129 C106 ANT_SEL0 R102 ANT_SEL1 B7827 10nH R103 ANT_SEL2 R134 C170 C168 C174 GND6 GND1 L130 L131 10nH GND5...
  • Page 84 4. TROUBLE SHOOTING Set the Phone Rx is ON Check bias1 Check bias block Over 2V ? soldering Check TP1 Check RF s/w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Duplexer Signal exist? Check TP4 Check RFR6250 Signal exist? Change the board - 85 -...

  • Page 85: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6 Checking GSM Block - 86 -...
  • Page 86 4. TROUBLE SHOOTING 4.6.1 Checking VCO Block Test Point (TXVCO Level) 925-960 MHz GSM_PA_EN GSM1800_INN L119 9.1nH GSM1800_INP VDDA10 L120 10nH GSM900_INP GSM900_INN R110 VDDA11 TX_MOD_CP R111 VREG_RFTX_2.85V R115 C124 C125 C126 VDDA12 (PPS) 120p 1000p C129 R116 (2012) TX_VCO_FB 0.1u C118 C119...
  • Page 87 4. TROUBLE SHOOTING - 88 -...
  • Page 88 4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 3.4 4.6.3 Checking RF Tx level Test Point (RF Tx Level) 1P7T SWITCH ANT_SEL0 ANT_SEL1 ANT_SEL2 GSM 900 TX GSM 1800/1900 TX GSM1800 RX GSM1900 RX GSM 900 RX ANT100 ANT101 ANT102...
  • Page 89 4. TROUBLE SHOOTING - 90 -...
  • Page 90 4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.
  • Page 91 4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block Test Point (RF Rx Level) FL100 L102 2.7nH SAFEB1G96FA0F00 L106 3.6nH C105 1000p 1930-1990 MHz L108 3.6nH PCS RX L110 2.7nH FL101 L111 5.6nH SAFEB1G84FA0F00 L112 7.5nH C108 1000p 1805-1880 MHz L114 7.5nH DCS RX L116 5.6nH...
  • Page 92 4. TROUBLE SHOOTING - 93 -...

  • Page 93: Bluetooth Rf Block

    4. TROUBLE SHOOTING 4.7 Bluetooth RF Block TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode : Enter Test Mode(277634#*#) -> Module Test Set -> BT DUT -> BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4.
  • Page 94 4. TROUBLE SHOOTING Test Point (Bluetooth Block ) BLUETOOTH KYOCERA ANT900 FEED SNGF0016501 R904 L900 C901 U901 SMZY0009501 C902 1000p BT_CLK CLK_REF SBST BT_SBST SBCK BT_SBCK VREG_MSMP_2.7V VDD_MSM SBDT BT_SBDT SYNC_DET_TX_EN BT_TX_RX_N VREG_BT_2.85V VDD_A RX_BB_TX_BB BT_DATA C904 1000p C908 C909 LDO1 XTAL_IN TCXO_BT...
  • Page 95 4. TROUBLE SHOOTING - 96 -...

  • Page 96: Power On Trouble

    4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.8 Power ON Trouble Power On sequence of U300 is : PWR(END) key press → PM_ON_SW_N go to low(D601),PM6650-2 KPDPWR_N pin(24) → PM6650-2 Power Up → VREG_MSMC_1.250V(C436), VREG_MSME_1.8V(C437), VREG_MSMP_2.7V(C428) VREG_MSMA_2.6V(C424), VREG_TCXO_2.85V(C418) power up and system reset assert to MSM →...
  • Page 97 4. TROUBLE SHOOTING VREG_MSMC_1.25V VREG_MSME_1.8V MSM6250A PM6650-2 VREGC_MSMP_2.7V VREGC_MSMA_2.6V 32.768KHz VREG_TCXO_2.85V 19.2MHz(R411) 19.2MHz (C438) - 98 -...

  • Page 98: Usb Trouble

    4. TROUBLE SHOOTING 4.9. USB Trouble USB Initial sequence of U300 is : USB connected to U300 → USB_VBUS(U403 Pin_4) go to 5V → USB_D+(U403 Pin_1) go to 3.3V → 48M Crystal on → USB work. Start Cable insert Cable is insert?

  • Page 99: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.10 SIM Detect Trouble USB Initial sequence of U300 is : VREG_USIM_2.85V(C433 of PM6650-2) go to 3.0V → USIM_CLK,USIM_RST,USIM_DATA triggered → USIM IF work(Schematic and place are refer to SIM technical brief) Start Re-insert the SIM card...

  • Page 100: Key Sense Trouble

    4. TROUBLE SHOOTING 4.11 Key Sense Trouble Key Sense sequence of U300 is : Default condition ROW(0-4) is 2.7V → Press the key → Corresponding row(x) and col(x) go to 0V → Key sensing Start Change the side key Work well?

  • Page 101: Camera Trouble

    4. TROUBLE SHOOTING 4.12 Camera Trouble Camera control signals are generated by MSM6250A and directly connected with MSM6250A. Start Check the camera conn. and reconnect the camera Camera is OK? Check VREG_CAM_2.7V, Change the U500 VREG_CAM_1.8V Check the DSP_CLK Change the Main board (FB500) Change the camera Camera is OK?

  • Page 102: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.13 Main LCD Trouble Main LCD control signals are generated by MSM6250A. Those signal’s path are : MSM6250A → MAIN B’d → CN602 → LCD FPCB and LCD Module START Press END key to turn the power on Follow the Power ON Is the circuit powered? trouble shooting...
  • Page 103 4. TROUBLE SHOOTING LCD Control data flow LCD Module 40pin LCD connector CN600(50pin LCD connector) - 104 -...

  • Page 104: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.14 Folder ON/OFF Trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event → Flip(U600 pin 1) is triggered(Open : about 2.6V, Close : 0V) → MSM6250A Sense the Folder Flip Event. Sensing signal is directly connected to MSM6250A. Start Check the magnet in Insert the magnet...

  • Page 105: Camera Direction Detection Trouble

    4. TROUBLE SHOOTING 4.15 Camera Direction Detection Trouble Camera direction detection is worked as below : Camera direction change Event → CAM_SENSE(U501 pin out) is triggered as this (Cam front side view : 0V, Cam back side view : about 2.5V) → MSM6250A Sense the Camera direction change Event Start Check the magnet in the mechanics of camera module...

  • Page 106: Trans Flash Trouble

    4. TROUBLE SHOOTING 4.16 Trans Flash Trouble Trans Flash is worked as below : Trans Flash insertion → VREG_MMC_3.0V is 3.0V → MMC_CD go to High → Trans Flash Insertion detecting by MSM6250A → go working Start Check the B-to-B connector for SUB PCB Insert the Trans Flash Card Trans Flash insertion...

  • Page 107: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.17 Audio Trouble Shooting 4.17.1 Receiver Path Voice Receiver path as below: MSM6250A Ear1ON/Ear1OP → R623,R624 → U503(Speaker/receiver switch) → L500, L501 → CN602(b’d to b’d connector for LCD Module) → LCD b’d to b’d connector of LCD FPCB → LCD module →...
  • Page 108 4. TROUBLE SHOOTING Speaker Speaker soldering point FPCB for LCD Module CN602(50pin LCD connector) U503(Speaker/receiver switch) L500,L501 (audio signal serial bead) - 109 -...
  • Page 109 4. TROUBLE SHOOTING 4.17.2 Voice and Sound Path for Headset Voice and Multimedia Sound path for Head_Set as below: MSM6250A HPH_R, HPH_L → C515, C516 → CN501 headset Jack pin 4,5 Start Connect the phone to network Equipment and setup call Setup 1KHz tone out And insert head_Set Headset insertion detection...
  • Page 110 4. TROUBLE SHOOTING CN501 C515,C516 - 111 -...
  • Page 111 4. TROUBLE SHOOTING 4.17.3 Loud Speaker path (voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6250A AUXOP_AUXOL, AUXOP_AUXOR → C537,C543 → R527,R534 → U504(amp) → U503(Receiver/Speaker switch) → L500, L501 → CN602 → LCD FPCB → Speaker Start Connect the phone to network Equipment and setup call...
  • Page 112 4. TROUBLE SHOOTING Speaker Speaker soldering point FPCB for LCD Module CN602(50pin LCD connector) R527, R534 (audio signal serial resistor) C537, C543 (audio signal serial capacitor) U503(Speaker/receiver switch) U504 (Audio AMP) L500,L501 (audio signal serial bead) - 113 -...
  • Page 113 4. TROUBLE SHOOTING 4.17.4 Microphone for Main MIC Main Microphone path as below: MIC → C527,C528 → MSM6250A → MIC feedback gain logic → MSM internal CODEC MIC2N C201 MICBIAS MIC2P C519 C526 C202 AUDIO Near to MSM SP0102BE3 U502 C527 MIC1N C528...
  • Page 114 4. TROUBLE SHOOTING U502 (MIC for Handset) MICBIAS C519 C526 SP0102BE3 U502 C527 MIC1N C528 MIC1P C534 C535 - 115 -...
  • Page 115 4. TROUBLE SHOOTING 4.17.5 Microphone for Headset MIC for Head_Set path as below: Insert Headset → EAR_SENSE_N(pin6) goes 0V → MSM6250A sense Head_Set insertion → MIC signal goes to MSM(C201, C202) VREG_MSMP_2.7V MIC2N C513 C201 MIC2P R507 VREG_MSMP_2.7V VREG_MSMP_2.7V C202 2.2K R510 CN501...
  • Page 116 4. TROUBLE SHOOTING C201,C202 for MIC capacitor - 117 -...

  • Page 117: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.18 Charger Trouble Shooting Charging Current Flow USB Cable USB_VBUS (5.0V) Pass control Tr (ON) USB Charging control USB_CNT_N +5V_PWR (4.6V) Pass control Tr (ON) TA Charging control CHG_CNT_N Charging current ICHARGE sensing ICHARGEOUT 4.2~4.25V +VPWR VBATT Main Battery Battery FET...
  • Page 118 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA voltage 4.6V? Change TA/USB cable Is the USB voltage 5.0V? Check the Q400,Q401,Q402 Charging OK? Change the board - 119 -...
  • Page 119 4. TROUBLE SHOOTING Q400 Q401 Q402 VBATT - 120 -...

  • Page 120: Download

    LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 8 handsets at the same time.
  • Page 121 5. DOWNLOAD 5.2.1 Connecting to PC • Choose desired country and then click on the OK button. Once the desired country is selected, the selected country name will be displayed at the bottom of left corner screen. For instance, if the selected country is “Italy”, then LGMDP will operate based on the Italy Setting Values.
  • Page 122 5. DOWNLOAD • Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. The current security status will be displayed under Security column. Make sure that the selected country is valid. If the selected country is invalid, select the country name again.
  • Page 123 5. DOWNLOAD • The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. - 124 -...
  • Page 124 5. DOWNLOAD 1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse...
  • Page 125 5. DOWNLOAD 5.2.2 Choosing image files • Select the image folder, where all the image files are located, by clicking on the Browse..(The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) •...
  • Page 126 5. DOWNLOAD • Select the path, where Media Image file is located by clicking on the Browse... button. The selected Media image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen the right media image file. •...
  • Page 127 5. DOWNLOAD • Choose a Module Image file after clicking on the Browse... button. The selected Module image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen the right Module image file. •...
  • Page 128 5. DOWNLOAD • If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse... button. •...
  • Page 129 5. DOWNLOAD 5.2.3 Downloading • The following flow chart is whole process for downloading images to the handset. You will see snapshots for each step in the succeeding slides. Download Start (NV Backup) (NV Restore) Erase MEDIA directory Reset Download MEDIA Erase MODULE directory Download MODULE (Erase EFS)
  • Page 130 5. DOWNLOAD • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 131 5. DOWNLOAD • Rebooting the handset and re-establishing the connection • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection. • Rebooting the handset and re-establishing the connection •...
  • Page 132 5. DOWNLOAD • Downloading Media image in progress • Downloading Module image in progress • Downloading process has completed successfully - 133 -...
  • Page 133 5. DOWNLOAD 5.2.4 Tools • Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu. •...

  • Page 134: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error 5.3.1 When the phone does not work • Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images again including AMSS modem, Media, and Module image.
  • Page 135 5. DOWNLOAD • Choose Image file after clicking on the Browse... button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.
  • Page 136 5. DOWNLOAD • Reboot the phone and then re- try to download only the Media and Module images again. Both Media and Module image have to be downloaded at the same time. 5.3.3 NV Restore Error • Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt. - 137 -...
  • Page 137 5. DOWNLOAD • Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) • Click on NV Restore. A list of NV Backup files(*.nv2) will be shown. These files were saved every time NV Backup option was selected.

  • Page 138: Caution

    5. DOWNLOAD • Choose the desired NV file to be downloaded on the handset, and click on Restore. • Snapshot showing the error, Reading the NV file and restore NV. 5.4 Caution 1) Not recommended that multi-downloading using the USB hub. 2) Recommended that the Module and Media Image have to be downloaded at the same time.

  • Page 139: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block Fig 6.1-1 UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 140 -...
  • Page 140 6. BLOCK DIAGRAM - 141 -...

  • Page 141: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram U300 Interface Diagram - 142 -...

  • Page 142: Circuit Diagram

    Checked C184 C188 C189 C186 C187 C185 0.1u R140 0.1u 0.01u DRAWING R141 Approved (RF3166 & RF5198) 3.3K (1%) C190 (PPS) (2012) C191 3.9n 470p R142 4.7K (1%) DRAWING LG Electronics Inc. U300_REV_1.1 LG(42)-A-5505-10:01 LG Electronics Inc. - 143 -...
  • Page 143 AE11 EBI2_ADD[10] BT_SBCK_GPIO[23] BT_SBCK BT_SBDT EBI2_ADD[9] BT_SBDT_GPIO[22] AC11 BT_TX_RX_N EBI2_ADD[8] BT_TX_RN_N_GPIO[21] AA11 BT_DATA EBI2_ADD[7] BT_DATA_GPIO[20] EBI2_ADD[6] BLUETOOTH AC10 EBI2_ADD[5] EBI2_ADD[4] AA10 EBI2_ADD[3] EBI2_ADD[2] EBI2_ADD[1] C251 0.1u U300 J.H.Jang KEYPAD UART USIM PMIC MicroSD CAMERA 07/MAR/2006 MSM6250A U300_REV_1.1 - 144 -...
  • Page 144 SDRAM_DATA(6) SDRAM_ADDR(6) SDRAM_DATA(7) SDRAM_ADDR(7) SDRAM_DATA(8) SDRAM_ADDR(8) SDRAM_DATA(9) SDRAM_ADDR(9) SDRAM_DATA(10) SDRAM_ADDR(10) DQ10 SDRAM_DATA(11) SDRAM_ADDR(11) DQ11 SDRAM_DATA(12) SDRAM_ADDR(12) DQ12 SDRAM_DATA(13) NAND_WP_N DQ13 U300 SDRAM_DATA(14) R303 DQ14 RESOUT_N R302 SDRAM_DATA(15) DQ15 _WEN EBI2_WE_N 100K VREG_MSMP_2.7V SDRAM_DATA(16) SDRAM_RAS_N USIM_P_DATA USIM_P_CLK DQ16 _RAS SDRAM_DATA(17) SDRAM_WE_N...
  • Page 145 PA_FET_N 1000p 4.7u U402 4.7u 1608 TC7S04FU 1608 U403 Q403 Q404 SI8402DB SI8407DB-T2-E1 USB_D- USB_D+ VREG_PA +VPWR C441 USB_VBUS Sheet/ U300 Sheets PLR0504F-P R412 07/MAR/2006 J.W.PARK EDTY0008607 100K R413 PA_FET_N PMIC C442 0.1u U300_REV_1.1 LG Electronics Inc. - 146 -...
  • Page 146 80.6K COM2 VBAT_GND R533 L501 C606 COM1 SPK- U504 LM4898ITLX-NOPB C541 R530 VREG_5V R531 R620 C540 SW_EN U300 BYPASS NLAS4684FCT1G C542 A.S.CHO 07/MAR/2006 U503 SPK_AMP_EN SD_SEL SD_MODE 0.1u R532 100K CAM & AUDIO & I/O R535 R622 C543 0.1uF R534 3.9K...
  • Page 147 LD603 LD601 KEY_COL(4) R610 R611 R612 KEY_COL(3) KEY_COL(2) LD604 LD605 LD606 KEY_COL(1) R613 R614 R615 KEY_COL(0) LD607 LD609 R616 LD608 R617 R618 U300 07/MAR/2006 B.G.KIM KYPD_BACKLIGHT 2006.02.21 Snow White LED KEY & LCD CONN VA619 EVLC14S02050 U300_REV_1.1 - 148 -...
  • Page 148 VREG_MSMP_2.7V VDD_MSM SBDT BT_SBDT SYNC_DET_TX_EN BT_TX_RX_N VREG_BT_2.85V VDD_A RX_BB_TX_BB BT_DATA C904 1000p C908 C909 LDO1 XTAL_IN TCXO_BT C906 C907 C910 C911 0.01u 0.01u LDO2 R911 R912 100K 100K C905 U300 22/MAR/2006 A.S.CHO C903 2.2u SUB B'D U300_REV_1.1 - 149 -...

  • Page 149: Pcb Layout

    8. PCB LAYOUT - 150 -...
  • Page 150 8. PCB LAYOUT - 151 -...
  • Page 151 8. PCB LAYOUT - 152 -...
  • Page 152 8. PCB LAYOUT - 153 -...
  • Page 153 - 154 -...

  • Page 154: Calibration

    9. Calibration 9. Calibration 9.1 HOT KIMCHI 9.1.1 HOT KIMCHI setting files ..\Cal_GSM\Cal_Model\U300 - Directory of Calibration Model Setup_Cal_test.xml: Including WCDMA, GSM, DCS, PCS power tables. At_Serial_Cmd.xml: Serial communication test of AT command. PwrSupply_Cmd.xml: Several kinds of power supply operating command.

  • Page 155: How To Use Hot Kimchi

    9. Calibration 9.2 How to use HOT KIMCHI 9.2.1 Calibration Find model name Apply U300 model - 156 -...
  • Page 156 9. Calibration Check testing object Click Start for Calibration - 157 -...
  • Page 157 9. Calibration Show result of calibration Show result - 158 -...

  • Page 158: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 38 39 40 51 52 53 44 45 46 10 11 12 - 159 -...
  • Page 159 - 160 -...

  • Page 160: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT,FOLDER TIFF0012411 ORANGE AAAY00 ADDITION AAAY0171212 ORANGE...
  • Page 161 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark ACGK00 COVER ASSY,FRONT ACGK0064502 Silver MBJL00 BUTTON,SIDE MBJL0028202 COMPLEX, (empty), , , , , Silver MCJK00 COVER,FRONT MCJK0052301 MOLD, PC LUPOY SC-1004A, , , , , Silver MDAG00 DECO,FRONT...
  • Page 162 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White MLAN00 LABEL,QUALCOMM MLAN0000603 White,95C Transparent MLAZ00 LABEL MLAZ0045501 PRINTING, (empty), , , , , White MLEA00 LOCKER,BATTERY MLEA0033301 MOLD, PC LUPOY SC-1004A, , , , , ORANGE...
  • Page 163 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MSAZ00 SHEET MSAZ0042001 COMPLEX, (empty), , , , , Gray Without MGAD00 GASKET,SHIELD FORM MGAD0118001 COMPLEX, (empty), , , , , Color - 164 -...

  • Page 164: Main Component

    BOARD CONNECTOR,BOARD TO CN101 ENBY0020201 40 PIN,0.4 mm,ETC , ,H=0.9, Header BOARD SPCY00 PCB,FLEXIBLE SPCY0069401 POLYI ,.5 mm,MULTI-6 ,U300 F-LCD SJMY VIBRATOR,MOTOR SJMY0004201 3 V,0.12 A,12*3.4 ,G8000 VIBRATOR SUSY SPEAKER SUSY0018401 ASSY ,8 ohm,91 dB,17 mm, MAIN ,176*220, Sub 96*64(Mono) ,2.0"(35.9*49.2) ,262k...
  • Page 165 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C109 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C110 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C111 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C112 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 166 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C143 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C144 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C145 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C146 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C147 CAP,CHIP,MAKER ECZH0001106...
  • Page 167 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C182 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C183 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C184 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C185 CAP,CERAMIC,CHIP ECCH0000155...
  • Page 168 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C224 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C225 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C226 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C227 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C228 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 169 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C306 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C307 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C308 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C309 CAP,CHIP,MAKER ECZH0004402...
  • Page 170 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C427 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C428 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C429 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C430 CAP,CHIP,MAKER ECZH0000826...
  • Page 171 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C522 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C523 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C524 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C525 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C526 CAP,CERAMIC,CHIP ECCH0000122...
  • Page 172 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FB500 FILTER,BEAD,CHIP SFBH0000909 60 ohm,1005 , FB501 FILTER,BEAD,CHIP SFBH0009801 600 ohm,1005 ,DC Res.0.6ohm, R.C.500mA FB502 FILTER,BEAD,CHIP SFBH0000909 60 ohm,1005 , FL100 FILTER,SAW SFSY0024303 1960 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 FL101 FILTER,SAW SFSY0024302...
  • Page 173 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L116 INDUCTOR,CHIP ELCH0001002 5.6 nH,J ,1005 ,R/TP ,chip inductor PBFREE L117 INDUCTOR,CHIP ELCH0005815 10 nH,J ,1005 ,R/TP ,1005, 10nH,J L118 INDUCTOR,CHIP ELCH0003818 9.1 nH,J ,1005 ,R/TP , L119 INDUCTOR,CHIP ELCH0003818...
  • Page 174 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R103 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R104 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R105 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R106 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R107 RES,CHIP ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP R108 RES,CHIP ERHY0000220...
  • Page 175 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R138 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R139 RES,CHIP ERHY0000214 51 ohm,1/16W,J,1005,R/TP R140 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R141 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP R142 RES,CHIP,MAKER ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP R200...
  • Page 176 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R407 RES,CHIP ERHY0008602 0.1 ohm,1/4W ,J ,2012 ,R/TP R408 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R409 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R412 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R413 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R500...
  • Page 177 QFN ,48 PIN,R/TP ,UMTS-1900/-2100 and GPS RF U105 EUSY0246002 Receiver IC CSP ,409 PIN,R/TP ,WCDMA BASE BAND SLEEP U201 EUSY0279002 CURRENT IMPROVEMENT VERSION U300 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE U301 EUSY0297301 11*14*1.2 ,225 PIN,R/TP ,NAND(90nm), DRAM(90nm) HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT...
  • Page 178 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA515 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA516 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA517 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA518 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...
  • Page 179 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C543 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP C600 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C601 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP L500 FILTER,BEAD,CHIP SFBH0007103...
  • Page 180 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R618 RES,CHIP ERHY0000208 22 ohm,1/16W,J,1005,R/TP R620 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R621 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R622 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R623 RES,CHIP ERHY0000181 15 ohm,1/16W ,F ,1005 ,R/TP R624 RES,CHIP ERHY0000181...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C910 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP C911 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP R900 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R901 RES,CHIP ERHY0000280...

  • Page 182: Accessory

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark ADEY00 DATA KIT ADEY0004101 U900 Data Kit for Hutchison MBAZ00 MBAZ0004702 80mm CD Cover...
  • Page 183 Note...
  • Page 184 Note...

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