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Specifications - Sanyo HIP-205BA3 General Installation Manual

Hit photovoltaic modules

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SPECIFICATIONS

Notes on Specification
(1)
Rated electrical characteristics are
within 10% of the values measured at
Standard Test Conditions (STC). STC are:
Irradiance
of
1000W/m,
temperature, and solar spectral irradiance
per IEC 60904-3.
Mechanical / Electrical Specifications
Ele ctric a l Spe c ific atio n
M o de l
C e ll Num be r in S e rie s
R a te d P o we r, Wa tts (P m a x)
M a xim um P o we r Vo lta ge (Vpm )
M a xim um P o we r Curre nt (Ipm )
Ope n C ircuit Vo lta ge (Vo c )
S ho rt Circ uit Curre nt (Is c )
C e ll Type
M a xim um S ys te m Vo lta ge (Vo c )
F a c to ry Ins ta lle d B ypa s s Dio de s
M e c ha nica l Spe c ific a tio n
M o de l
Le ngth, m m (inc he s )
Width, m m (inc he s )
F ra m e Depth , m m (inc he s )
We ight, kg (po unds )
*HIT = Hetero junction with Intrinsic Thin-layer
(2)
The current output for the modules
shown in the Specifications is
measured at Standard Test Conditions.
These conditions may not be frequently
observed in actual practice.
(3)
Under normal conditions, a
photovoltaic module may experience
conditions that produce more current
and/or voltage than reported at
standard component test conditions.
Accordingly, the values of Isc and Voc
marked on UL listed modules should
be multiplied by a factor of 1.25 when
determining voltage ratings, conductor
capacities, fuse sizes, and size of
controls connected to the module output.
USA: Refer to Section 690-8 of the
U.S. National Electrical Code for an
additional multiplying factor of 1.25
which may be applicable.
Mechanical Loading
The modules should be mounted at the
four quarter points by the means shown
in Figure 3.1 and 3.2. This method offers
a maximum loading of 2400N/m
in a static state) on the module surface.
WIRING
General
All wiring should be done in accordance
with
applicable
Wiring
accordance with the NEC in USA or
25℃
cell
CEC in Canada.
All wiring should be done by a
qualified, licensed professional.
All HIP -xxxBA3 M o de ls (xxx = o utput po we r)
2 0 5
2 0 0
19 5
96
96
96
205
200
195
56.7
55.8
55.3
3.62
3.59
3.53
68.8
68.7
68.1
3.84
3.83
3.79
HIT*
HIT*
HIT*
600
600
600
4
4
4
205
200
195
Wiring should be protected to help
ensure personal safety and to prevent its
damage.
All modules connected in series
should be of the same model number
and/or type.
Do not connect modules in parallel
without using a connection box.
Module Wiring
The maximum number of modules
that can be wired in series is seven (7).
The SANYO solar modules are not
designed for "off-grid" or battery charging
systems. It is not recommended to use
them to charge batteries.
These
installed bypass diodes. If these modules
are incorrectly connected to each other,
the bypass diodes, cables, or junction
box may be damaged.
Array Wiring
The term "array" is used to describe the
assembly of several modules on a
support structure with associated wiring.
Use copper wire that is sunlight resistant
2
(50PSF,
and
is
insulated
maximum possible system open circuit
voltage.
Check your local codes for
requirements.
3
electrical
codes.
methods
should
be
19 0
18 6
18 0
17 5
96
96
96
96
190
186
180
175
54.8
54.4
54.0
52.9
3.47
3.42
3.33
3.31
67.5
67.0
66.4
65.7
3.75
3.71
3.65
3.64
HIT*
HIT*
HIT*
HIT*
600
600
600
600
4
4
4
4
190
186
180
175
1319 (51.9)
894 (35.2)
35 (1.4)
14 (30.9)
modules
contain
factory
to
withstand
Earth Ground Wiring
Grounding should be carried out by
the securement to the module or array
frame to avoid the hazards of electric
shock or fire. The array frame shall
in
be grounded in accordance with NEC
Article 250 (USA) or CEC in Canada. 
Each framed module has a hole in the
shorter side frame rail, to connect a
grounding conductor to the module
metal frame (see Figure 2).
All HIP -xxxB A5 M o de ls (xxx = o utput po we r)
2 0 5
2 0 0
19 5
19 0
96
96
96
96
205
200
195
190
56.7
55.8
55.3
54.8
3.62
3.59
3.53
3.47
68.8
68.7
68.1
67.5
3.84
3.83
3.79
3.75
HIT*
HIT*
HIT*
HIT*
600
600
600
600
4
4
4
205
200
195
190
60(2.4)
Ground Location (1 place)
Ground hole
Junction Box
Label
Backside
The ground hole is
on the inside of the
module frame.
Figure 2.
Module Ground Position
the
18 6
18 0
96
96
186
180
54.4
54
3.42
3.33
67.0
66.4
3.71
3.65
HIT*
HIT*
600
600
4
4
4
186
180

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