Table of Contents
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TABLE OF CONTENTS
1.
Setting Up the Phone ...................................................... 3
Making and Receiving Calls ........................................... 3
2.
......................................................... 5
3.
.............................................................. 7
4.
ELECTRICAL ADJUSTMENTS
Base Unit ......................................................................... 10
Handset ............................................................................ 13
5.
5-1. Block Diagram - BASE UNIT Section - ...................... 17
5-2. Block Diagram - HANDSET Section - ........................ 18
Schematic Diagrams ....................................................... 19
5-4. Printed Wiring Board - BASE RF Section - ................ 20
5-5. Schematic Diagram - BASE RF Section - ................... 21
5-6. Printed Wiring Board - BASE MAIN Section - ........... 22
5-7. Schematic Diagram - BASE MAIN Section - ............. 23
5-8. Printed Wiring Board - HAND RF Section - ............... 24
5-9. Schematic Diagram - HAND RF Section - .................. 25
5-10. Printed Wiring Board - HAND MAIN Section - ........ 26
5-11. Schematic Diagram - HAND MAIN Section - ............ 27
5-12. IC Pin Function Description ........................................... 29
6.
7.
2
................................................ 31
............................... 33
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
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