1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
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1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.
1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
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1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...
2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Standard Battery Li-ion, 830mAh Stand by TIME Up to 200 hrs : Paging Period 9, RSSI 85dBm Talk time Up to 200min : GSM Tx Level 7 Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm) Charging time Approx.
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2. PERFORMANCE Item Description Specification Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio BER (Class II) < 2.439% @-100 dBm RX Level Report Accuracy 3 dB 8 3 dB...
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2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% System frequency 2.5ppm (13 MHz) tolerance 32.768KHz tolerance 30ppm...
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2. PERFORMANCE Item Description Specification Forced shut down Voltage 3.33 0.03 V 1 Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 830mAh Switching-mode charger Travel Charger Input: 100 ~ 240 V, 50/60 Hz Output: 5.2 V, 800 mA - 14 -...
3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Power Transceiver (SKY77328, U500) The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedancematching circuitry for 50 Ω...
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3. TECHNICAL BRIEF SKY77328 PAM Pin Configuration-20-Pin Figure 6. Typical Case Makings Leadless (Top View) Table 4. SKY77328 Pin Names and Signal Descriptions Mame Description Band Select VCC1A VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC) DCS/PCS IN RF input 1710-1910 MHz (DCS1800, PCS1900) GND IN RF input 824-915 MHz (GSM850/900)
3. TECHNICAL BRIEF 3.3 26 MHz Clock (VCTCXO, X500) The 26 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 26 MHz. It is used within the SKY77328, base band processor(AD6720,U101), Midi(U203, YMU762C-QZ) , CAMERA( U403,CL761A ) 2V75_VVCXO X500 VCONT...
3. TECHNICAL BRIEF 3.4 Baseband Processor (AD6720 , U101) • AD6720 is an ADI designed processor • AD6720 consists of 1. Control Processor Subsystem including: • 32-bit MCU ARM7TDMI® Control Processor • 39 MHz operation at 1.8V • 1Mb of on-chip System SRAM Memory 2.DSP Subsystem including: •...
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3. TECHNICAL BRIEF Figure 3-4 SYSTEM INTERCONECTION OF AD6720 EXTERNAL INTERFACE - 20 -...
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3. TECHNICAL BRIEF 3.4.1 Interconnection with external devices A. RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz B. LCD module interface The LCD module is controlled by CAMERA IC, CL761A If CL761A is in the state of by-pass mode, the LCD control signals from AD6720 are by-passed through CL761A.
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3. TECHNICAL BRIEF The backlight of LCD module is controlled by AD6720 via AAT3157 , U404. The control signals related to Backlight LED are given bellow. Signals Description MLED Current source for backlight LED LCD_DIM_CTL Control LCD backlight level in 16 steps MLED[1:2] This pins are returned-paths for backlight LED current source (MLED) Table 3-3.
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3. TECHNICAL BRIEF D. SIM interface The AD6720 provides SIM Interface Module. The AD6720 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required.
3. TECHNICAL BRIEF E. LDO Block There are 8 LDOs in the AD6720. - VCORE : supplies Digital baseband Processor core and AD6720 digital core - VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (1,8V or 2.8V, 150mA) - VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA) - VSIM : supplies the SIM interface circuitry on the digital processor and SIM card...
3. TECHNICAL BRIEF 3.6 Display and Interface • Main LCD Properties Spec. Unit Active Screen Size 35.78*40.05*2.8 Color Depth 65,536 colors Resolution 128 X RGB X 128 dots Controlled by L_MAIN_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, IFMODE, L_DATA[00:15] ports • L_MAIN_LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin •...
3. TECHNICAL BRIEF 3.7 Camera IC(CL761A , U403) This model has a built-in VGA(640 x 480) camera module. And the camera produces JPG pictures. Camera module is controlled by CL761A. Interface is done by I2C and YCbCr format. I2C is a control signal and YCbCr is real data interface signal.
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3. TECHNICAL BRIEF 2V85_VCAM CAMERA CTL IC 2V8_C_PWR 2V85_VCAM Q401 C408 C409 SI1305-E3 C_PWDN STATUS 0.1u HIGH DEACTIVE ACTIVE 2V85_VCAM C410 C411 C412 C413 C414 VDDS 0.1u 0.01u L_RESET_N L_DATA00 L_DA0 VDDL L_DATA01 L_DA1 L_DATA02 L_DA2 VDDI1 L_DATA03 L_DA3 VDDI2 L_DATA04 L_DA4 L_DATA05...
3. TECHNICAL BRIEF 3.8 Keypad Switches and Scanning The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 26 switches (Normal Key 24EA, Volume up down side key), connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in Figure 3-11, except for the power switch (KB1), which is connected independently.
3. TECHNICAL BRIEF 3.9 Microphone The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to AIN1P and AININ pins of AD6720. The voltage supply VMIC is output from AD6720, and is a biased voltage for the AIN1P.
3. TECHNICAL BRIEF 3.10 Main Speaker The main speaker is driven directly by AD6720 AOUT1P and AOUT1N pins and the gain is controlled by the PGA in an AD6720. The receiver is placed in the folder cover and connected to AOUT1x terminal via FPCB.
3. TECHNICAL BRIEF 3.11 Headset Interface This phone has 6 electrodes such as GND, AUXIP, AUXIN (this pin is floating), AUXOP, JACK_DETECT, HOOK_DETECT. This type supports mono sound Switching from Receiver to Headset Jack If jack is inserted, JACK_DETECT goes from low to high. Audio path is switched from receiver to earphone by JACK_DETECT interrupt.
3. TECHNICAL BRIEF 3.12 Key Back-light Illumination In key back-light illumination, there are 14 Blue LEDs in Main Board, which are driven by KEY_BACKLIGHT signal from AD6720. VBAT VBAT KEY BACKLIGHT Q300 R359 KEY_BACKLIGHT IMX9T110 Figure 3-15. KEY BACK-LIGHT ILLUMINTION - 34 -...
3. TECHNICAL BRIEF 3.14 VIBRATOR The vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator is driven from VIBRATOR (GPIO_0) of AD6720 VBAT R101 VBAT VIBRATOR R103 R104 Q100 R105 20K VIBRATOR R106 MOTOR 7.5K C117 EMZ2 4.7u...
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4. TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT U503. 5 (OUT) U503 U503. 3 (EN) CIRCUIT VBAT RF2V85 U503 MIC5255-2.85BM5 R522 CLKON C545 C546 C547 R523 100K 0.01u 4.7u Checking Flow Voltage at Level at Change main board Pin5 of U503 Pin3 of U503 Is 2.85V? Is high?
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4. TROUBLE SHOOTING (2) Checking FEM & Mobile SW TEST POINT Checking Flow X500.4 (VCC) VCTCXO Circuit is OK VCTCXO Circuit is OK 26 MHzO.K? See next Page to check See next Page to check Check Pin 3. Mobile SW Mobile SW Refer to Graph 4 -1(b) 2.75V OK?
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4. TROUBLE SHOOTING (3) Checking Mobile SW & FEM TEST POINT SW500.ANT C541 SW500 C540 SW500.RF VC_DCSPCS(VC1) FL500 VC_EGSM(VC2) FL500.10 (C533) FL500.12 (C533) CIRCUIT Waveform TP500 TP501 TP502 FL301. 10 R502 5.6nH VC_DCSPCS 1.5p C588 VC_EGSM R588 2.2nH SW500 KMS-506 ANT SW Control GSM&...
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4. TROUBLE SHOOTING Checking Flow For these 2 test case, No Call connection is needed Check SW500 Pin ANT,RF Open Changing SW500 with RF Cable connected. Check SW500 Pin ANT,RF Short Changing SW500 with No RF Cable Connected Check C540,C541 VC1 :Low Changing the Board.
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4. TROUBLE SHOOTING (4) Checking RX IQ TEST POINT CIRCUIT C523 U501 R514 XOUT 26M_DBB C526 C523 C526 Figure 5 Waveform Graph 3 Checking Flow Check C523,C526. Check if there is any Replace U501 Similar? Major difference Refer to graph 4-3 Redownload software and calibration again - 43 -...
4. TROUBLE SHOOTING 4.3 TX Trouble Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting (1)Check regulator circuit (2)Check VCTCXO (3)Check Mobile SW & FEM (4)Check PAM control signal (5)Check TX IQ...
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4. TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT U503. 5 U503 (OUT) U503. 3 (EN) Figure 6 CIRCUIT VBAT RF2V85 U503 MIC5255-2.85BM5 R522 CLKON C545 C546 C547 R523 100K 0.01u 4.7u Checking Flow Voltage at Level at Change main board Pin5 of U503 Pin3 of U503 Is 2.85V?
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4. TROUBLE SHOOTING (2) Checking VCTCXO Circuit TEST POINT Checking Flow X500.4 VCTCXO Circuit is OK VCTCXO Circuit is OK (VCC) 26 MHzO.K? Check Pin 3. See next Page to check See next Page to check Refer to Graph 4(b) Mobile SW Mobile SW X500...
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4. TROUBLE SHOOTING Checking Flow For the test, TX Stand alone Mode is needed. Refer to chapter 11 (PL=7 for GSM, PL=2 for DCS) Check C540,C541 Check whether Ant SW Check VC_EGSM, Changing board Set as TX mode VC_DCSPCS Refer to Graph 5 Refer to Table 4-3 Check RF Level of Pin9 : ~29.5dBm...
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4. TROUBLE SHOOTING (4) Checking PAM Control Signal TEST POINT CIRCUIT VBAT R500 PA_BAND R501 PA_EN C505 C506 U500 ENABLE SKY77328 U500 GSM_IN DCS_PCS_IN R503 (TX_RAMP) C519 C520 0.01u 0.01u R502 (PAM_EN) R513 TX_RAMP C522 Figure 9 Waveform Graph 6 Checking Flow Check TX_RAMP and PA_EN Check TX_RAMP and PA_EN...
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4. TROUBLE SHOOTING (5) Checking TX IQ TEST POINT Waveform U501 C523 C526 Graph 7 Figure 10 CIRCUIT C523 R514 XOUT 26M_DBB C526 Checking Flow Check if there is Similar? Replace U101 Any Major Difference Refer to Graph7 Redownload the Software And calibrate - 50 -...
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4. TROUBLE SHOOTING Checking Flow START Check Battery Voltage Charge or Change Battery > 3.35V Push power-on key Check the contact of power key And check the level change Or dome-switch of PWRKEY Check the voltage of Replace U101 The LDO outputs at U101 VCORE=1.8V VVCXO=2.75V VMEM=2.8V...
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4. TROUBLE SHOOTING Checking Flow START Resolder the CN300 I/O Connector(CN300) Pin 4,5 : VCHARGE Is well-soldered ? Pin12,19 : GND The TA is out of order Voltage at anode of Change the TA D101 = 5.2V ? Resolder the Q102,D101,R129 are Q102, D101, R129 well-soldered?
4. TROUBLE SHOOTING 4.6 Vibrator Trouble TEST POINT Q100.6 Q100.1 R103 Q100 R106 R105 Q300.3 R101 (Q100.2) Soldering C heck in LC D Module Figure 13 CIRCUIT VBAT R101 VBAT VIBRATOR R103 R104 Q100 R105 20K VIBRATOR R106 MOTOR 7.5K C117 EMZ2 4.7u...
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4. TROUBLE SHOOTING Checking Flow SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu START Is the voltage at pin 3 Check the soldering of R105, R106 of Q100 high ? Resolder R105, R106 Check the soldering Is the voltage at pin 2 of R101...
4. TROUBLE SHOOTING 4.7 LCD Trouble TEST POINT FL604 FL602 FL600 CN600 FL603 FL601 Figure 14 Camera Module conne ction Connect or ( 24Pin, m ale ) LCD Mo dule LCD Mo dule connection connector( 6 0Pin, m ale ) Figure 15 - 57 -...
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4. TROUBLE SHOOTING Checking Flow START Is the connection of FPCB with connector on Reassemble FPCB with CN600 connector PCB(CN600) ok ? Check the connection LCD Reassemble LCD module with connector on FPCB module with connector On FPCB ? Check the soldering of Resoldering CN600 CN600 ? Change the FPCB and try again...
4. TROUBLE SHOOTING 4.8 Camera Trouble TEST POINT FL608 FL607 FL606 FL605 CN601 Q401 U403 Figure 16 Camera Module Connector ( 24Pin, Fem ale ) Camera Module Figure 17 - 59 -...
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4. TROUBLE SHOOTING Checking Flow START Does the LCD itself Go to the LCD trouble Has no trouble ? Replace the U403 Change the camera Check the voltage Check the voltage module, Does it work of pin 3 of of pin 1 of properly ? Q401 is 3V ? Q401 LOW ?
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4. TROUBLE SHOOTING Checking Flow START Check the signal level Re-Place U204 ofU204.17 = 2.85V? Check the state of Replace speaker contact of dual mode speaker Speaker Working well!! - 62 -...
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4. TROUBLE SHOOTING Checking Flow START Change the SIM Card. Our phone Does the SIM cards supports only 3V SIM card. supports 3V ? Voltage output Voltage at pin1 of Resolder J100 of VSIM LDO J100 is 2.85V? Is 2.85V? Replace J100 Change the SIM Card Redownload SW.
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4. TROUBLE SHOOTING Checking Flow START Resolder J200 Does the audio Level at pin1 profile of the phone Replace U201 of U201 is high change to the earphone mode? Resolder component Set the audio part of the test equipment to Download software Set the audio part of the test Change the earphone...
4. TROUBLE SHOOTING 4.12 KEY backlight Trouble TEST POINT R359 Q300 Figure 21 - 67 -...
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4. TROUBLE SHOOTING CIRCUIT VBAT VBAT KEY BACKLIGHT Q300 R359 KEY_BACKLIGHT IMX9T110 Checking Flow START Is the level at R359 Check U101 High? Are all LEDs Check the soldering Working? each R and LED Replace or resoldering Backlight will work properly. component - 68 -...
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4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. START Does waveform at Replace main board R133 and R135 fluctuate? Is CN600 connected...
4. TROUBLE SHOOTING 4.14 Microphone Trouble TEST POINT C220 R208 R219 C223 R217 Figure 23 CIRCUIT DIAGRAM 2V5_VMIC R213 R215 C219 C215 2.2K R216 R217 VINNORP MIC200 C220 C221 C223 0.1u R219 OB4-15L42-C33L VINNORN R220 2.2K CLOSE TO MIC - 71 -...
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4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode START Voltage VMIC of U101 Replace U101 = DC 2.5V? Check the signal Level at each side Replace microphone of MIC200. Is it a few tens mV AC? Check the soldering of Resolder component...
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4. TROUBLE SHOOTING Checking Flow START Is the voltage level at R113 Check the soldering of R113. about 1.2V Replace X100and try again. RTC will work properly - 74 -...
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4. TROUBLE SHOOTING Checking Flow Indication LED only operates in trickle charging mode. START VBAT is 3.6~4. Check the soldering of VBAT(R048/R406) Check the soldering of Is LED working? Q400, Q101,LD400, LED will work properly - 76 -...
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4. TROUBLE SHOOTING Checking Flow START Is there the magnet Place the magnet properly. in the folder side? Voltage at pin 1 Voltage of VMEM at U101 of U400 = 2.8V? = 2.8V? Resolder U400 Replace U101 Open folder. Resolder R400 and U400 Voltage at pin 1 of U400 =2.8V Close folder.
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5. DOWNLOAD B. Multi Download Procedure 1. Run GSM Multi Download program and select Setting - 80 -...
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5. DOWNLOAD 2. Select Configuration from the menu and you may see this window 3. Press key to select DLL file and press Open KG225.dll - 81 -...
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5. DOWNLOAD 4. Press key to select the mot files 5. Select AlchemyData.mot and press open 6. Repeat step 4-5 to select CodeData.mot - 82 -...
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5. DOWNLOAD 7. Check if the ADI option is set to Hermes 8. Press OK to end Configuration Select Rate - 83 -...
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5. DOWNLOAD 9. Press START to execute download 10. Once downloading is started, press STOP button to keep from re-downloading after downloading is completed. - 84 -...
Date Sign & Name Sheet/ Sheets C153 C154 12 / 19 BUTTERFLY(KG225) MODEL Designer 2005 Checked DRAWING NAME Approved OJ100 OJ101 OJ102 OJ103 DRAWING VER-1.1 LG Electronics Inc. Iss. Notice No. Date Name LG(42)-A-5505-10:01 LG Electronics Inc. - 87 -...
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C227 2.2K 0.1u C228 C229 SPVSS CLOSE TO MIC Section Sign & Name Date Sheet/Sheets MODEL BUTTERYFLY(KG225) Designer Checked DRAWING AUDIO NAME Approved DRAWING Iss. Notice No. Date Name VER-1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 88 -...
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R342 KEY_COL2 R343 KEY_COL3 R344 KEY_COL4 VBAT VBAT KEY BACKLIGHT Q300 Section Date Sign & Name R359 Sheet/Sheets KEY_BACKLIGHT MODEL BUTTERFLY(KG225) Designer IMX9T110 Checked DRAWING MMI,I/O NAME Approved DRAWING VER-1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 89 -...
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C421 MLED2 C450 100K 2V85_VCAM Section Date Sign & Name Sheet/ Sheets MODEL BUTTERFLY(KG225) Designer Checked DRAWING CAMERA IC/ CHARGE PUMP NAME Approved DRAWING Iss. Notice No. Date Name VER-1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 90 -...
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R523 C545 C546 C547 100K 0.01u 4.7u Section Date Sign & Name Sheet/Sheets MODEL BUTTERFLY(KG225) Designer 5 / 6 Checked DRAWING NAME Approved DRAWING Iss. Notice No. Date Name VER-1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 91 -...
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INOUT_A2 INOUT_B2 C_RST INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 Section Date Sign & Name Sheet/ MODEL Sheets BUTTERFLY(KG225) Designer Checked DRAWING LCD CONNECTOR NAME Approved DRAWING VER-1.1 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 92 -...
9. ENGINEERING MODE 9. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
9. ENGINEERING MODE 9.1 BB Test [MENU 1] 9.1.1 CAMERA This menu is to test the Camera. 1) Main LCD preview : It shows the picture on Main LCD. 9.1.2 LED This menu is to test the LED. 1) Green On 2) Green Off 3) Red On 4) Red Off...
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9. ENGINEERING MODE 9.1.7 ADC (Analog to Digital Converter) This displays the value of each ADC. 1) MVBAT ADC : Main Voltage Battery ADC 2) AUX ADC : Auxiliary ADC 3) TEMPER ADC : Temperature ADC 9.1.8 BATTERY 1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order : BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT...
9. ENGINEERING MODE 9.2 RF Test [MENU 2] 9.2.1 SAR test This menu is to test the Specific Absorption Rate. 1) SAR test on : Phone continuously process TX only. Call-setup equipment is not required. 2) SAR test off : TX process off 9.3 MF mode [MENU 3] This manufacturing mode is designed to do the baseband test automatically.
9. ENGINEERING MODE 9.3.7 MicSpk Test The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically. 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call timer [MENU 5] This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
10. STAND ALONE TEST 10. STAND ALONE TEST 10.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test - this is to see if the transmitter of the phones is activating normally. B.
10. STAND ALONE TEST 10.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button Figure 10-1.
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10. STAND ALONE TEST Figure 10-2. HW test setting Figure 10-3. Ramping profile - 102 -...
11. AUTO CALIBRATION 11. AUTO CALIBRATION 11.1 Overview Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply). Auto-cal generates calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
11. AUTO CALIBRATION JTAG2 JTAG1 Status ADI-REMOTE TI-REMOTE POWER VBAT UART Status POWER Figure 11-2 The top view of Test JIG 11.3 Test Jig Operation Power Source Description Power Supply Usually 4.0V Table 11-2 Jig Power Switch Number Name Description Switch 1 ADI-REMOTE In ON state, phone is awaked.
1. Connect as Fig 11-2 (RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general.) 2. Run Hot_Kimchi.exe to start calibration. 3. From the Calibration Lib menu, Select F3000, then, Press APPLY! KG225 - 105 -...
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11. AUTO CALIBRATION 4. Press Calibration START KG225 KG225 This model is KG220) Test band : GSM900/DCS 1800/PCS 1900 Max target : dfasdf - 106 -...
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11. AUTO CALIBRATION 5. Select RF Cable Loss value from the Offset menu 6. Press START to execute calibration KG225 - 107 -...
11. AUTO CALIBRATION 11.5 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
Black MPBT02 PAD,CAMERA MPBT0025102 KG225 camera pad(upper rib) Black MTAA00 TAPE,DECO MTAA0105701 CAMERA DECO Black MTAB00 TAPE,PROTECTION MTAB0098002 KG225 FOLDER CAMERA DECO PROTECTION TAPE Black MTAB01 TAPE,PROTECTION MTAB0098003 KG225 FOLDER_CAMERA_PROTECTION_TAPE Black MTAZ00 TAPE MTAZ0107501 CAMERA WINDOW TAPE Black MWAE00 WINDOW,CAMERA...
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Pi5.8 5Kgf, CAN Type, Prexco(Head R1.0) Deep Silver MIDZ00 INSULATOR MIDZ0090201 KG225 FPCB INSULATOR Black MLAC00 LABEL,BARCODE MLAC0003401 EZ LOOKS(user for mechanical) MPBZ00 MPBZ0132201 KG225 LOWER CAMERA PAD Black MTAB00 TAPE,PROTECTION MTAB0097801 PROTECTION TAPE<MAIN WINDOW> Black MTAB01 TAPE,PROTECTION MTAB0116101 KG225 PROTECTION TAPE MTAZ00 TAPE...
12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0041902 PCB ASSY, SACB00 SACB0027601 FLEXIBLE,INSERT SBCL00...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C105 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C106 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C107 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C108 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C109 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C110 CAP,CERAMIC,CHIP ECCH0004904...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C145 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C146 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C147 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C148 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C149 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C150 CAP,CERAMIC,CHIP ECCH0000120...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C301 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C302 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C303 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C304 CAP,CERAMIC,CHIP ECCH0000120...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C514 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C515 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C516 INDUCTOR,CHIP ELCH0005001 2.2 nH,S ,1005 ,R/TP , C519 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C520 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C521...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CONNECTOR, 60 PIN,0.4 mm,STRAIGHT ,AU ,STACKING HEIGHT 1.5 / CN600 ENBY0013008 BOARD TO BOARD SOCKET FOR LCM FPCB D100 DIODE,SWITCHING EDSY0017301 VSM ,15 V,100 mA,R/TP ,PB-FREE D101 DIODE,SWITCHING EDSY0012101...
Page 118
12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R106 RES,CHIP ERHY0000258 7.5K ohm,1/16W,J,1005,R/TP R109 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R110 RES,CHIP ERHY0000229 300 ohm,1/16W,J,1005,R/TP R111 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R112 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R113 RES,CHIP ERHY0000512...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R215 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R216 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R217 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R218 RES,CHIP ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP R219 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R220 RES,CHIP ERHY0000247...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R430 RES,CHIP ERHY0000262 12K ohm,1/16W,J,1005,R/TP R431 RES,CHIP ERHY0000262 12K ohm,1/16W,J,1005,R/TP R499 RES,CHIP ERHY0000274 51K ohm,1/16W,J,1005,R/TP R500 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R501 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R502 INDUCTOR,CHIP ELCH0005014...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SW500 CONN,RF SWITCH ENWY0002301 ANGLE ,SMD ,0.8 dB, 80-ACTIVE BALL STACKED CSP ,88 PIN,R/TP ,128 MLC U100 EUSY0206101 NOR (L30 : TYAX) / 64-PSRAM / PB FREE U101 EUSY0280001 CSP_BGA ,289 PIN,R/TP ,GSM Onechip Baseband...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C312 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C313 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C314 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C315 CAP,CERAMIC,CHIP ECCH0004904...
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12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R336 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R339 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R341 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R342 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R343 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R344 RES,CHIP ERHY0000237...