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5-4.
PRINTED WIRING BOARD – BASE RF Section –
1
A
ANT
A
B
BASE MAIN
GND
BOARD
(Page 22)
VCC
LE
DATA
C
CLK
D
E
F
CLK
DATA
LE
VCC
G
GND
ANT
H
• Semiconductor
Location
Ref. No.
Location
D302
C-5
D303
C-3
IC302
F-4
Q301
B-3
Q302
C-4
Q306
A-4
Q307
B-4
Q312
C-3
20
2
3
BASE RF BOARD
(COMPONENT SIDE)
L310
1
6
C303
FT301
L303
3
4
C315
C301
L301
L302
C304
R302
C307
E
C306
C
C309
R361
L351
L352
(SHIELD CASE)
R309
C336
C337
TP
R307
C314
(RX VCO)
R328
C312
+
C339
C338
BASE RF BOARD
(CONDUCTOR SIDE)
R397
R398
C380
R399
C381
R332
C335
L306
C321
C326
C327
R322
C308
05
4
C375
L355
C376
L356
C371
C368
R354
C372
L354
Q307
R351
L357
B C E
B
C366
C369
C351
E
C310
C370
C364
C341
R352
R353
C365
A
K
C363
D302
R348
C325
Q302
+
C360
B C E
R303
R339
R321
C390
R330
R327
R331
R340
C358
L304
C344
R306
C333
C311
C379
13
12
C397
IC302
C346
R317
24
1
C386
R341
C343
C342
L350
(
(
PRINTED
RT301
COIL
C349
L309
5
6
L351-357
(PRINTED COIL)
(SHIELD CASE)
MOD
TX
L353
GND
LO
TP(TX VOC)
GND
IF
11
(11)
1-675-273-
R316
IF
GND
LO
R359
GND
TX
C382
MOD
11
1-657-273-
(11)
7
B
BASE MAIN
BOARD
(Page 22)
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