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HP 280 G5 SFF Business PC Product End-Of-Life Disassembly Instructions

HP 280 G5 SFF Business PC Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category:
Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 280 G5 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries, excluding Li-Ion batteries.
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
EL-MF877-00
Template Revision C
Last revalidation date 08-May-2020
Notes
With a surface greater than 10 sq cm
All types including standard alkaline, coin or button
style batteries
Battery(ies) are attached to the product by (
that apply with an
[
[x] snaps
[
[
HPI instructions for this template are available at
HP's Sustainability
"x"
inside the
] screws
] adhesive
] other. Explain
EL-MF877-01
Contact.
Quantity of
items
included in
product
2
1
check all
"[ ]"):
Page 1

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Summary of Contents for HP 280 G5 SFF Business PC

  • Page 1 Marketing Name / Model [List multiple models if applicable.] HP 280 G5 SFF Business PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of items Item Description Notes included in product NOTE: Add detailed removal procedures including required tools in the sections 3.1 and 3.2. Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas than 100 sq cm discharge lamps...
  • Page 3 Tool Description Tool Size (if applicable) Hexagon Screw Driver T-15 Electric Iron QUICK 310 Crisscross Screw Driver 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure: 1.
  • Page 4 Step1 Use T-15 screwdriver to Loose thumb Step2 Remove front bezel from chassis screw and remove access panel. Step3 Loose screw and remove blank module Step4 Disconnect HDD power cable and HDD SATA cable from 1 HDD. Step5 Disconnect ODD power cable and ODD SATA Step6 Press the ODD’s latch on ODD cage and remove ODD cable from ODD.
  • Page 5 Step8 Remove the driver cage from Chassis Step7 Use T-15 screwdriver to Loose screw Step9:Use T-15 screw driver to loose the screws of HDD Step10 Disconnect HDD power cable and HDD SATA cable from 2 HDD. and remove HDD from HDD cage Step11 Loose 2 HDD screw and remove the 2 Step12:Disconnect CPU Cooler Fan cable from MB...
  • Page 6 Step13 Loose the screws and remove cooler fan Step14: Disconnect system fan cable from MB EL-MF877-00 Page 6 Template Revision C Last revalidation date 08-May-2020 HPI instructions for this template are available at EL-MF877-01...
  • Page 7 Step15 Loose the screws and remove system fan Disconnect all cables from MB Step16 Step17 Remove memory from the MB Step18 Rotate the handle and open it up EL-MF877-00 Page 7 Template Revision C Last revalidation date 08-May-2020 HPI instructions for this template are available at EL-MF877-01...
  • Page 8 Step19:Remove the CPU from the board Step20 loose screw from behind panel Step21 remove graphic card from board Step22 Remove the battery from MB Step23 Remove M.2 WLAN card Step24 Loose the screw of rear antenna and remove it EL-MF877-00 Page 8 Template Revision C Last revalidation date 08-May-2020...
  • Page 9 Step25 Loose the all screws of motherboard Step26 Remove motherboard from chassis EL-MF877-00 Page 9 Template Revision C Last revalidation date 08-May-2020 HPI instructions for this template are available at EL-MF877-01...
  • Page 10 Step27 Remove the screws of PSU from chassis Step28 Press the PSU’s latch on chassis Step29 Remove the power supply from chassis Step30 loose screws from top and right EL-MF877-00 Page 10 Template Revision C Last revalidation date 08-May-2020 HPI instructions for this template are available at EL-MF877-01...
  • Page 11 Step31 Remove the screw and open cage Step32 Loose screws and remove PCB from cage Step33 Take off CAP using electric iron from the PSU EL-MF877-00 Page 11 Template Revision C Last revalidation date 08-May-2020 HPI instructions for this template are available at EL-MF877-01...