HP xw8600 Specification page 85

QuickSpecs
Technical Specifications - Monitors
Packaging
DA – 12849 Worldwide • Version 10 • June 1, 2008
HP xw8600 Workstation
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on
the external surface designed to be
frequently handled or carried by the
user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers
(PBBEs)
Polybrominated Biphenyl Oxides
(PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) - except for
wires and cables, and certain retail
packaging has been voluntarily
removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT),
Tributyl Tin Oxide (TBTO)
HP follows these guidelines to decrease the
environmental impact of product packaging:
Eliminate the use of heavy metals such
as lead, chromium, mercury and
cadmium in packaging materials.
Eliminate the use of ozone-depleting
substances (ODS) in packaging
materials.
Design packaging materials for ease
of disassembly.
Maximize the use of post-consumer
recycled content materials in
packaging materials.
Use readily recyclable packaging
materials such as paper and
corrugated materials.
Reduce size and weight of packages
to improve transportation fuel
efficiency.
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