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This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
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HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
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La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
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Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
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HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 12...
Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”...
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• HP PartSurfer mobile site (http://partsurfermobile.hp.com) Item Description Spare part Customer self number repair (on page 6) System battery 234556-001 Optional Three-slot PCIe riser board* 779085-001 Mandatory Two-slot PCIe riser board* 779084-001 Mandatory Dedicated iLO management module 779095-001 Mandatory HP 550-W Power Supply (non-hot-plug)
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— — a) 4-bay LFF hot-plug Mini-SAS cable for connection 782464-001 Mandatory to the onboard storage controller or to an HP H-series Host Bus Adapter** b) 4-bay or 12-bay LFF hot-plug Mini-SAS cable for 782465-001 Mandatory connection to an HP Smart Array P-series...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
• T-10/T-15 Torx screwdriver • HP Insight Diagnostics (on page 87) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
Get help to lift and stabilize the product during installation or removal, especially when the • product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.
Extend the server from the rack (on page 26). If you are performing service procedures in an HP, Compaq branded, Telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.
• Remove the fan cage (on page 33). Remove the security bezel (optional) To access the front panel components, unlock and then remove the security bezel. The security bezel is only supported in servers that are using the quick-release latch rack ears. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.
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WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack. Do one of the following: In a server that uses thumbscrew rack ears, loosen the captive thumbscrews that secure the server faceplate to the front of the enclosure, and then slide the server out of the enclosure.
After performing the installation or maintenance procedure, slide the server back into the enclosure, and then press the server firmly into the enclosure to secure it in place. Do one of the following: In a server that uses thumbscrew rack ears, tighten the captive thumbscrews. In a server that uses quick-release latch rack ears, if necessary, tighten the shipping screws.
Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.
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WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
Secondary PCI riser cage If expansion boards with internal cabling are installed on the PCI riser cage, disconnect all internal cables from the expansion boards to completely remove the cage from the server. Remove the air baffle CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed.
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Remove the air baffle in an upward direction as shown in the following image. If a PCI riser cage has a half-length expansion board installed on it, do the following: Release the expansion board cables from the air baffle cable clip. Removal and replacement procedures 32...
Remove the air baffle in the direction shown in the following image. Remove the fan cage To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 26).
Remove the fan cage. Non-hot-plug drive carrier CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive. Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
To remove the component: Back up all server data on the drive. Determine the status of the drive from the drive LED definitions ("HP SmartDrive LED definitions" on page 99). Removal and replacement procedures 36...
Remove the hot-plug drive. To replace the component, reverse the removal procedure. Access panel CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Lift and remove the access panel. To replace the component, reverse the removal procedure. 8-bay SFF hot-plug drive cage assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the SFF hot-plug drive cage. To replace the component, reverse the removal procedure. 4-bay and 8-bay LFF non-hot-plug drive cable assemblies WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
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Remove the fan cage (on page 33). Prepare the non-hot-plug drive cable assembly for removal: Disconnect the Mini-SAS and drive power cables from the system board. Release the Mini-SAS and drive power cables from the front chassis cable clips. — 4-bay LFF non-hot-plug drive cable disconnections —...
4-bay LFF non-hot-plug drive cable assembly removal 8-bay LFF non-hot-plug drive cable assembly removal To replace the component, reverse the removal procedure. 4-bay and 8-bay LFF hot-plug drive backplanes This procedure shows the removal of the 4-bay and 8-bay LFF drive backplanes from a 12-bay LFF hot-plug drive configuration.
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To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove all drives ("Hot-plug drive" on page 36) and drive blanks ("Hot-plug drive blanks"...
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Remove the drive backplane. If you are removing the 8-bay LFF hot-plug drive backplane, do the following: Disconnect the following cables from the drive backplane: — BP2 drive power cable — 12-bay LFF drive identification signal cable — Mini-SAS Y-cable Release the Mini-SAS Y-cable from the front chassis cable clip.
Remove the drive backplane. To replace the component, reverse the removal procedure. HP Smart Storage Battery WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. Remove the HP Smart Storage Battery from its holder. To replace the component, reverse the removal procedure.
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CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
Remove the cache module. To replace the component, reverse the removal procedure. Optical drive WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the optical drive. To replace the component, reverse the removal procedure. Fan and fan blank Fan population guidelines Configuration Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay 5 One processor, non-redundant Blank Blank Blank Blank One processor, redundant...
• In a redundant fan mode: If one fan fails, the system continues to operate without redundancy. This condition is indicated by a flashing amber Health LED. If two fans fail, the system shuts down. • The minimum fan requirement to make this server bootable is: Two fans (fans 2 and 5) for a single processor configuration Four fans (fans 1, 2, 4, and 5) for dual processor configuration Fan blank...
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Remove the air baffle in an upward direction as shown in the following image. If a PCI riser cage has a half-length expansion board installed on it, do the following: Release the expansion board cables from the air baffle cable clip. Removal and replacement procedures 50...
Remove the air baffle in the direction shown in the following image. Remove the fan blank. To replace the component, reverse the removal procedure. Hot-swap fan WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
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To remove the component: If a full-length expansion board is installed in the server, do the following: Power down the server (on page 26). Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 26).
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Release the expansion board cables from the air baffle cable clip. Remove the air baffle in the direction shown in the following image. Disconnect the fan cable. Removal and replacement procedures 53...
Remove the fan. To replace the component, reverse the removal procedure. DIMM WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
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Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
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CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. IMPORTANT: If installing a processor with a faster speed, update the system ROM before installing the processor.
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Remove the processor from the processor retaining bracket. To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board.
Install the heatsink: Position the heatsink on the processor backplate. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel.
Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 26). Remove the server from the rack (on page 29). Remove the access panel ("Access panel" on page 37). Remove the PCI riser cage ("Remove the PCI riser cages"...
If an expansion board is installed in the PCI riser cage, remove the board ("Expansion board" on page 61). Remove the PCIe riser board. Two-slot PCIe riser board Three-slot PCIe riser board To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock.
Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HP UEFI System Utilities" on page 84) to reconfigure the system. To replace the component, reverse the removal procedure.
Enabling the dedicated iLO management module The onboard NIC 1/shared iLO connector is set as the default system iLO connector. To enable the dedicated iLO management module, use the iLO 4 Configuration Utility accessible within the HP UEFI System Utilities.
For more information on the HP UEFI System Utilities, see the UEFI documentation on the HP website (http://www.hp.com/go/ProLiantUEFI/docs). IMPORTANT: If the iLO configuration settings are reset to the default values, remote access to the machine will be lost. Access the physical machine and repeat the procedure described in this section to re-enable the dedicated iLO management connector.
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Disconnect the front I/O assembly cable. — Front I/O cabling disconnection in an LFF chassis — Front I/O cabling disconnection in an SFF chassis Remove the front I/O assembly from the chassis: Removal and replacement procedures 67...
Front I/O assembly removal in an LFF chassis Front I/O assembly removal in an SFF chassis To replace the component, reverse the removal procedure. Quick-release latch rack ear assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
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Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove the server from the rack (on page 29). Remove the access panel ("Access panel" on page 37). If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage ("Remove the PCI riser cages"...
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Remove the cable cover behind the right quick-release latch rack ear. Remove the right quick-release latch rack ear assembly. Removal and replacement procedures 70...
Remove the left quick-release latch rack ear. Pull tab cage for SFF chassis using quick-release latch rack ears CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Power down the server (on page 26).
Remove the right quick-release latch rack ear screws, and then move the ear away from the right side of the pull tab cage. Remove the pull tab cage. To replace the component, reverse the removal procedure. System board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
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CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags. To remove the system board: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
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Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. Remove the processor from the processor retaining bracket.
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Remove the failed system board. To replace the system board: Install the system board. Removal and replacement procedures 75...
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Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Remove the clear processor socket cover. Retain the processor socket cover for future use. Removal and replacement procedures 76...
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Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: Do not press down on the processor.
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Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Install the processor socket cover onto the processor socket of the failed system board. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.
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Finish the installation by completely tightening the screws in the same sequence. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board. Install the fan cage. Install the air baffle. Install the PCI riser cages. Install the access panel.
Press the Esc key to exit RBSU. Press the F10 key to confirm exiting RBSU. The server automatically reboots. HP 550-W Power Supply (non-hot plug) WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Remove the HP Smart Storage Battery holder. Disconnect all power supply cables from the system board and any associated component (drive backplane, GPU, etc.). Remove the non-hot-plug power supply. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part.
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If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board. Removal and replacement procedures 82...
• Simplified Chinese (http://www.hp.com/support/Gen9_TSG_zh_cn) The HP ProLiant Gen9 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: •...
Diagnostic tools HP UEFI System Utilities The HP UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including: • Configuring system devices and installed options •...
OS installation if the defaults are restored. To avoid this issue, use the User Defined Defaults feature in UEFI System Utilities to override the factory default settings. For more information, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs).
Embedded UEFI shell The system BIOS in all HP ProLiant Gen9 servers includes an Embedded UEFI Shell in the ROM. The UEFI Shell environment provides an API, a command line prompt, and a set of CLIs that allow scripting, file manipulation, and system information.
HP ProLiant Pre-boot Health Summary. For additional information, see the HP iLO 4 User Guide on the HP website (http://www.hp.com/go/ilo) or the HP ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting.
HP Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system. The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy).
OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB 2.0 devices through legacy USB support, which is enabled by default in the system ROM. USB 3.0 ports are not functional before the OS loads. The native OS provides USB 3.0 support through appropriate xHCI drivers.
USB 3.0 connector (in servers using quick-release latch rack ears) USB 2.0 connector (in servers using thumbscrew rack ears) • 8-bay SFF drive model Item Description HP Universal Media Bay (box 1, for the optical drive cage option) Component identification 90...
Right side—Default iLO account information label and the QR code label Use your mobile device to scan the QR code label to display the server mobile product page (http://www.hp.com/qref/dl180gen9). This page contains links to server setup information, spare part numbers, QuickSpecs, troubleshooting resources, and other useful product links.
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• Front panel LEDs and buttons in an LFF chassis with quick-release latch rack ears • Front panel LEDs and buttons in an SFF chassis with thumbscrew rack ears • Front panel LEDs and buttons in an SFF chassis with quick-release latch rack ears Component identification 92...
Item Description Status Power supply LED Solid green = Normal Off = One or more of the following conditions exists: • Power is unavailable • Power supply failed • Power supply is in standby mode • Power supply error PCIe riser board slot definitions Slot 2-slot PCIe3 riser 1, 2...
System board components Item Description FlexibleLOM sideband signal connector System battery Primary PCIe riser board connectors* Dedicated iLO module connector microSD card slot Reserved SATA optical drive connector Internal USB 3.0 connector (for USB flash devices) Front USB 3.0 connector (for the USB 3.0 connector on the right quick-release latch rack ear) Mini-SAS connector 1 Mini-SAS connector 2...
Description Fan connector 1 Reserved 12-bay LFF drive identification signal connector GPU power connector 24-pin power supply connector HP Smart Storage Battery connector 20-pin drive power connector 16-pin power supply sideband signal connector 10-pin RPS connector Processor 2 NMI header...
IMPORTANT: Before using the S7 switch to change to Legacy BIOS Boot Mode, be sure the HP Dynamic Smart Array B140i Controller is disabled. Do not use the B140i controller when the server is in Legacy BIOS Boot Mode.
16-bay SFF hot-plug drive model HP SmartDrive LED definitions HP SmartDrives are the latest HP drive technology, and they are supported beginning with ProLiant Gen8 servers and server blades. The HP SmartDrive is not supported on earlier generation servers and server blades.
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When a drive is configured as a part of an array and connected to a powered-up controller, the drive LEDs indicate the condition of the drive. Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update.
For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• Drives connected to an HP Smart Array Controller option Item Description Drive power cable Mini SAS Y-cable 12-bay LFF hot-plug SAS/SATA drive cabling Item Description 12-bay LFF drive identification signal cable Drive power cables Mini-SAS Y-cable to the box 2 drives (8-bay LFF backplane)
• Drives connected to an HP Smart Array Controller option Item Description Drive power cable Mini-SAS Y-cable 16-bay SFF hot-plug SAS/SATA drive cabling • Drives connected to two HP Smart Array P440 Controllers Item Description Drive power cable Mini-SAS Y-cable to the box 3 drives...
• Drives connected to an HP Smart Array P840 Controller Item Description Drive power cables Mini-SAS Y-cable to the box 2 drives Mini-SAS Y-cable to the box 3 drives FBWC module backup power cabling The FBWC solution is a separately purchased option. This server only supports FBWC module installation when an HP Smart Array P-Series controller is installed.
Fan cabling Item Description Fan 1 cable Fan 2 cable Fan 3 cable Fan 4 cable Fan 5 cable HP 550-W Power Supply cabling (non-hot-plug) Item Description 24-pin power supply cable Cabling 110...
Item Description 16-pin power supply sideband signal cable Front panel cabling • Front panel cabling in an LFF chassis with thumbscrew rack ears Item Description Ambient temperature sensor cable USB 2.0 connector cable Front I/O cable • Front panel cabling in an LFF chassis with quick-release latch rack ears Description Item Cabling 111...
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Description Item Ambient temperature sensor cable Front I/O cable USB 3.0 connector cable • Front panel cabling in an SFF chassis with thumbscrew rack ears Item Description Ambient temperature sensor cable Front I/O cable • Front panel cabling in an SFF chassis with quick-release latch rack ears Item Description Ambient temperature sensor cable...
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Item Description USB 3.0 connector cable Cabling 113...
40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft). The approved hardware configurations for this system are listed on the HP website (http://www.hp.com/servers/ASHRAE).
* These dimensions apply to all server models. Power supply specifications The server supports the HP 550-W Power Supply (PN 730941-B21). This is an Entry Level Power Supply product for HP ProLiant servers. For more information about the power supply features, specifications, and compatibility, see the HP website (http://www.hp.com/go/proliant/powersupply).
American Society of Heating, Refrigerating and Air-Conditioning Engineers backplane Customer Self Repair file allocation table FBWC flash-backed write cache graphics processing unit host bus adapter HP SIM HP Systems Insight Manager Integrated Lights-Out Integrated Management Log Acronyms and abbreviations 116...
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large form factor Lights-Out Management nonmaskable interrupt NVRAM nonvolatile memory Optical Disk Drive PCIe Peripheral Component Interconnect Express POST Power-On Self Test RBSU ROM-Based Setup Utility REST representational state transfer redundant power supply serial attached SCSI SATA serial ATA Secure Digital small form factor Acronyms and abbreviations 117...
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Systems Insight Manager HP Service Pack for ProLiant Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification universal serial bus xHCI Extensible Host Controller Interface Acronyms and abbreviations 118...
Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.
36 drive cage, removing 38 hot-swap fan 51 drive carrier 34 HP Insight Diagnostics 87 drive LEDs 99 HP Insight Diagnostics survey functionality 87 drive numbering 99 HP ProLiant Pre-boot Health Summary 87 drives, determining status of 99 Index 120...
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HP Smart Storage Battery cabling 109 operating systems supported 87 HP SmartDrive LED definitions 99 optical drive 47 HP Systems Insight Manager (SIM) 87, 89 optical drive cabling 109 HP technical support 6 HP Trusted Platform Module option 81 HP Universal Media bay 90...
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serial label pull tab 90, 91 serial number 86, 90 server specifications 113 server warnings and cautions 24, 25 SFF drive cage 38 specifications, environmental 113 specifications, mechanical 113 specifications, power supply 114 specifications, server 113 SPP 87 static electricity 23 symbols on equipment 23 system board 72 system board battery 109...