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This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Contents Customer self repair ........................5 Parts only warranty service ......................... 5 Illustrated parts catalog ....................... 15 Mechanical components ........................... 15 System components ..........................18 Removal and replacement procedures ................... 23 Required tools ............................23 Safety considerations ..........................23 Preventing electrostatic discharge ....................23 Symbols on equipment ........................
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Specifications ..........................82 Environmental specifications ........................82 Mechanical specifications ........................82 Power supply specifications ........................82 HP 1200 W CS HE Power Supply (94%) specifications ..............82 Acronyms and abbreviations ......................84 Documentation feedback ......................86 Index ............................87 Contents 4...
HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
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HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
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La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
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Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
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HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 11...
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5) Access panel 696239-001 Mandatory Air baffle 696238-001 Mandatory Front cage assembly 696240-001 Optional PCIe riser cage 662526-001 Optional Hard drive blank 667276-001 Optional Hardware blank kit 662519-001 Mandatory a) FlexibleLOM blank*...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
System components Item Description Spare part number Customer self repair (on page 5) System components Hot-plug fan module 696241-001 Mandatory Power supply, hot-plug 1200 W, Platinum Plus, 660185-001 Mandatory Processors — — a) 2.4-GHz Intel Xeon processor E5-4657L v2 733831-001 Optional 115W b) 2.7-GHz Intel Xeon processor E5-4650 130W* 687963-001...
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Item Description Spare part number Customer self repair (on page 5) o) 3.3-GHz Intel Xeon processor E5-4627 v2* 733838-001 Optional p) 2.9-GHz Intel Xeon processor E5-4617 130W* 687970-001 Optional Heatsink, standard efficiency 662522-001 Optional Drives Hot-plug SAS drives — — a) 300-GB, 10,000-rpm, SFF, 6G, dual port 653955-001 Mandatory...
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662525-001 Optional Power supply backplane 662528-001 Mandatory FlexibleLOM — — a) HP 1GbE 4-port, 331FLR Adapter FIO Kit 634025-001 Mandatory b) HP 10GbE 2-port, 530FLR Adapter FIO Kit* 649869-001 Mandatory c) HP Ff 10Gb 2-port, 554FLR-SFP+ Adapter FIO 634026-001 Mandatory...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 66) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.
If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components. For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.racksolutions.com/hp).
The sliding rails could pinch your fingers. Remove the server from the rack To remove the server from an HP, Compaq branded, telco, or third-party rack: Power down the server (on page 25).
Access the Systems Insight Display To access the HP Systems Insight Display: Press and release the panel. After the display fully ejects, rotate the display sideways to view the LEDs. Access the product rear panel Opening the cable management arm To access the server rear panel: Release the cable management arm.
Open the cable management arm. The cable management arm can be right-mounted or left-mounted. Release the full-length expansion board retainer To remove the component: Power down the server (on page 25). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server.
If any full-length expansion boards are installed, do one of the following: Remove the primary PCIe riser cage ("PCIe riser cage (primary)" on page 31) Remove the secondary PCIe riser cage ("PCIe riser cage (secondary)" on page 32) Remove the air baffle. To replace the component, reverse the removal procedure.
PCIe riser blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. To remove the component: Power down the server (on page 25). Remove all power: Disconnect each power cord from the power source.
Remove the access panel ("Access panel" on page 29). Disconnect any external cables that are connected to the expansion board. Disconnect any internal cables that are connected to the expansion board. If any full-length expansion boards are installed, release the full-length expansion board retainer (on page 28).
Remove the secondary PCIe riser cage. To replace the component, reverse the removal procedure. PCIe riser board WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power.
Remove the PCIe riser board. To replace the component, reverse the removal procedure. Drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the drive blank.
Remove the drive. To replace the component, reverse the removal procedure. Power supply blank Remove the blank. To replace the component, reverse the removal procedure. AC power supply CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. To replace the component, reverse the removal procedure. Power supply backplane WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server.
To avoid damage to server components, all fan modules must be installed in fan bays for any processor configuration. For all processor configurations, the HP ProLiant DL560 Gen8 Server requires six fan modules for redundancy. A fan failure causes a loss of cooling redundancy. A second fan failure or a missing fan module causes an orderly shutdown of the server.
The server shuts down in the following temperature-related scenarios: • At POST and in the OS, HP iLO performs an orderly shutdown if a cautionary temperature level is detected. If the server hardware detects a critical temperature level before an orderly shutdown occurs, the server performs an immediate shutdown.
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Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove any attached network cables. Extend the server from the rack (on page 25). Remove the access panel ("Access panel" on page 29). Remove the primary PCIe riser cage ("PCIe riser cage (primary)"...
Install the PCIe riser cage ("PCIe riser cage (primary)" on page 31). Install the access panel ("Access panel" on page 29). Slide the server into the rack. Connect the LAN segment cables. Connect each power cord to the server. Connect each power cord to the power source. Power up the server.
IMPORTANT: If any cables in the front panel assembly need replacing, the entire front panel assembly must be replaced. Remove the four T-10 Torx screws from each side, and then remove the front panel assembly. To replace the component, reverse the removal procedure. Flash-backed write cache procedures Two types of procedures are provided for the FBWC option: •...
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Back up all data. Close all applications. Power down the server (on page 25). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.
If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the connector on the top of the cache module. To replace the component, reverse the removal procedure. CAUTION: To prevent damage to the cache module during installation, be sure the cache module is fully inserted before pressing down.
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If the capacitor pack is connected to the cache module, disconnect the capacitor pack cable from the connector on the top of the cache module. Disconnect the SAS hard drive backplane ribbon cable. Remove the capacitor pack. Single capacitor pack holder: Removal and replacement procedures 44...
Set up a recovery server using an identical server model. Do not install any internal drives or FBWC in this server. (HP recommends this option.) Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requirements for drive and array migration.
If the drives are migrated to different drive positions or there are volumes present in the recovery server, a 1724 POST message appears, stating that logical drive configuration has been updated automatically. Expansion slot blanks WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server.
Expansion boards Half-length expansion board WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
To remove the component: Power down the server (on page 25). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Extend the server from the rack (on page 25). Remove the access panel ("Access panel"...
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Disconnect each power cord from the power source. Disconnect each power cord from the server. Extend the server from the rack (on page 25). Remove the access panel ("Access panel" on page 29). Remove the air baffle ("Air baffle" on page 29). Remove the heatsink.
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To replace the component: Remove the thermal interface protective cover from the heatsink. Install the heatsink. Install the air baffle ("Air baffle" on page 29). Install the access panel ("Access panel" on page 29). Slide the server into the rack. Connect each power cord to the server.
Power up the server. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server.
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Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.
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To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.
Install the heatsink. Install the air baffle ("Air baffle" on page 29). Install the access panel ("Access panel" on page 29). Slide the server into the rack. Connect each power cord to the server. Connect each power cord to the power source. Power up the server.
Disconnect each power cord from the server. Extend the server from the rack (on page 25). Remove the access panel ("Access panel" on page 29). Remove the air baffle ("Air baffle" on page 29). Remove the DIMM. To replace the component, reverse the removal procedure. For DIMM configuration information, see the server user guide.
Disconnect each power cord from the server. Extend the server from the rack (on page 25). Remove the access panel ("Access panel" on page 29). Remove the secondary PCIe riser cage ("PCIe riser cage (secondary)" on page 32), if installed. CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the expansion boards.
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Remove the access panel ("Access panel" on page 29). Remove the air baffle ("Air baffle" on page 29). Remove the PCIe riser cage ("PCIe riser cage (primary)" on page 31). If installed, remove the secondary PCIe riser cage ("PCIe riser cage (secondary)"...
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To replace the component: Install the spare system board. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 59...
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Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket.
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Install the heatsink. IMPORTANT: Install all components with the same configuration that was used on the failed system board. Install all components removed from the failed system board. Install the access panel ("Access panel" on page 29). Install the power supplies ("AC power supply"...
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.
FBWC cabling • SFF FBWC cabling • PCIe option Depending on the server configuration, you may need to remove the primary PCIe riser cage ("PCIe riser cage (primary)" on page 31) before cabling to a PCIe expansion board. Cabling 65...
• Simplified Chinese (http://www.hp.com/support/ProLiant_TSG_v1_sc) The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: •...
Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the HP RBSU Information Library (http://www.hp.com/go/rbsu/docs). Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
USB support and functionality USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.
Component identification Front panel components Item Description Video connector Serial pull tab USB connector Fan module Hot-plug hard drive Systems Insight Display Front panel LEDs and buttons Component identification 69...
** Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the power button cable is disconnected. Systems Insight Display LEDs The HP Systems Insight Display LEDs represent the system board layout. The display enables diagnosis with the access panel installed. Item...
Item Description Status NIC link/activity Off = No link to network. If the power is off, view the rear panel RJ-45 LEDs for status ("Rear panel LEDs and buttons" on page 73). Flashing green = Network link and activity Solid green = Network link AMP status Off = AMP modes disabled Solid green = AMP mode enabled...
Systems Insight Display Health LED System power Status LED and color Amber Power supply (amber) • Only one power supply is installed and that power supply is in standby. • Power supply fault • System board fault Amber Green Power supply (amber) •...
Video connector iLO connector Serial connector FlexibleLOM ports (Shown: 4x1Gb/Optional: 2x10Gb); port 1 on right side Rear panel LEDs and buttons Item Description Status Power supply 1 Off = System is off or power supply has failed. Solid green = Normal Power supply 2 Off = System is off or power supply has failed.
FL/FH denotes full-length, full-height. HL/FH denotes half-length, full-height. LP denotes low profile. The PCIe 2-slot x16 riser cage supports a maximum power of 150 W with an HP power cable. This cable must be used for PCIe board wattages greater than 75 W.
Processor 1 DIMM slots (7-12) Processor 1 socket System maintenance switch Position Default Function Off = HP iLO security is enabled. On = HP iLO security is disabled. Off = System configuration can be changed. On = System configuration is locked. Reserved Reserved Off = Power-on password is enabled.
NMI feature preserves that information by performing a memory dump before a hard reset. To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO Virtual NMI feature. For more information, see the HP website (http://www.hp.com/support/NMI). Component identification 76...
DIMM slot locations DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the letter assignments for population guidelines. Hot-plug drive bay numbering Hot-plug drive LED definitions Component identification 77...
Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity No drive activity Do not remove Solid white Do not remove the drive.
FBWC module LEDs (P222, P420, P421) The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing. 1 - Amber 2 - Green 3 - Green Interpretation The cache module is not powered.
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The server shuts down in the following temperature-related scenarios: • At POST and in the OS, HP iLO performs an orderly shutdown if a cautionary temperature level is detected. If the server hardware detects a critical temperature level before an orderly shutdown occurs, the server performs an immediate shutdown.
Weight (maximum) 18.59 (41.00) Weight (minimum) Power supply specifications The server is configured with the HP 1200 W CS HE Power Supply (94%) ("HP 1200 W CS HE Power Supply (94%) specifications" on page 82). HP 1200 W CS HE Power Supply (94%) specifications...
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9.1 A at 100 VAC Rated input current 6.7 A at 200 VAC 897 W at 100V AC input Maximum rated input power 1321 W at 200V AC input 3408 at 120V AC input Btus per hour 4433 at 200V to 240V AC input Power supply output 800 W at 100V AC input Rated steady-state power...
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