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3
Features
3.1
Overview
This section provides an overview of the key characteristics for the baseboard
D3081, the CPU Memory Risers (CPUMEMRs) D3131, and the PCI Riser
(PCIR) D3082.
Processors
Up to 8 Intel Xeon® X7500/E7500 series processors (up to 130 W); one
processor per CPUMEMR
4 Intel QuickPath Interconnects; up to 6,4 GT/s in each direction
Hyper-Threading technology; except X7542 processors
Up to 2.0 MB L2 cache and 24 MB L3 cache (Nehalem-EX)
Main memory
Up to 128 slots for DDR3 memory modules (1333 MHz) with 2 GB, 4 GB,
8 GB, and 16 GB capacity; 16 slots per CPUMEMR
4 SMI links per CPU and up to 4 DDR3 DIMM memory modules per SMI link;
memory modules connected to CPU via memory buffer named Millbrook;
Intel® Scalable Memory Interconnect (SMI) link connects CPU and
Millbrook
Maximum configuration: 2 TB memory with availability of 16 GB memory
modules
Basic configuration: 32 GB memory; 4 CPUMEMRs with 4 memory modules
per CPUMEMR
Maximum 32 Gbit/s band width (DDR3)
Hardware memory scrubbing
Single Device Data Correction (SDDC) function (Chipkill™)
Memory interleaving function
Memory mirroring function
D3081, D3131, D3082 (RX900 S1)
Technical Manual
17
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