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Item Description
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screwdriver
Description #2 Needle nose pliers
Description #3 Diagonal pliers
Description #4 Socket wrench
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Use screw driver to remove 6 screws from bottom, left, and right side of unit. Remove Top Cover.
2. Remove 2 memory dimm modules.
3. Detach 2 connectors for the fans from the mainboard.
4. Remove DC connector nut and washer
5. Use screw driver to remove 8 screws.
6. Remove mainboard from chassis.
7. Remove coin battery from socket.
8. Open Power Adapter. Remove PCB. Remove electrolytic capacitor.
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
No. 2
N/A
N/A
9.5
MF877-01
Quantity of
items
included in
product
0
Page 2
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