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Huawei ME909u-523 Hardware Manual

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HUAWEI ME909u-523 LTE LGA Module
Hardware Guide
Issue
01
Date
2014-05-24

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Summary of Contents for Huawei ME909u-523

  • Page 1 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Issue Date 2014-05-24...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
  • Page 3 HUAWEI ME909u-523 LTE LGA Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2014-05-24 Creation Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright © Huawei Technologies Co., Ltd.

  • Page 4: Table Of Contents

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Contents Contents 1 Introduction............................ 7 2 Overall Description ........................8 2.1 About This Chapter ........................... 8 2.2 Function Overview ........................... 8 2.3 Circuit Block Diagram ........................10 2.4 Application Block Diagram ......................11 3 Description of the Application Interfaces ................
  • Page 5 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Contents 3.12 RF Antenna Interface ........................41 3.13 Tunable Antenna Control ......................44 3.14 Reserved Interface ........................45 3.15 NC Interface ..........................45 4 RF Specifications ......................... 46 4.1 About This Chapter ......................... 46 4.2 Operating Frequencies ........................
  • Page 6 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Contents 6.8 Assembly Processes ........................69 6.8.1 General Description of Assembly Processes ................ 69 6.8.2 Stencil Design ........................69 6.8.3 Reflow Profile ........................70 6.9 Specification of Rework ........................71 6.9.1 Process of Rework ........................ 71 6.9.2 Preparations of Rework ......................

  • Page 7: Introduction

    Introduction Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI ME909u-523 LTE LGA module (hereinafter referred to as the ME909u-523 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the ME909u-523 module.

  • Page 8: Overall Description

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the ME909u-523 module and provides:  Function Overview  Circuit Block Diagram  Application Block Diagram 2.2 Function Overview...
  • Page 9 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Overall Description Feature Description See the HUAWEI ME909u-523 LTE LGA Module AT Command Commands Interface Specification. Application One standard USIM (Class B and Class C) interface Interface Audio interface: PCM interface (145-pin LGA interface) USB 2.0 (High Speed)

  • Page 10: Circuit Block Diagram

    [3]: The firmware function is planning. [4]: These interfaces are reserved for intelligent module in future. 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the ME909u-523 module. The major functional units of the ME909u-523 module contain the following parts: ...

  • Page 11: Application Block Diagram

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Overall Description 2.4 Application Block Diagram Figure 2-2 Application block diagram of the ME909u-523 module UART Interface: The module supports 3 UART interfaces. Two are 4-wire UARTs. The one is 2-wire UART, which is only for debugging.

  • Page 12: Description Of The Application Interfaces

    Reserved Interface  NC Interface 3.2 LGA Interface The ME909u-523 module uses a 145-pin LGA as its external interface. For details about the module and dimensions, see "6.4 Dimensions and Interfaces". Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright © Huawei Technologies Co., Ltd.
  • Page 13 Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the ME909u-523 module. Figure 3-1 Sequence of LGA interface (Top view) Figure 3-2 shows the appearance of ME909u-523 module. One is top view, and the other is bottom view. Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright ©...
  • Page 14 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-2 Appearance of ME909u-523 module (without label) Table 3-1 shows the definitions of pins on the 145-pin signal interface of the ME909u-523 module. Table 3-1 Definitions of pins on the LGA interface...
  • Page 15 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type The firmware 0.45 function is planning. Reserved Reserved, must keep this pin open. Reserved Reserved, must keep this pin open.
  • Page 16 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type control signal, bit 2 0.45 The firmware function is planning. ANT_TUNE3 Tunable antenna 1.35 control signal, bit 3 The firmware 0.45...
  • Page 17 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type Not connected, please keep this pin open. Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 18 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type Ground GPIO General Purpose 1.35 I/O pins. The 0.45 function of these pins has not been 1.17 defined.
  • Page 19 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type output 0.45 Reserved Reserved, must keep this pin open. UART0_RTS UART0 Ready for 1.35 receive 0.45 Reserved Reserved, must keep this pin open.
  • Page 20 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type SIM_RESET SIM reset 1.8/2.85 SIM_DATA SIM data 1.8/2.85 SIM_CLK SIM clock 1.8/2.85 Reserved Reserved, must keep this pin open.
  • Page 21 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type Not connected, please keep this pin open. ADC_2 Conversion VBAT interface for analog signals to digital signals...
  • Page 22 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type Not connected, please keep this pin open. Not connected, please keep this pin open. Not connected, please keep this pin open.
  • Page 23 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type Thermal Ground Pad, this pad needs thermal via. Thermal Ground Pad, this pad needs thermal via. Thermal Ground Pad, this pad needs thermal via.

  • Page 24: Power Interface

    Thermal Ground Pad 3.3.2 Power Supply VBAT Interface When the ME909u-523 module works normally, power is supplied through the VBAT pins and the voltage ranges from 3.3 V to 4.2 V (typical value: 3.8 V). The 145-pin LGA provides 2 VBAT pins and 38 GND pins for external power input. To ensure that the ME909u-523 module works normally, all the pins must be used efficiently.

  • Page 25: Output Power Supply Interface

    10 mA (typical value) for external level conversion or other applications. If the ME909u-523 module is in sleep mode, the output power supply interface is in the low power consumption state (< 500 μA). If the ME909u-523 module is in power down mode, the output power supply is in the disabled state.
  • Page 26 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces  System reset (RESIN_N) pin  WAKEUP_IN Signal (WAKEUP_IN) pin  WAKEUP_OUT Signal (WAKEUP_OUT) pin  SLEEP_STATUS Signal (SLEEP_STATUS) pin  LED control signal (LED_MODE) pin Table 3-3 lists the pins on the signal control interface.

  • Page 27: Power-On/Off (Power_On_Off) Pin

    Please connect the WAKEUP_IN pin if you need to use the High-Speed UART normally in future. High-Speed UART can work only while WAKEUP_IN pin is high, or it stops working. 3.4.2 Power-on/off (POWER_ON_OFF) Pin The ME909u-523 module can be controlled to be powered on/off by the POWER_ON_OFF pin. Power-On Time Sequence After VBAT has been applied and is stable, the POWER_ON_OFF signal is pulled down, and then the module will boot up.

  • Page 28: Resin_N Pins

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Power-Off Time Sequence Figure 3-5 Power off timing sequence Table 3-5 Power off timing Parameter Comments Time (Nominal values) Units POWER_ON_OFF turn off time. 3.5–5.0 POFF POWER_ON_OFF Valid to USB +0.5...

  • Page 29: Wakeup_In Signal

    For example, the AT command automatically reports ^SYSSTART. Figure 3-8 Reset pulse timing The RESIN_N pin must not be pulled down for more than 1s. Otherwise, the ME909u-523 module will be powered off. 3.4.4 WAKEUP_IN Signal Table 3-3 shows the definition of the WAKEUP_IN signal.

  • Page 30: Wakeup_Out Signal

    WAKEUP_IN pin is the authorization signal of ME909u-523 module entering sleep mode. If the signal is pulled up to high level (1.8 V), ME909u-523 module cannot enter sleep mode. If this pin is not connected, it will keep in low level by default. But if you need to use the High-Speed UART in future, you must connect this pin.

  • Page 31: Sleep_Status Signal

    The external devices can get to know whether the module is in sleep mode by reading SLEEP_STATUS pin. When SLEEP_STATUS pin is in high level, ME909u-523 module is in wakeup state. When SLEEP_STATUS pin is in low level, ME909u-523 module is in sleep state.

  • Page 32: Led_Mode Pin

    Figure 3-12 shows recommended circuit of the SLEEP_STATUS pin. Figure 3-12 Connections of the SLEEP_STATUS pin 3.4.7 LED_MODE Pin ME909u-523 module provides a LED_MODE signal to indicate the work status. Table 3-6 State of the LED_MODE pin Operating Status LED_MODE No service/Restricted service Outputs: low (0.1s)-high (0.1s)-low...

  • Page 33: Uart Interface

    Figure 3-13 Driving circuit 3.5 UART Interface 3.5.1 Overview The ME909u-523 module provides two UART interfaces for asynchronous communication channels. They are UART0 (4-wire UART) and UART1 (4-wire UART). The UART2 (2-wire UART) is for debugging only. Customers should layout two test points for them in case of system trouble shooting and analysis.

  • Page 34: Circuit Recommended For The Uart Interface

    Figure 3-14 Connection of the UART interface in the ME909u-523 module (DCE) with the host (DTE) The RS-232 chip can be used to connect the ME909u-523 module with UART. In this connection, the Complementary Metal Oxide Semiconductor (CMOS) logic level and the Electronic Industries Association (EIA) level are converted mutually.

  • Page 35: Usb Interface

    The level of RS-232 Transceivers must match that of the ME909u-523 module. 3.6 USB Interface The ME909u-523 module is compliant with USB 2.0 High speed protocol. The USB interface is powered directly from the VBAT supply. The USB signal lines are compatible with the USB 2.0 signal specifications.

  • Page 36: Usim Card Interface

    USIM card 3.7.2 Circuit Recommended for the USIM Card Interface As the ME909u-523 module is not equipped with an USIM socket, you need to place an USIM socket on the user interface board. Figure 3-16 shows the circuit of the USIM card interface.

  • Page 37: Audio Interface

    Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the ME909u-523 module. 3.8 Audio Interface ME909u-523 module provided one PCM digital audio interface. Table 3-10 lists the signals on the digital audio interface. The firmware function is planning. Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright ©...
  • Page 38 1.35 0.45 The ME909u-523 module PCM interface enables communication with an external codec to support linear format. Figure 3-17 Circuit diagram of PCM interface (ME909u-523 module is used as PCM master)  PCM_SYNC: output when PCM is in master mode.

  • Page 39: General Purpose I/O Interface

    Description of the Application Interfaces 3.9 General Purpose I/O Interface The ME909u-523 module provides 5 GPIO pins for customers to use for controlling signals which are worked at 1.8 V CMOS logic levels. Customers can use AT command to control the state of logic levels of 5 GPIO output signal. About the details...
  • Page 40 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Table 3-13 Signals on the JTAG interface Pin Name Description Parameter Min. (V) Typ. (V) Max. (V) Type JTAG_TMS JTAG test mode 1.17 select –0.3 0.63 JTAG_TRST_N JTAG test reset 1.17...

  • Page 41: Rf Antenna Interface

    MU509, MC509 and MU609.  JTAG_SRST_N must be dealt with ESD protection as follow. The 1 kΩ resistor and 4.7 nF capacitor must be placed as close as possible to ME909u-523 module. Figure 3-18 ESD protection of JTAG_SRST_N 3.12 RF Antenna Interface The ME909u-523 module provided three antenna pads (MAIN_ANT, GPS_ANT and AUX_ANT) for connecting the external antennas.
  • Page 42 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces Route the antenna pad as close as possible to antenna connector. In addition, the impedance of RF signal traces must be 50 Ω. Figure 3-19 RF signal trace design about MAIN_ANT for reference (the same for AUX &...
  • Page 43 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Description of the Application Interfaces For the PCB designed by the user, the impedance of all the RF signal tracks must be 50 Ω. Generally, the impedance depends on the medium factor, track width, and distance from the floor.

  • Page 44: Tunable Antenna Control

    Please use impedance simulation tool to calculate RF MAIN pad impedance. The RF MAIN pad dimension of ME909u-523 is 1.1 mm (L) x 0.9 mm (W). You can get the impedance with lower than 50 Ω calculated by the impedance simulation tool. Since the target impedance is 50 Ω...

  • Page 45: Reserved Interface

    9, 10, 16–20, 27, 35, Reserved Reserved, please 43–46, 60–69, 92 keep open 3.15 NC Interface The ME909u-523 module has 23 NC pins. All NC pins should not be connected. Please keep these pins open. Table 3-17 NC pins PIN No. Description Min. (V) Typ.

  • Page 46: Rf Specifications

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the ME909u-523 module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 47: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP TS 51.010-1, 3GPP TS 34.121-1 and 3GPP TS 36.521-1 test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.

  • Page 48: Conducted Transmit Power

    According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-4 lists the required ranges of the conducted transmit power of ME909u-523. Table 4-4 ME909u-523 conducted Tx power (unit: dBm)

  • Page 49: Antenna Design Requirements

    In addition, the transmission line from the antenna port of ME909u-523 module to the antenna is also part of the antenna. The line loss increases with the line length and the frequency. It is recommended that the line loss is as low as possible.
  • Page 50  Antenna direction The primary antenna must be placed as near as possible to the ME909u-523 module to minimize the line length. The secondary antenna needs to be installed perpendicularly to the primary antenna. The secondary antenna can be placed farther away from the ME909u-523 module.

  • Page 51: Interference

    The antenna consists of the antenna body and the relevant RF transmission line. Take the RF transmission line into account when measuring any of the preceding antenna indicators.  Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module.

  • Page 52: Antenna Requirements

    Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.

  • Page 53: Electrical And Reliability Features

     EMC and ESD Features 5.2 Absolute Ratings Table 5-1 lists the absolute ratings for the ME909u-523 module. Using the ME909u-523 module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings for the ME909u-523 module...

  • Page 54: Electrical Features Of Usim

    Ambient temperature for storage °C [1]: When the ME909u-523 module works at this temperature, all its RF specifications comply with the 3GPP and 3GPP2 (CDMA) RF specifications. [2]: The temperatures outside of the range –20°C to +70°C; the module might slightly deviate from the 3GPP and 3GPP2 (CDMA) RF specifications.

  • Page 55: Power Supply Features

    The value for each digital pad refer to "Typ." column DD_PX in Table 3-1 . 5.6 Power Supply Features 5.6.1 Input Power Supply Table 5-5 lists the requirements for input power of the ME909u-523 module. Table 5-5 Requirements for input power for the ME909u-523 module Parameter Min. Typ.

  • Page 56: Power Consumption

    Table 5-7 to Table 5-10 . The power consumption listed in this section are tested when the power supply of ME909u-523 module is normal voltage (3.8 V), and all of test values are measured at room temperature.
  • Page 57 Module is powered up. DRX cycle=8 (2.56s) Module is registered on the network, and no data is transmitted. USB is in active. Table 5-9 Averaged Data Transmission DC power consumption of ME909u-523 module Description Band Test Value Units Power (dBm)

  • Page 58: Reliability Features

    USB is in active; The Rx power of GPS is –130 dBm. GPS tracking 5.6.3 Reliability Features Table 5-11 lists the test conditions and results of the reliability of the ME909u-523 module. Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright © Huawei Technologies Co., Ltd.
  • Page 59 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Electrical and Reliability Features Table 5-11 Test conditions and results of the reliability of the ME909u-523 module Item Test Condition Standard Sample Results size Temperature: –40ºC Stress Low-temperature  JESD22- 3 pcs/group Visual inspection: ok...
  • Page 60 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample Results size  Salty fog test Temperature: 35°C JESD22- 3 pcs/group Visual inspection: ok A107-B  Density of the NaCl Function test: ok solution: 5%±1% RF specification: ok ...

  • Page 61: Emc And Esd Features

    The following are the EMC design comments:  Attention should be paid to static control in the manufacture, assembly, packaging, handling, storage process to reduce electrostatic damage to HUAWEI module. Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright © Huawei Technologies Co., Ltd.
  • Page 62 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Electrical and Reliability Features  RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit.
  • Page 63  Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. The ME909u-523 module does not include any protection against overvoltage. Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright © Huawei Technologies Co., Ltd.

  • Page 64: Mechanical Specifications

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the process design and mechanical specifications:  Storage Requirement  Moisture Sensitivity  Dimensions and Interfaces  Packaging  Label  Customer PCB Design ...

  • Page 65: Dimensions And Interfaces

    6.4 Dimensions and Interfaces Figure 6-1 shows the dimensions in details. Figure 6-1 Dimensions (unit: mm) 6.5 Packaging HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. Huawei Proprietary and Confidential Issue 01 (2014-05-24)
  • Page 66 HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications The following figure shows the packaging. Module quantity per tray: 5 x 9 = 45 pcs/tray Use vacuum packages; five trays per carton; module quantity per carton: 5 x 45 = 225pcs/carton.

  • Page 67: Label

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications 6.6 Label The label is made from deformation-resistant, fade-resistant, and high-temperature-resistant material and is able to endure the high temperature of 260°C. Figure 6-2 ME909u-523 label The picture mentioned above is only for reference.

  • Page 68: Heat Dissipation Solution

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-3 Footprint design of customer's PCB (unit: mm) 6.7.3 Heat Dissipation Solution  The copper size on the PCB must be 70 mm x 70 mm or larger.  All copper ground layers of the PCB must be connected to each other through via-holes.

  • Page 69: Requirements On Pcb Layout

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications 6.7.5 Requirements on PCB Layout  To reduce deformation, a thickness of at least 1.0 mm is recommended.  Other devices must be located more than 3 mm (5 mm recommended) away from the LGA module.

  • Page 70: Reflow Profile

    Mechanical Specifications Figure 6-5 Recommended stencil design of LGA module (unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect.

  • Page 71: Specification Of Rework

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-6 Reflow profile Table 6-2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 60s–120s Heating rate: 0.5°C/s–2°C/s (40°C–150°C) Soak zone (t1–t2): 60s–120s Heating rate: < 1.0°C/s (150°C–200°C) Reflow zone (> 217°C) (t3–t4): 30s–90s...

  • Page 72: Preparations Of Rework

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications 6.9.2 Preparations of Rework Remove barrier or devices that can’t stand high temperature before rework.   If the device to be reworked is beyond the storage period, bake the device according to Table 6-1 .

  • Page 73: Module Installation

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Mechanical Specifications It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the rework. 6.9.5 Module Installation Install the module precisely on the module and ensure the right installation direction of the module and the reliability of the electrical connection with the PCB.

  • Page 74: Certifications

    7.1 About This Chapter This chapter gives a general description of certifications of ME909u-523 module. 7.2 Certifications Table 7-1 shows certifications the ME909u-523 module has been implemented. For more demands, please contact us for more details about this information. Table 7-1 Product Certifications...

  • Page 75: Safety Information

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.

  • Page 76: Traffic Security

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Safety Information Area indicated with the “Power off bi-direction wireless equipment” sign   Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security  Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.

  • Page 77: Laws And Regulations Observance

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.
  • Page 78 Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue 01 (2014-05-24)

  • Page 79: Appendix A Circuit Of Typical Interface

    HUAWEI ME909u-523 LTE LGA Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface Huawei Proprietary and Confidential Issue 01 (2014-05-24) Copyright © Huawei Technologies Co., Ltd.

  • Page 80: Appendix B Acronyms And Abbreviations

    HUAWEI ME909u-523 LTE LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project 8PSK 8 Phase Shift Keying Auxiliary Bit Error Rate BLER Block Error Rate BIOS...
  • Page 81 HUAWEI ME909u-523 LTE LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Electrostatic Discharge European Union Federal Communications Commission GMSK Gaussian Minimum Shift Keying GPIO General-purpose I/O GPRS General Packet Radio Service Global Positioning System Global System for Mobile Communication...
  • Page 82 HUAWEI ME909u-523 LTE LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Restriction of the Use of Certain Hazardous RoHS Substances SIMO Single-input multiple-output Short Message Service To Be Determined Total Isotropic Sensitivity Total Radiated Power...

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