System Technical Specifications - HP xw8600 Quickspecs

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System Technical Specifications

System Board System Board System Board System Board
System Board Form System Board Form System Board Form System Board Form SSI-EEB (E-ATX 12" x 13")
Factor Factor Factor Factor
Processor Socket Processor Socket Processor Socket Processor Socket Dual LGA 771
Chipset Chipset Chipset Chipset Intel® 5400
Super I/O Controller Super I/O Controller Super I/O Controller Super I/O Controller SMSC SCH5327
DIMM Connectors DIMM Connectors DIMM Connectors DIMM Connectors 8 (16 with Risers)
(FBD DDR2 (FBD DDR2 (FBD DDR2 (FBD DDR2
Memory Memory Memory Memory
Maximum Memory Maximum Memory Maximum Memory Maximum Memory Supports up to 128 GB of DDR2 Fully Buffered DIMMs . Memory risers are required to support larger
memory configurations (at launch, Configure-to-order HP xw8600 Workstations ordered with more than 16
GB of memory will require riser modules). Large capacity 8 GB DIMMs require the use of riser cards. No
quad ranked DIMM should be used in the HP xw8600 without riser cards.
DA - 12849 North America — Version 18 — October 1, 2009
HP xw8600 Workstation HP xw8600 Workstation HP xw8600 Workstation HP xw8600 Workstation
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