LG KU800 Service Manual
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LG KU800 Service Manual

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Service Manual
KU800
11:30
AM
Date: November, 2006 / Issue 1.0

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Summary of Contents for LG KU800

  • Page 1 Service Manual KU800 11:30 Date: November, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......5 4.11 SIM Detect Troubleshooting ....106 4.12 Key Sense Troubleshooting....107 1.1 Purpose........... 5 4.13 Camera Troubleshooting 1.2 Regulatory Information......5 (2M Camera)........108 4.14 Keypad Backlight Troubleshooting ..110 2. PERFORMANCE.......7 4.15 Folder ON/OFF Troubleshooting ..111 2.1 System Overview ........7 4.16 Main LCD Troubleshooting ....112 2.2 Usable environment .........8...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1800/1900 and WCDMA Slide Handset Size 94.6 X 45.6 X 17.1 mm Weight Under 100 g (with 1000mAh Battery) Power 3.7 V normal, 1000 mAh Li-Polymer Talk Time Over 180 min (WCDMA, Tx=10 dBm, Voice) (with 1000mAh) Over 200 min (GSM, Tx=Level 7, Voice) Standby Time...

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), 3.47 V(Min), [Shut Down : 3.4 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ. Unit TA Power Available power * CLA : 12 ~ 24 V(DC)
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Maximum Output Power Class 3 : +24dBm(+1/-3dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by Voice Call Under 3.3 mA Under 333 mA Under 600mA WCDMA (DRX=2.56) (Tx=10dBm) (Tx=10dBm) Under 3.3 mA Under 300 mA Paging=5 period (PCL=7) (Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight Of,Neighbor Cell offf) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change...

  • Page 14: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -4 ± 3 dB Receiving Loudness Rating (RLR) -13 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Idle Noise-Sending (INS) -64 dBm0p Under -47 dBPA...

  • Page 15: Charging

    2. PERFORMANCE 2.8 Charging • Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 800 mA • Normal Battery Capacity : 1000 mAh • Charging Time : Max 3 hours (except for trickle charging time) •...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. RF TECHNICAL BRIEF 3.1 General Description The KU800 supports UMTS-2100, DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900 GSM/GPRS/EGPRS/EDGE. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of KU800 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS dual band operation).
  • Page 18 3. TECHNICAL BRIEF KU800 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

  • Page 19: Gsm Mode

    GSM,DCS,PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In KU800, a common antenna connects to one of four paths : 1) DCS 1800/PCS 1900 RX 2) GSM900 RX 3) GSM 900 TX/ WCDMA 4) DCS 1800 /PCS 1900 TX operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals.
  • Page 20 3. TECHNICAL BRIEF Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers - this is accomplished in the switch module. The GSM900, DCS, and PCS receive signals are routed to the RTR6250 through band selection filters and matching networks that transform single-ended 50-Ω...
  • Page 21 3. TECHNICAL BRIEF 3.2.2. GSM Transmitter The shared GSM Low-band (GSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6275 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSK-modulated signal from IF to RF primarily for two reasons: 1.
  • Page 23 3. TECHNICAL BRIEF Figure 1-3 RFR6250 IC Fuctional block diagram The QUALCOMM RFR6250 IC is a custom GPS/UMTS-band design that meets DSWCDMA dynamic range requirements. The RFR6250 IC accepts its UMTS-1900, UMTS-2100 and GPS input signals from the handset RF front-end filters. Each individual input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter.

  • Page 24: Lo Phase-Locked Loop

    The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in KU800 is “Load Insensitive PA ”- no need to use isolator- and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.
  • Page 25 AC-couple the inactive pin to ground using an appropriately valued capacitor (4 pF is used in KU800). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.
  • Page 26 3. TECHNICAL BRIEF Ultimately the loop forces the error to approach zero and the PLL is phase and frequency locked. Many key PLL performance characteristics are largely determined by the loop filter design - stability, transitory response, settling time, and phase noise. 3.4.2 Transceiver PLL (PLL1) All LO functional blocks for the other handset modes(UMTS Tx, GSM900 Tx/Rx, DCS Tx/Rx, PCS Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 3.4.2-1).

  • Page 27: Off-Chip Rf Components

    A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; -. Insertion loss . this component is also in the receive and transmit paths ; In the KU800 typical losses : UMTS Tx = 1.2 dB, UMTS Rx = 1.6 dB -.
  • Page 28 3. TECHNICAL BRIEF 3.5.3 UMTS Power Amplifier (U1003) • U1003 : WCDMA2100 Power Amplifier module The AWT6277 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset.
  • Page 29 (high peak-torms ratio)signals, such as CDMA,WCDMA and QPSK/QAM based OFDM waveforms. The KU800 uses ADL5500 power detector IC. In Figure 3.5.5-1, Figure3.5.5-2 shows the output voltage versus PA output power of the ADL5500 setup as depicted in Figure3.5.5-1 Figure 3.5.5-1 Block diagram of ADL5500...
  • Page 30 3. TECHNICAL BRIEF Figure 3.5.5-2 Power detector response, Vout vs PA output power 3.5.5 GSM/GPRS/EDGE Power amplifier (U1002 : TQM7M5003) The TQM7M5003 is a small (7x7mm), GSM/EDGE PAM for handset applications. This module has been optimized for excellent EDGE efficiency , ACPR and EVM in an open loop polar modulation environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency.
  • Page 31 3. TECHNICAL BRIEF 3.5.6 GSM transmit VCO (X1000 : MQW6V0C869M) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to Murata MQW6V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 32 3. TECHNICAL BRIEF 3.5.8 VCTCXO (X1001 : TG-5001LA-19.2MHz) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6275 IC. The 6275-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The oscillator frequency is controlled by the MSM6275’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.
  • Page 33 3.5.9 Bluetooth(M1:RB06A,ANT1 : ACS2450HBAKU8 ) The MSM6275 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure3.5.12-1 shows the bluetooth system architecture in the KU800. Figure3.5.12-1 Bluetooth system architecture - 34 -...

  • Page 34: Digital Baseband(Dbb/Msm6275)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband(DBB/MSM6275) 3.6.1 General Description A. Features(MSM6275) • Support for multimode operation - WCDMA(UMTS),GSM/GPRS,EDGE • The ARM926EJ-S microprocessor can operate at up to 225 MHz with variable rate, software controlled clocks to provide greater standby time. •...

  • Page 35: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture (2.0 inch) Camera 2M GSM/ EDGE Camera VGA Q_VCO RTR6250 USIM PCS1900_Rx_SAW TX/RX DCS1800_Rx_SAW & WCDMA GSM900_Rx_SAW WCDMA 1900 Mono Speaker MSM6275 & Earpiece TX_SAW HDET 18PIN VCTCXO Stereo Headset MMI. Memory RFR6250 SDRAM RX_SAW WCDMA NAND Flash...
  • Page 36 3. TECHNICAL BRIEF 3.7.1. Block Diagram(MSM6275) NAND Flash SDRAM 512M 512M (2.0 inch) EBI 1 EBI 2 GSM/GPRS/EDGE Camera 0.3M CAMERA DUAL MEMORY BUS processor PROCESSING (Default 8bit Interface) MSM6275 UMTS, WCDMA, Camera 2M processor GRAPHICS Modem QDSP 4000 BT 1.2 Open GL ES processor 3D, 2D...

  • Page 37: Subsystem(Msm6275)

    3. TECHNICAL BRIEF 3.8. Subsystem(MSM6275) 3.8.1. ARM Microprocessor Subsystem The MSM6275 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6202, RFL6202, and PM6650 devices.
  • Page 38 3. TECHNICAL BRIEF 3.8.5. Serial Bus Interface(SBI) The MSM6275 device’s SBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6250, RFR6202, RFL6202, and PM6650 ASICs. Using the SBI, the RTR6250, RFR6202, RFL6202, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode.
  • Page 39 3. TECHNICAL BRIEF 3.8.10. General-Purpose Input/Output Interface The MSM6275 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

  • Page 40: Power Block

    3. TECHNICAL BRIEF 3.9. Power Block 3.9.1. General MSM6275, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6275, MSM memory, RF block, Bluetooth, Camera, T-flash, USIM and TCXO. Major power components are : PM6650(U401) : Phone power supply MIC2211-PMYML(U801) : LCD Power &...
  • Page 41 3. TECHNICAL BRIEF Figure. PM6650 Functional Block Diagram - 42 -...
  • Page 42 ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. KU800 Battery Bar Display(Stand By Condition) - 43 -...
  • Page 43 3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
  • Page 44 3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

  • Page 45: External Memory Interface

    • 1Gb NAND(8bit) flash memory + 512Mb SDRAM (32bit) • 2-CS(Chip Select) are used Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY9000A800EOGG Toshiba 50 ns 50 ns SDRAM TY9000A800EOGG Toshiba 8 ns Table#1. External memory interface for KU800 - 46 -...

  • Page 46: H/W Sub System

    3. TECHNICAL BRIEF 3.11. H/W Sub System 3.11.1. RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6275 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PA_ON : Power AMP on RF part • RX0_I/Q_M/P,TX_I/Q_M/P: I/Q for T/Rx of RF •...
  • Page 47 3. TECHNICAL BRIEF B. RFR6250(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX0_I/Q_M/P : I/Q for Rx of RF C. the others • UHF_VCO_BAND_SEL : WCDMA(3G) VCO Band Selection of UHF VCO • UHF_VCO_EN : WCDMA(3G) UHF VCO Enable •...
  • Page 48 3. TECHNICAL BRIEF 3.11.2. MSM Sub System 3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx VREG_UIM 2.85V USIM CLK PM6650 USIM CLK...
  • Page 49 3. TECHNICAL BRIEF 3.11.2.2. USB The MSM6275 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6275 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0.
  • Page 50 3. TECHNICAL BRIEF 3.11.3. HKADC(House Keeping ADC) The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6275 device has six analog input pins which are multiplexed to the input of the internal HKADC. Figure.
  • Page 51 3. TECHNICAL BRIEF 3.11.4. Key Pad There are 24 buttons and 6 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected On_SW to PMIC(PM6650). COL0 COL1 COL2 COL3 COL4 COL5 COL6 ROW0 Side key ROW1 (Up) Side Key ROW2 (Down) Side Key...
  • Page 52 3. TECHNICAL BRIEF CAMERA/MP3 KEY KEY_ROW(4) SW700 KEY_COL(5) VA704 EVLC18S02015 VOLUME_SIDE_KEY PM_ON_SW_N KEY_ROW(3) KEY_COL(5) VOLUME_SIDE_KEY KEY_ROW(2) KEY_COL(5) KEY_ROW(1) Figure. Keypad Circuit (Side KEY) - 53 -...
  • Page 53 3. TECHNICAL BRIEF 3.11.5 Camera Interface KU800 has two camera : 2M (UXGA) Pixel CMOS Camera and 0.3M(VGA) Camera. UXGA is a outer camera and VGA is a inner camera. Below figure show the camera board to board connector and camera I/F signal.
  • Page 54 3. TECHNICAL BRIEF The Camera module is connected to main board with 24pin Board to Board connector (UXGA : 14- 5602-024-000-829, VGA : GB042-20S-H10-E3000). Its interface is dedicated camera interface port in MSM6275. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 55 3. TECHNICAL BRIEF Name Port Note VGA_CAM_P_DOWN Power Down CAM_MCLK Master Clock(12M) CAM_PCLK Pixel clock CAM_DATA(0) Data CAM_DATA(1) Data CAM_DATA(2) Data CAM_DATA(3) Data CAM_DATA(4) Data CAM_DATA(5) Data CAM_DATA(6) Data CAM_DATA(7) Data CAM_VSYNC Vertical Sync CAM_HSYNC Horizontal Sync I2C_SDA I2C Data I2C_SCL I2C Clock VGA_CAM_RESET_N...
  • Page 56 3. TECHNICAL BRIEF 3.11.6 Slide ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U301 goes to 0V. Otherwise, 2.6V. This Slide signal is delivered to MSM6275 GPIO43 SLIDE_SENSE R305...
  • Page 57 3. TECHNICAL BRIEF 3.11.7 Keypad Light There are EL Sheet operated by EL Driver circuit, which are driven by HV860 EL-KEY DRIVER KEYPAD_EL_EN VREG_MSMP_2.7V C735 0.1u EL700 REL_OSC EL701 3.3M U701 VREG HV860 R709 +VPWR VREF EL PAD C737 3300p 4.7u C736 Figure.
  • Page 58 3. TECHNICAL BRIEF 3.11.8. LCD Module (LH200Q04-TD03 : LG.PHILIPS) - The LH200Q04-TD03 module is a Color Active Matrix Liquid Crystal Display with an Light Emission Diode(LED) Back Light system. The matrix employs a-Si Thin Film Transistor as the active element.
  • Page 59 3. TECHNICAL BRIEF 3.11.9. Display & LCD FPC Interface LCD module is connected to upper board with 35-pin Zip connector ( XF2B-3545-31A-P ) The LCD module is controlled by 16-bit EBI2 in MSM6275 Table. Interface between LCD Module and Main Board - 60 -...
  • Page 60 3. TECHNICAL BRIEF 3.11.10. Audio and Sound 3.11.10.1. Overview of Audio & Sound path Head_Set Analog MSM6275 switch (U200-1) (U500) Receiver and Loud Speaker (U501) Head_set MIC Figure. Audio Path Block Diagram - 61 -...
  • Page 61 3. TECHNICAL BRIEF 3.11.10.2. Audio Signal Processing & Interface The MSM6275 device integrates a wideband audio CODEC into the mobile station modem. The wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition to the 8 kHz voice band applications on the forward link.
  • Page 62 3. TECHNICAL BRIEF MSM6275 BLK MIC_Feedback MICFBN MICINP R200 0.1u C200 0.1u C201 MICOUTN 180K C202 C206 R203 C207 33p 470K C203 R209 0.1u C204 0.1u C205 MICOUTP 180K MICINN MICFBP Place close to MSM under same Shield SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105...
  • Page 63 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS C717 C718 SP0204LE5-PB U702 C719 MIC1N C720 MIC1P Audio Amp for loud Speaker Audio AMP C501 U501 TPA2010D1YZF R502 R503 AUX_N +VPWR PVDD R504 AUX_P SPK- SPK_AMP_EN _SHDN SPK+ C503 TP501 EUSY0278601 TP502 SELECT_SPK&RCV +VPWR...
  • Page 64 3. TECHNICAL BRIEF 3.11.10.3. Audio Mode There are three audio modes (Voice call, speaker phone, MIDI/MP3). MODE Device Description Voice Call Receiver Mode Receiver Voice Call Loud Mode Speaker Phone Headset Headset Voice Call Speaker phone Loud Mode Speaker Phone MIDI Loud Mode Speaker MIDI Bell...
  • Page 65 3. TECHNICAL BRIEF Voice Call Receiver Mode Path Head_Set Analog MSM6275 switch (U200-1) (U500) Receiver and Loud Speaker (U501) Head_set MIC Voice Voice + MP3 + MIDI Voice Call Receiver Mode is routed as below MSM6275 EAR1ON,EAR1OP Analog Switch( U500) Receiver - 66 -...
  • Page 66 3. TECHNICAL BRIEF Voice Call Headset Mode Path & Head video Telephony Mode Head_Set Analog MSM6275 switch (U200-1) (U500) Receiver and Loud Speaker (U501) Head_set MIC Voice Voice + MP3 + MIDI ❊ Voice Call Headset Mode is routed as below ➜...
  • Page 67 3. TECHNICAL BRIEF Voice Call Speaker Phone Mode Receiver and Loud Speaker Head_Set Analog MSM6275 switch (U200-1) (U500) (U501) Head_set MIC Voice Voice + MP3 + MIDI ❊ Voice Call Speaker Phone Mode is routed as below ➜ ➜ MSM6250 AUX_N, AUX_P AMP(U501) Analog Switch( U50 ) ->...
  • Page 68 3. TECHNICAL BRIEF MIDI Ring Tone/MP3 (Speaker) Receiver and Loud Speaker Head_Set Analog MSM6275 switch (U200-1) (U500) (U501) Head_set MIC Voice Voice + MP3 + MIDI ❊ MIDI Ring Tone/MP3 Mode is routed as below ➜ ➜ MSM6250 HPH_L AMP(U301) Loud speaker - 69 -...
  • Page 69 3. TECHNICAL BRIEF MIDI Ring Tone/MP3 (Headset) Head_Set Analog MSM6275 switch (U200-1) (U500) Receiver and Loud Speaker (U501) Head_set MIC Voice Voice + MP3 + MIDI ❊ MIDI Ring Tone/MP3 Headset Mode is routed as below ➜ ➜ MSM6250 HPH_L, HPH_R 18PIn MMI Headset - 70 -...
  • Page 70 3. TECHNICAL BRIEF Audio & Sound Main Component There are 6 main components in CU320. Component Design No. Maker Part No. Note MSM6275 U200 MSM6275 Base-Band Modem Audio amp U501 TPA2010D1YZF Class-D Audio Amp Analog Switch U500 FSA2267AL10X 1 Channel Analog SW Receiver &...
  • Page 71 3. TECHNICAL BRIEF 2. KU800 Main Component Flash LED Camera(2M) Power Logic/ Audio EL Driver Bluetooth Module LCD Module Vibrator Slide FPCB Speaker Camera (VGA) Upper board - 72 -...
  • Page 72 3. TECHNICAL BRIEF U1000 U1005 U1002 U1003 X1000 U1001 FL1002 Reference Description Reference Description U1003 WCDMA PAM U1002 GSM PAM FL1002 Duplexer U1000 U1005 RFR6250 X1000 GSM VCO U1001 RTR6250 - 73 -...
  • Page 73 3. TECHNICAL BRIEF Audio/logic CN503 BAT500 U400 CN401 S700 U302 X1001 U200 J700 Reference Description Reference Description X1001 TCXO BAT500 RTC Battery J700 USIM connector U200 MSM6275 U400 PMIC U302 Memory S600 Micro SD socket CN401 Battery connector CN503 18 pin MMI connector BT module - 74 -...

  • Page 74: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component RF component (Bottom) Reference Description Reference Description ANT1000 ANT. Contact point U1001 WCDMA/GSM Transceiver ICr SW1000 RF Switch FL1002 WCDMA 2100 Duplexer U1000 ANT. Switch Module RF component (Top) Reference Description Reference Description U1002...

  • Page 75: Signal Path

    4. TROUBLE SHOOTING 4.2 SIGNAL PATH RF WCDMA SIGNA PATH (Top Side) WCDMA RX GSM Tx WCDMA RX - 76 -...
  • Page 76 4. TROUBLE SHOOTING (Bottom Side) GSM RX WCDMA RX WCDMA TX - 77 -...

  • Page 77: Checking Vtcxo Block

    4. TROUBLE SHOOTING 4.3 Checking VTCXO Block The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX part, GSM part and BB part. Check 1. Crystal part If you already check this crystal part, you can skip check 1. k >...
  • Page 78 4. TROUBLE SHOOTING smd_0603h_3_r C1051 1000p VREG_TCXO_2.85V C1056 C1057 2.2n 0.1u smd_0603h_3_r smd_0603h_3_r 19.2MHz smd_0603h_25_r X1001 R1025 TRK_LO_ADJ VCONT TG-5001LA-19.2MHz C1061 smd_0603h_3_r C1062 smd_0603h_3_r 1000p smd_0603h_3_r C1064 100p TCXO_PM TCXO_BT_IN < Schematic of the The Crystal Part > - 79 -...
  • Page 79 4. TROUBLE SHOOTING Check TP2 VREG TCXO 2.85V Check PMIC TP2 ≥ 2.8V Check TP1 TRK_LO_ADJ Check MSM Check TP3 Whit Oscilloscope TP1: TRK_LO_ADJ TP2: VREG_TCXO_2.85V TP3: VTCXO Output_19.2MHZ - 80 -...

  • Page 80: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4 Checking Ant. SW Module Block Schematic of the Antenna Switch Block ANT_SEL0 VREG_RFRX_0_2.85V GSM850_RX1 GSM850_RX2 ANT_SEL0 CTRL1 GSM900_RX1 ANT_SEL1 CTRL2 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GND1 GSM1900_RX1 ANT_SEL1 GND2 GSM1900_RX2 GND3 WCDMA2100 smd_0603h_3_r smd_0603h_3_r GND4 C1004 C1005 C1007 C1008 GND5 DGM085M01...
  • Page 81 4. TROUBLE SHOOTING Logic Table of the Antenna Switch Mode ANT_SEL0 ANT_SEL1 GSM 900 TX High GSM 900 TX/WCDMA High DCS1800/PCS1900 TX High High DCS1800/PCS1900 TX < FEM Switch logic Table> Checking Switch Block power source Check Soldering of ANT_SEL0, 1 High Level Check VCC 2.5V <...

  • Page 82: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5 Checking WCDMA Block 4.5.1 Checking TX POWER of WCDMA 2100MHz R1000 SW1000 C1000 L1030 KMS-506 L1031 Antenna Module L1000 12nH RF Mobile Switch WCDMA +VPWR C1047 C1048 C1049 AWT6277R U1003 100p FL1000 GND5 EFCH1950TDC1 VCC2 VCC1 GND4 RFIN RFOUT...
  • Page 83 4. TROUBLE SHOOTING 4.5.2 Checking WCDMA PAM Control Block • PAM control signal 1. PA_ON : WCDMA PAM Block Enable 2. HDET_EN : WCDMA Tx Power Detect IC(U1006:HDET) Enable 3. PAM_EN : WCDMA PAM Enable HDET_EN PAM_EN PA_ON → PA_ON must be HIGH(over 2.7V) →...
  • Page 84 4. TROUBLE SHOOTING PAM OUT must be over 16dBm PAM IN must be over -5dBm R1000 SW1000 C1000 L1030 Antenna KMS-506 L1031 FEM Module L1000 12nH RF Mobile Switch FEM Module U1004 ADL5500 U1006 PLNA_OUT RFR6250 HDET1 ILNA_OUT VOPS VRMS ILNA_OUT PLNA_BIAS RFIN...

  • Page 85: Bluetooth Rf Block

    4. TROUBLE SHOOTING 4.6 Bluetooth RF Block BLUETOOTH VREG_MSMP_2.7V R707 VREG_BT_2.85V FEED ANT1 C724 C729 C727 C725 C730 C728 0.01u 0.01u RB06A L702 C732 BT_CLK CLK_REF SBST BT_SBST 4.7nH SBCK BT_SBCK VDD_MSM SBDT BT_SBDT SYNC_DET_TX_EN BT_TX_RX_N VDD_A RX_BB_TX_BB BT_DATA LDO1 XTAL_IN TCXO_BT LDO2...
  • Page 86 4. TROUBLE SHOOTING BT function On of The Phone TP1 > 2.5V Replace the PCB Replace the PMIC TP2 > 2.8V Check the buffer IC 19.2MHz ? U402 Replace BT module - 87 -...

  • Page 87: Checking Gsm Block

    4. TROUBLE SHOOTING 4.7 Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block < Main TOP > 4. Check RF Rx Level 5. Re-download SW & CAL. < Main BOT > - 88 -...
  • Page 88 4. TROUBLE SHOOTING 4.7.1 Checking Ant. SW Module TP5. TP4. TP1. TP3. TP2. Test Point (TXVCO Level) Schematic of RF TXVCO 925-960 MHz R1008 R1007 (1%) C1020 C1021 R1011 120p 330p C1024 C1025 (PPS) FB1000 5.6n R1012 VREG_RFTX_2.85V C1028 smd_0603h_3_r R1013 VREG_MSMP_2.7V C1031...
  • Page 89 4. TROUBLE SHOOTING - 90 -...
  • Page 90 4. TROUBLE SHOOTING 4.7.2 Checking Ant. SW Module Refer to chapter 4.4 4.7.3 Checking RF Tx level TP3. Test Point (RF Tx Level) BOT & TOP ANT1002 ANT1003 R1000 SW1000 C1000 KMS-506 L1000 U1000 GSM850_RX1 GSM850_RX2 CTRL1 GSM900_RX1 CTRL2 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GND1...
  • Page 91 4. TROUBLE SHOOTING - 92 -...
  • Page 92 4. TROUBLE SHOOTING 4.7.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.25V < Vapc < 1.6V TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3.
  • Page 93 4. TROUBLE SHOOTING 4.7.5 Checking RF Rx Block EGSM RX PCS RX DCS RX Test Point (RF Tx Level) L1001 2.7nH PCS RX. L1003 1930-1990 MHz 3.3nH L1007 2.7nH VREG_RFTX_2.85V smd_0603h_3_r C1009 L1009 3.9nH R1003 R1004 DCS RX. (1%) 4.7K 4.3K ECHU1C682JX5 C1014...
  • Page 94 4. TROUBLE SHOOTING - 95 -...

  • Page 95: Power On Troubleshooting

    4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.8 Power ON Troubleshooting Power On sequence of KU800 is : PWR key press(Key PCB) → PM_ON_SW_N go to low(VA502),PM6650 KPDPWR_N pin(24) → PM6650 Power Up → VREG_MSMC_1.375V(C429), VREG_MSME_1.8V(C430), VREG_MSMP_2.7V(C421), VREG_MSMA_2.6V(C419), VREG_TCXO_2.85V(C413) power up and system reset assert to MSM →...
  • Page 96 4. TROUBLE SHOOTING SIDE KEY FPCB - 97 -...
  • Page 97 4. TROUBLE SHOOTING VREG MSMP 2.7V VREG MSME 1.8V VREG MSMA 2.6V 32.768 KHz PS HOLD VREG MSMC 1.375V VREG TCXO 2.85V - 98 -...
  • Page 98 4. TROUBLE SHOOTING 19.2 MHz PM_ON_SW_N - 99 -...
  • Page 99 4. TROUBLE SHOOTING More tips for not powering-on cases ! Main board failure: 1. Check short of +VPWR(4.2V) and GND ! → Change a board 2. Check short of L400/L401 and GND → If YES, PM6650 internal FET short ! → Change PM6650 or a board.

  • Page 100: Charger Troubleshooting

    4. TROUBLE SHOOTING 4.9 Charger Troubleshooting Charging Current Flow +5V_PWR (4.6V) Pass (ON) CHG_CNT_N ICHARGE ICHARGEOUT +VPWR 4.2~4.25V Main VBATT Battery Battery FET (ON) BATT_FET_N Charging Procedure - Connect TA - Control the charging current by PM6650 IC - Charging current flows into the battery Troubleshooting Setup - Connect TA and battery to the phone Check Point...
  • Page 101 4. TROUBLE SHOOTING Charging function components R405 Q402 Q403 - 102 -...
  • Page 102 4. TROUBLE SHOOTING Troubleshooting Flow Start Check the pin and battery Connect terminals of I/O connector Change I/O connector Connection OK? Is the TA voltage Change TA 4.6V? Is it charging properly After turning on Q402, Q403? Change the board - 103 -...

  • Page 103: Usb Troubleshooting

    4.10 USB Troubleshooting USB Initial sequence of KU800 is : USB connected to KU800 → USB VBUS SWITCH -> USB_VBUS go to 5V → USB_D+ go to 3.3V 48M Crystal on → USB_VP and USB_VN is triggered → USB work.
  • Page 104 4. TROUBLE SHOOTING R204 X200 : 48M clock Q1001 : USB VBUS Switch VA503 : USB D+ C422, R407 - 105 -...

  • Page 105: Sim Detect Troubleshooting

    4. TROUBLE SHOOTING 4.11 SIM Detect Troubleshooting USIM Initial sequence of KU800 is : USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 3.0V → USIM IF work Start Re-insert the SIM card Work well? Check the Side key FPCB VREG_UIM_2.85V is 3.0V?

  • Page 106: Key Sense Troubleshooting

    4. TROUBLE SHOOTING 4.12 Key Sense Troubleshooting Key Sense sequence of KU800 is : Default condition ROW(1-4) is 2.6V → Press the key → Corresponding row(x) go to 0V → Key sensing Start Check the side key FPCB and Connector...

  • Page 107: Camera Troubleshooting (2M Camera)

    4. TROUBLE SHOOTING 4.13 Camera Troubleshooting (2M Camera) 2M Camera control signals are generated by MSM6275. Start Check the camera connector and reconnect the camera Camera is OK? Check Camera Power (CN502) Change the Main board pin14->1.8V pin15->2.8V pin16->2.7V Check the CAM_MCLK Change the Main board (CN502 18pin) Change the camera...
  • Page 108 4. TROUBLE SHOOTING (VGA Camera) VGA Camera control signals are generated by MSM6275. Start Check the camera connector and reconnect the camera Camera is OK? Check Camera Power (CN1) Change the Main board pin19->2.8V pin20->2.8V Check the CAM_MCLK Change the Main board (CN1 2pin) Change the camera Camera is OK...

  • Page 109: Keypad Backlight Troubleshooting

    4. TROUBLE SHOOTING 4.14 Keypad Backlight Troubleshooting Key Pad Back Light is on as below : Key pressing → EL Driver ON → EL Sheet ON Start Check the side key FPCB and Connector Work well? Check EL-Key Driver Change the Side Key FPCB -VPWR : C736 -VREG_MSMP_2.7V : C735 -KEYPAD_EL_EN : CN700 33pin...

  • Page 110: Folder On/Off Troubleshooting

    4. TROUBLE SHOOTING 4.15 Folder ON/OFF Troubleshooting Folder On/Off is worked as below : Folder On/Off Event → Flip(U301 pin 1) is triggered(On : about 2.1V, Off : 0V) → MSM6275 Sense the Folder Event Start Check the magnet in Insert the magnet Slide Assy Approach the magnet to...

  • Page 111: Main Lcd Troubleshooting

    4. TROUBLE SHOOTING 4.16 Main LCD Troubleshooting Main LCD control signals are generated by MSM6275. The signal path is : MSM6275 → A → B → C → D (upper board = Sub PCB) START Press END Key to turn the Power on Follow the Power ON Is the circuit powered ? Trouble shooting...

  • Page 112: Main Lcd Troubleshooting

    4. TROUBLE SHOOTING 4.17 Main LCD Troubleshooting Previous Page Previous Page LCD Display OK? Change LCD Module LCD Display OK? The LCD works Change Main board - 113 -...
  • Page 113 4. TROUBLE SHOOTING LCD Control data flow Main board Front Rear Main to Sub FPCB - 114 -...

  • Page 114: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.18 Audio Trouble Shooting Audio & sound signal paths are like below. Receiver and Loud Speaker Head_Set Analog MSM6275 switch (U500) (U200-1) (U501) Head_set MIC Voice Voice + MP3 + MIDI - 115 -...

  • Page 115: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.19 Audio Trouble Shooting 4.19.1 Receiver Path Voice Receiver path as below: MSM6275 Ear1ON/Ear1OP → R500,R501 → U500(Speaker/receiver switch) → CN501(b’d to b’d connector for LCD Module) → LCD b’d to b’d connector of LCD FPCB → LCD module →...
  • Page 116 4. TROUBLE SHOOTING Receiver and Loud Speaker Speaker soldering point FPCB for LCD Module CN501(LCD connector) U501(Audio Amplifier) R313,R314 (receiver signal serial resistor) VA500,VA501 (varistor) U500(Speaker/receiver switch) - 117 -...
  • Page 117 4. TROUBLE SHOOTING 4.19.2 Voice and Sound Path for Head_set Voice and Multimedia Sound path for Head_Set as below: MSM6275 HPH_R, HPH_L → C505 , C506 → R508,R509 → CN503 headset Jack (pin 4,5) Start Connect the phone to network equipment and setup call.
  • Page 118 4. TROUBLE SHOOTING C505 R508, R509 C506 - 119 -...
  • Page 119 Loud speaker path as below: MSM6275 AUX_P/N → C501,C502 → R502,R504 → U501(Amplifier) → U500(Receiver/Speaker switch) → CN501 → LCD FPCB → Speaker KU800 use Class-D Audio Amplifier. Start The output signal waveform of amplifier is not sine wave but rectangular waveform.
  • Page 120 4. TROUBLE SHOOTING Loud Speaker Speaker soldering point FPCB for LCD Module U501(Audio Amplifier) VA500,VA501 (varistor) U500(Speaker/receiver switch) - 121 -...
  • Page 121 4. TROUBLE SHOOTING 4.19.4 Microphone for Main MIC Main Microphone path as below: MIC → C720 → MSM6275 → MIC feed back gain logic → MSM internal CODEC MICBIAS C717 C718 SP0204LE5-PB U702 C719 MIC1N C720 MIC1P SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105 Start...
  • Page 122 4. TROUBLE SHOOTING MICBIAS C717 C718 SP0204LE5-PB U702 C719 MIC1N C720 MIC1P - 123 -...
  • Page 123 4. TROUBLE SHOOTING 4.19.5 Microphone for Head_Set MIC for Head_Set path as below: Insert Headset → EAR_SENSE_N(pin8) go 0V → MSM6275 sense Head_Set insertion → MIC signal go to MSM( to C215) CN503 MIC2N EAR_MIC2P R508 HPL_L R509 C505 HPL_R C506 EAR_SENSE_N +VPWR...
  • Page 124 4. TROUBLE SHOOTING R505 ( You can check Headset Mic signal at R505 ) - 125 -...

  • Page 125: Download

    LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. 5.2 Downloading Procedure 5.2.1 Setup Preferences...
  • Page 126 5. DOWNLOAD 5.2.2 Connecting to PC Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM14) shall be different from that of the port number in the snapshot.) - 127 -...
  • Page 127 5. DOWNLOAD The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar indicating the degree of transmission of data is displayed. The following slide describes how to use or set options in detail. - 128 -...
  • Page 128 5. DOWNLOAD 1) Image Folder indicates root path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where new images are located. Please note that all images should be located in a selected folder. (This program support the automatically loading image for some models based on MSM6275) 2) Click on the Browse...
  • Page 129 5. DOWNLOAD 5.2.3 Choosing image files Select the image folder, where all the image files are located, by clicking on the Browse... button. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) ★...
  • Page 130 5. DOWNLOAD ★ If you select the image folder, the program will automatically load images accordingly. Automatically load images ★ If you want to download the Flexible logo image, click the “Browse...” button and select image file - 131 -...
  • Page 131 5. DOWNLOAD ★ If NV restore is failed, then the NV data(*.nv2) is erased permantly. In this case, choose the desired NV file to be downloaded on the handset. If you want to download the NV data, click the “Browse...” button and select data file. Caution) Error message will show if you choose improper folder like this.
  • Page 132 5. DOWNLOAD 5.2.4 Downloading • This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory. • Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.
  • Page 133 5. DOWNLOAD • Writing the AMSS modem image from SDRAM to Flash memory. • Downloading Flexible logo. • Rebooting the handset and re-establishing the connection. • Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection.
  • Page 134 5. DOWNLOAD • Rebooting the handset and re-establishing the connection. • Erasing the existing directories and files before downloading the selected Media image • Downloading Media image in progress. • Downloading Module image in progress. - 135 -...
  • Page 135 5. DOWNLOAD • Rebooting the handset and re-establishing the connection. • Downloading process has completed successfully. - 136 -...
  • Page 136 5. DOWNLOAD 5.2.4 Tools Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed. Select Device Manager from the Tools of the file menu. - 137 -...
  • Page 137 5. DOWNLOAD Log Extractor is designed to extract log information from handset and store log related files in the selected root path in PC. This function is very useful for debugging. Select Log Extractor from the Tools of the file menu, and connect the phone with LGMDP by clicking on the Connect button. When clicking on the Connect button, this checks if the appropriate files such as LGAPP/RecMngr.bin, err directory, Debugging_Tip.txt, or Hidden_info.bin are placed on the handset.

  • Page 138: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 1) When the phone does not work after downloading has been completed. ➜ Reboot the phone as the emergency mode (keep pressing “2” and “5” key while the phone is being booted). and then try to download the images again. ★...
  • Page 139 5. DOWNLOAD ➜ Select the image folder, where all the image files are located, by clicking on the Browse... button. And start downloading the selected images. ➜ Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown. ★ The files are saved every NV Backup. The name is based on the time when NV Backup is done.) - 140 -...
  • Page 140 5. DOWNLOAD 2) NV Restore Error ➜ Connect to the phone. - 141 -...
  • Page 141 5. DOWNLOAD ➜ Click on ‘Cancel’. ➜ Click on ‘NV Restore’ then several NV Backup files(*.nv2) are shown. ★ The files are saved every NV Backup. The name is based on the time when NV Backup is done.) - 142 -...
  • Page 142 5. DOWNLOAD ➜ Select the proper file and click on ‘Restore’. ➜ If you want image download and NV backup file restore at once, use the NV Default function. - 143 -...
  • Page 143 5. DOWNLOAD ➜ Start download the selected images. - 144 -...

  • Page 144: Caution

    5. DOWNLOAD 5.4 Caution 1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) In emergency mode, you can not download the media and module image. So if you want download media and module image, connect the phone normal mode after emergency mode download, and then you can do it.

  • Page 145: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block Fig 2.1-1.UMTS2100+EGSM/DCS-1800/PCS-1900 RF Functional - 146 -...
  • Page 146 6. BLOCK DIAGRAM GSM & WCDMA RF Block Table 2.1-1. RF Block Component - 147 -...

  • Page 147: Interface Diagram

    6. BLOCK DIAGRAM 6.2 Interface Diagram VCO_EN / VCO_Band PA_ramp PA_EN, / PA_Band Ant_Sel 0,1,2 TRK_LO_ADJ PA_ON T X _ A G C _ A D J HDET KU800 Interface Diagram - 148 -...
  • Page 148 6. BLOCK DIAGRAM Main RF signal EGSM TX : GSM Tx RF signal EGSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS 2100 TX : UMTS 2100 Tx RF signal UMTS 2100 RX : UMTS 2100 Rx RF signal...
  • Page 149 6. BLOCK DIAGRAM *Top Side *Bottom Side - 150 -...

  • Page 150: Circuit Diagram

    RX_QP C1080 C1079 100p 4.7u C1081 1.8p Checked VREG_TCXO_2.85V RX_IM DRAWING C1082 RX_IP 100p smd_0603h_3_r Approved VREG_TCXO_2.85V R1032 C1083 C1084 smd_0603h_3_r 4.7u 100p smd_0603h_3_r RX_VCO_IN DRAWING REV 1.1 C1085 LG Electronics Inc. LG(42)-A-5505-10:01 LG Electronics Inc. - 151 -...
  • Page 151 Date Sign & Name Sheet/ Sheets 07/17 KU800 B.H.KU MODEL Designer 2006 KU311 C249 Place near Checked 0.1u MSM pin AD26 DRAWING R221 MSM6275 VREG_CAM_DVDD_2.8V NAME R222 Approved DRAWING REV.1.1 LG Electronics Inc. LG(42)-A-5505-10:01 LG Electronics Inc. - 152 -...
  • Page 152 NC26 NC86 NC27 NC87 NC28 NC88 NC29 NC89 Section Date Sign & Name Sheet/ Sheets MODEL KU800 12/10 Designer B.H.KU 2005 KU311 Checked DRAWING MEMORY NAME Approved DRAWING REV 1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 153 -...
  • Page 153 2.2n KU800 KU311 2/22 C434 C435 BGND C436 C437 Designer B.H.KU 2006 0.01u MIC2211-LGBML R412 100K C438 Checked DRAWING TCXO_BT_IN TCXO_BT PMIC 100p NAME U402 Approved TC7S04FU DRAWING REV 1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 154 -...
  • Page 154 USB_PWR_EN NFM21PC105B1A3 UART_TX DG2011DX-T1-E3 Section Date Sign & Name Sheet/ KU311 Sheets MODEL KU800 07/17 Designer B.H.KU UART_RX_IN 2006 Checked DRAWING AUDIO & BTOB NAME SERIALIZER Approved DRAWING LG Electronics Inc. REV 1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 155 -...
  • Page 155 7. Circuit Diagram KEY FPCB CONNECTOR ( SOCKET ) EL-KEY DRIVER AXK7L40227G KEYPAD_EL_EN ENBY0020301 MMC_CD VREG_MSMP_2.7V MMC_DATA U703 TCXO_BT VREG_MMC_3.0V MMC_CMD C735 BT_TX_RX_N MMC_CLK MMC_CD MMC_CMD RA601 0.1u BT_SBST BT_SBDT KEY_ROW(1) EL700 BT_SBCK KEY_ROW(2) MMC_DATA MMC_CLK BT_DATA KEY_ROW(3) KEY_ROW(4) BT_CLK RCLAMP0504F REL_OSC EL701...
  • Page 156 7. Circuit Diagram LCD BackLight Charge pump SLIDE PCB CONNECTOR (SOCKET) Dual LDO ( for LCD / Touch Sensor) CN800 +VPWR VOUT_FL Flash_LED_PWR Flash_LED_PWR TOUCHKEY_CLK +VPWR TOUCHKEY_ACK VOUT_BL LCD_BL_PWR U801 MIC2211-PMYML +VPWR TOUCHKEY_DAT +VPWR VOUT1 VREG_TOUCH_3.0V TOUCH_BL_SINK TOUCH_LDO_EN PGND LCD_ID_VSYNC LCD_BL_CTRL TOUCH_LDO_EN VOUT2...
  • Page 157 7. CIRCUIT DIAGRAM VGA CAM CONNECTOR FPCB CONNECTOR ( WITH MAIN B/D) 51 52 DSO+ MPL_LCD_EN VGA_CAM_P_DOWN DSO- LCD_LDO_EN 470K VREG_LCD_2.8V CKSO+ FLASH_LED_EN CKSO- VREG_MSMP_2.7V ICVE10184E070R100FR LCD_RESET_N VREG_CAM_AVDD_2.8V CAM_MCLK LCD_ID_VSYNC LCD_BL_CTRL INOUT_B1 INOUT_A1 VREG_CAM_DVDD_2.8V TOUCH_BL_SINK TOUCH_LDO_EN CAM_PCLK VGA_CAM_RESET_N INOUT_B2 INOUT_A2 CAM_DATA(0) INOUT_B3 INOUT_A3...
  • Page 158 7. CIRCUIT DIAGRAM CONNECTOR ( KEY SIDE / TOP) CONNECTOR ( M/B SIDE / BOT) AXK8L40125G CN10 MMC_CD ENBY0020201 MMC_CD MMC_DATA MMC_DATA TCXO_BT VREG_MMC_3.0V TCXO_BT VREG_MMC_3.0V MMC_CMD MMC_CMD BT_TX_RX_N MMC_CLK BT_TX_RX_N MMC_CLK BT_SBST BT_SBST BT_SBDT KEY_ROW(1) BT_SBDT KEY_ROW(1) BT_SBCK KEY_ROW(2) BT_SBCK KEY_ROW(2) BT_DATA...
  • Page 159 7. CIRCUIT DIAGRAM TOUCH PAD CONNECTOR +VPWR VREG_TOUCH_3.0V +VPWR RED LED CN900 LD900 R900 SML-A12UT 100ohm R901 R902 TOUCHKEY_CLK TOUCHKEY_DAT R903 C900 TOUCHKEY_ACK LD901 R904 SML-A12UT 100ohm AXK8L10125G R905 SML-A12UT 100ohm +VPWR RED LED LD903 R906 SML-A12UT 100ohm C901 LD904 R907 SML-A12UT 100ohm...
  • Page 160 7. CIRCUIT DIAGRAM FLED_PWR Section Date Sign & Name Sheet/ Sheets MODEL KU800 Designer B.h.Ku Checked DRAWING FLED NAME Approved DRAWING LG Electronics Inc. REV 1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 161 -...

  • Page 161: Pcb Layout

    8. pcb layout - 162 -...
  • Page 162 8. pcb layout - 163 -...
  • Page 163 8. pcb layout - 164 -...
  • Page 164 8. pcb layout - 165 -...
  • Page 165 8. pcb layout - 166 -...
  • Page 166 8. pcb layout - 167 -...
  • Page 167 8. pcb layout - 168 -...
  • Page 168 8. pcb layout - 169 -...
  • Page 169 8. pcb layout - 170 -...
  • Page 170 8. pcb layout - 171 -...
  • Page 171 8. pcb layout - 172 -...

  • Page 172: Calibration & Rf Auto Test Program

    9. Calibration & RF Auto Test Program 9. Calibration & RF Auto Test Program 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory HOT KIMCHI PROJECT Auto_Model KU800 AutoSetup_100.xml Procedure_KU800_102.xml Spec_KU800_101.xml Cal_Model KU800 At_Serial_Cmd.xml dacTable.cfg HOT_KIMCHI CmMqDll.dll Diag_NV6275_RevB.dll ComLMPLib_06.dll DLL_E5515CD.DLL Hot_KimchiD.exe...
  • Page 173 9. Calibration & RF Auto Test Program 9.1.2 Setup file (Info_Db.txt) /*cal*/[Default]=[KU800] /*cal*/[KU800]=[..\\Cal_Model\\KU800\\LG_RfCal_QuKU800Ag_099.dll] /*auto*/[KU800]=[..\\RF Auto\\Rf_AutoMain_Ver1114.dll] [ezlooks]=[off] [batcal]=[off] [svc]=[off] ‘on’ or ‘off’. (use only lower case) [standalone]=[off] [tescom]=[off] ‘auto’ or ‘cal’. (use only lower case) [process]=[cal] [KU800]= [..\\Auto_Model\\KU800\\Procedure_KU800_102.xml,..\\Auto_Model\\KU800\\Spec_KU800_101.xml,.. \\Auto_Model\\KU800\\AutoSetup_100.xml] 1: Indication of ‘cal process’ or ‘auto process’...
  • Page 174 9. Calibration & RF Auto Test Program 9.1.3 Items of setup file [ezlooks] => The yes or no for using ezlooks Domestic: on, Overseas: off [batcal] => The yes or no for using battery calibration [svc] => The yes or no for using HOT KIMCHI at service center Domestic: off, Service Center: on [standalone] =>...
  • Page 175 9. Calibration & RF Auto Test Program 9.1.4 Example for setup file CAL Process AUTO Process Ex1) Service center Ex1) Service center, Overseas factory, Repair [ezlooks]=[off] [ezlooks]=[off] [batcal]=[off] [batcal]=[off] [svc]=[on] [svc]=[off] [standalone]=[off] [standalone]=[off] [tescom]=[off] [tescom]=[off] [process]=[cal] [process]=[auto] Ex2) Overseas factory or Repair Ex2) Domestic factory [ezlooks]=[off] [ezlooks]=[on]...

  • Page 176: Example For Using Hot Kimchi

    9. Calibration & RF Auto Test Program 9.2 Example for using HOT KIMCHI ➀ Choose Exe_QKU800Ver0.99A ➁ Click APPLY button ➂ Click START button * Flow 1. Select the model name which you want 2. Click APPLY button to load the ‘cal’ 3.
  • Page 177 9. Calibration & RF Auto Test Program 9.2.1 Example for Calibration ver097A - 178 -...

  • Page 178: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 32 33 22 23 46 47 63 64 - 179 -...
  • Page 179 - 180 -...

  • Page 180: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT-2000(SLIDE) TISL0000501 Black AAAY00 ADDITION AAAY0169601 Black...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MWAE00 WINDOW,CAMERA MWAE0018701 MOLD, ABS HF-380, , , , , Color Without MWAH00 WINDOW,FLASH MWAH0006201 MOLD, PC LUPOY HI-1002M, , , , , Color ACGQ00 COVER ASSY,SLIDE ACGQ0011501...
  • Page 182 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MBFF00 BRACKET,LCD MBFF0010301 CASTING, Al Alloy, , , , , Color MCJW00 COVER,SLIDE(UPPER) MCJW0008501 MOLD, PC LUPOY SC-1004ML, , , , , Black MFBC00 FILTER,SPEAKER MFBC0026901 COMPLEX, (empty), , , , ,...
  • Page 183 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MTAB00 TAPE,PROTECTION MTAB0144901 COMPLEX, (empty), , , , , Color Without ADCA00 DOME ASSY,METAL ADCA0053601 Color GMEY01 SCREW MACHINE,BIND GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK Black MCCH00 CAP,SCREW...

  • Page 184: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark 3.0 ,-2.0 dBd,; ,internal, PIFA, SNGF00 ANTENNA,GSM,FIXED SNGF0020001...
  • Page 185 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT EUSY0223002 CONTROL / 2.8V VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005...
  • Page 186 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark PCB ASSY, SAEB00 SAEB0016301 KEYPAD,INSERT SAEE00 PCB ASSY,KEYPAD,SMT SAEE0018401 PCB ASSY,KEYPAD,SMT SAEC00 SAEC0016401 BOTTOM ANT1 ANTENNA,GSM,FIXED SNGF0020101 3.0 ,-2.0 dBd,; ,bluetooth chip ,; ,SINGLE ,-2.0 ,50 ,3.0 C711 CAP,CHIP,MAKER ECZH0000830...
  • Page 187 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L702 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP , MODULE,ETC SMZY0009501 Bluetooth RF Module, 5.0*4.0*1.1 R701 RES,CHIP ERHY0013401 1.5 Mohm,1/16W ,F ,1005 ,R/TP R702 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP R704 RES,CHIP,MAKER...
  • Page 188 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C800 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C801 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C802 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C803 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 189 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SVCY00 CAMERA SVCY0012201 CMOS ,VGA ,FPCB TYPE MAIN ,240*320 2.0" ,37.2*52.1*1.9(t) ,262k ,TFT ,TM SVLM00 LCD MODULE SVLM0012602 ,uPD161802 (G)/uPD161964 (S)-NEC , SAFY00 PCB ASSY,MAIN SAFY0169201 SAFB00 PCB ASSY,MAIN,INSERT...
  • Page 190 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1022 CAP,FILM,MPP ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP C1023 CAP,CERAMIC,CHIP ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP C1025 CAP,CERAMIC,CHIP ECCH0009105 82 pF,50V ,J ,X7R ,TC ,0603 ,R/TP C1026 CAP,CERAMIC,CHIP ECCH0000155...
  • Page 191 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C404 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C405 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP C406 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP C407 CAP,CERAMIC,CHIP ECCH0009106...
  • Page 192 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C507 FILTER,EMI/POWER SFEY0006501 SMD ,3 TERMINAL EMI FILTER C508 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C513 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP CN401 CONNECTOR,ETC ENZY0017701...
  • Page 193 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L400 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , L401 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , Q402 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 Q403 TR,FET,P-CHANNEL EQFP0005101...
  • Page 194 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark U401 EUSY0254901 MLF ,10 PIN,R/TP ,Dual(2.7V/150mA,1.8V/300mA) LDO U502 EUSY0198601 SOT-666 ,6 PIN,R/TP ,Single SPDT Analog Switch U503 EUSY0260001 Micropak ,10 PIN,R/TP ,Dual Analog switch, Pb Free SC70-5 ,5 PIN,R/TP ,1.8V Low Voltage Comparator with U504 EUSY0077701...
  • Page 195 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1056 CAP,CERAMIC,CHIP ECCH0009107 2.2 nF,16V ,K ,X7R ,TC ,0603 ,R/TP C1057 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C1058 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP C1059 CAP,CERAMIC,CHIP ECCH0000112...
  • Page 196 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C208 CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP C209 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C210 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C211 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C212...
  • Page 197 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C242 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C243 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C244 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C245 CAP,CERAMIC,CHIP ECCH0009101...
  • Page 198 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CONNECTOR,BOARD TO CN500 ENBY0020301 40 PIN,0.4 mm,ETC , ,H=0.9, Socket BOARD CONNECTOR,BOARD TO CN501 ENBY0022501 50 PIN,0.4 mm,ETC , ,H=0.9, Socket BOARD D501 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE D502 DIODE,TVS...
  • Page 199 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R1019 RES,CHIP ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R1020 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP R1021 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP R1022 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 200 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R302 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R303 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R304 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R305 RES,CHIP ERHY0009531 62 ohm,1/20W(0.05W) ,J ,0603 ,R/TP...
  • Page 201 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA505 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA506 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA507 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA508 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...

  • Page 202: Accessory

    Part Number Specification Color Remark Without MHBY00 HANDSTRAP MHBY0003604 Color BATTERY PACK,LI- 3.7 V,1000 mAh,1 CELL,PRISMATIC ,KU800 VDFBK BATT, SBPP00 SBPP0019501 Black POLYMER 3GSON Slide, Pb-Free 3.7 V,1000 mAh,1 CELL,PRISMATIC ,KU800 VDFBK BATT, REPLA BATTERY PACK,LI- SBPP0020801 3GSON Slide, Pb-Free ,; ,3.7 ,1000 ,0.2C ,PRISMATIC...
  • Page 203 Note...
  • Page 204 Note...

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