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TABLE OF CONTENTS
1.
GENERAL
Installation ......................................................................... 4
Connections ....................................................................... 5
Location and Function of Controls .................................... 8
2.
DISASSEMBLY
............................................................ 9
3.
ELECTRICAL ADJUSTMENTS
4.
DIAGRAMS
4-1. Printed Wiring Board – RF Section – ................................ 17
4-2. Schematic Diagram – RF Section – ................................... 19
4-3. Schematic Diagram – MAIN Section – ............................. 23
4-4. Printed Wiring Board – MAIN Section – .......................... 27
4-5. IC Pin Function Description .............................................. 33
5.
EXPLODED VIEWS
6.
ELECTRICAL PARTS LIST
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
........................... 15
................................................... 35
.................................... 41
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properites
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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