Huawei MU509 Hardware Migration Manual
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Huawei MU509 Hardware Migration Manual

Huawei MU509 Hardware Migration Manual

30 mm × 30 mm lga module
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HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Issue
08
Date
2016-12-12

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Summary of Contents for Huawei MU509

  • Page 1 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Issue Date 2016-12-12...
  • Page 2 Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
  • Page 3 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2011-05-17 Creation 2013-10-11 Updated Updated the description related to LED pins Updated the description related to UART...
  • Page 4 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide About This Document Document Date Chapter Descriptions Version 2.3.2 Deleted the description related to MU609 2.3.2 Updated Figure 2-11 The recommended connection of the PCM interface in the LGA module 2.3.3...

  • Page 5: Table Of Contents

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Contents Contents 1 Overview ..........................7 2 LGA Interface Differences....................19 2.1 LGA Interfaces ..........................19 2.2 Control Interface Compatibility Design ..................20 2.2.1 Detailed Interface Differences....................20 2.2.2 Control Interface Design Guide .................... 21 2.3 Audio Interface Compatibility Design .....................
  • Page 6 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Contents 3.1 Dimension Differences ........................48 3.2 Customer PCB Design ........................49 3.2.1 PCB Pad Design ........................49 3.2.2 Requirements on PCB Layout ....................50 3.3 Assembly Processes ........................50 3.3.1 General Description of Assembly Processes ................

  • Page 7: Overview

    ME909u (including ME909u-521 and ME909u-523), MU709 (including MU709s-2 and MU709s-6), and ME909s (including ME909s-821 and ME909s-120) and precautions for compatibility design of the preceding modules. Table 1-1 Bands and Rates of Huawei 30 mm × 30 mm LGA modules Product Bands...
  • Page 8 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Product Bands Rates MU509-g WCDMA Band 1/5 GSM CS: UL 14.4 kbit/s; DL 14.4 kbit/s GSM/GPRS/EDGE: 1900 MHz/1800 GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s MHz/900 MHz/850 MHz EDGE: UL 236.8 kbit/s;...
  • Page 9 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Product Bands Rates MU709s-6 WCDMA Band 1/2/5 GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s GSM/GPRS/EDGE: 850 MHz/900 EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s MHz/1800 MHz/1900 MHz WCDMA PS: UL 384 kbit/s; DL 384 kbit/s HSPA+: UL 5.76 Mbit/s;...
  • Page 10 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Table 1-2 Overview of Huawei 30 mm × 30 mm LGA modules Product Interface Temperature Dimension (mm) MU509 1 x USIM Normal operating 30 × 30 × 2.6 temperature: –20°...
  • Page 11 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Product Interface Temperature Dimension (mm) ME209u- 1 x USIM Normal operating 30 × 30 × 2.35 temperature: –30° C 2 × 4 wire UART to +75° C 1 × 2 wire UART (Debug) Extended operating 1 ×...
  • Page 12 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Product Interface Temperature Dimension (mm) MU709 1 x USIM Normal operating 30 × 30 × 2.27 temperature: –20° C 1 x USIM_DET to +70° C 1 × 8 wire UART Extended operating 1 ×...
  • Page 13 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Figure 1-2 Huawei 30 mm × 30 mm LGA module block level functional compatibility HUAWEI Proprietary and Confidential Issue 08 (2016-12-12) Copyright © HUAWEI Technologies Co., Ltd.
  • Page 14 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Table 1-3 Differences of LGA Interfaces Pin No. Interface Description MU509 MC509 MU609 ME209u-526 ME909u MU709 ME909s Control WAKEUP_IN CMOS 2.6 V CMOS 2.6 V CMOS 1.8 V CMOS 1.8 V...
  • Page 15 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Pin No. Interface Description MU509 MC509 MU609 ME209u-526 ME909u MU709 ME909s 107, 111 ANT function Main (pin 107) Main (pin 107), Main (pin 107), Main (pin 107), Main (pin 107),...
  • Page 16 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Pin No. Interface Description MU509 MC509 MU609 ME209u-526 ME909u MU709 ME909s 28 and 29 UART2 Reserved Reserved 2-wire UART 2-wire UART 2-wire CMOS 1.8 V only CMOS 1.8 V only UART for debugging.
  • Page 17 Y=supported   You need to use a SIM/USIM card in MU509/MU609/ME909u/ME209u-526/ME909s/MU709 and a RUIM card in MC509. The electrical features of CMOS 2.6 V interfaces refer to Table 1-4 .  The electrical features of CMOS 1.8 V interfaces refer to Table 1-5 .
  • Page 18 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Overview Table 1-4 Electrical features of CMOS 2.6 V interfaces Parameter Description Minimum Value Maximum Value Unit High-level input voltage –0.3 Low-level input voltage High-level 2.15 output voltage Low-level output 0.45...

  • Page 19: Lga Interface Differences

    LGA Interface Differences 2.1 LGA Interfaces Huawei 30 mm × 30 mm LGA module provides 145 pads, on which pin 1 to pin 116 are defined as signal pins and pin 121 to pin 145 are defined as heat-dissipation ground pads.

  • Page 20: Control Interface Compatibility Design

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences 2.2 Control Interface Compatibility Design 2.2.1 Detailed Interface Differences Table 2-1 Differences of the control interfaces Pin No. Interface Name MU509 MC509 MU609 ME209u ME909u MU709...

  • Page 21: Control Interface Design Guide

    When WAKEUP_IN pin is in high level, the module is in the wakeup state. When WAKEUP_IN pin is in low level, MU509/MC509 will be forced into sleep state; MU609/ME209u-526/ME909u/MU709/ME909s will not be forced but be allowed into sleep state instead.
  • Page 22 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Table 2-3 Differences of WAKEUP_OUT interface Interface Name MU509 MC509 MU609 ME209u-526 ME909u MU709 ME909s Control WAKEUP CMOS 2.6 V CMOS 1.8 V _OUT Figure 2-4 The recommended connection of the WAKEUP_OUT pin R6 depends on the actual DTE requirements.
  • Page 23 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Figure 2-5 The recommended connection of the SLEEP_STATUS pin R8 depends on the actual DTE requirements. USIM_DET MU709/ME909s support USIM hot swap function. MU709/ME909s provide an input pin (USIM_DET) to detect whether the USIM card is present or not.
  • Page 24 Pin 45 works as the W_DISABLE signal by normalization. The MC509 supports this function. MU609, ME209u-526, MU709 and ME909u are now planning this pin for W_DISABLE signal, while this pin is GPIO for MU509. This signal requires an external pull-up resistor, which should be pulled up to VCC_EXT1 (pin 32) or VCC_EXT2 (pin 31).
  • Page 25 LGA Interface Differences Figure 2-7 The recommended connection of the W_DISABLE pin For MC509 and MU509, install R1, R3, and do not install R2; For MU609, ME209u-526, ME909u, MU709, and ME909s install R2, R3, and do not install R1. R4 depends on the DTE GPIO driver.
  • Page 26 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Figure 2-8 The recommended connection of the POWER_ON_OFF pin RESIN_N Table 2-8 Differences of RESIN_N interface Interface Name MU509 MC509 MU609 ME209u ME909u MU709 ME909s -526...

  • Page 27: Audio Interface Compatibility Design

    The RESIN_N pin must not be pulled down for more than 1s. 2.3 Audio Interface Compatibility Design 2.3.1 Detailed Interface Differences For PCM Audio, MU509, MC509, ME209u-526, ME909u, MU709 and ME909s differ on the level. For Analog Audio, MU509 and MC509 support Analog Audio, while ME209u-526, ME909u, MU709 and ME909s do not support Analog Audio.

  • Page 28: Pcm Interface Design Guide

      PCM_CLK: Output when PCM is in master mode. MU709 and ME909s support both master and slave mode; MC509, MU509 and ME909u-  521 only support master mode. The firmware of ME909u-523 and ME209u-526 does not support PCM function yet.

  • Page 29: Gpio Interface Compatibility Design

    33 pF 33 pF 2.4 GPIO Interface Compatibility Design Please note the different signal level of GPIO between MU509/MC509 and MU609/ME209u-526/ME909u/MU709/ME909s. The signal of MU509 and MC509 are CMOS 2.6 V and MU609, MU709, ME209u-526, ME909u and ME909s are CMOS 1.8 V.
  • Page 30 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Table 2-10 Differences of the GPIO interface ME909s Interface Name MU509 MC509 MU609 ME209u- ME909u MU709 GPIO GPIO CMOS 2.6 V GPIO Reserved Reserved Reserved GPIO GPIO CMOS 2.6 V...
  • Page 31 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Figure 2-14 Maintaining the resistance in sleep mode Module Module (Modem) (Modem) 1.8 V BB Chip BB Chip Low output level in sleep mode High output level in sleep mode...

  • Page 32: Antenna Interface Compatibility Design

    2.5.1 Detailed Interface Differences Please note that the difference of antenna among 30 mm × 30 mm LGA modules. MU509 only supports MAIN_ANT. MC509, MU609 and ME909u support MAIN_ANT, AUX_ANT (Diversity) and GPS_ANT. ME209u-526, MU709 and ME909s support MAIN_ANT and AUX_ANT (Diversity).

  • Page 33: Antenna Interface Design Guide

    107 (MAIN_ANT), pin 111 (GPS_ANT), and pin 115 (AUX_ANT). Pay attention to the interface differences among the MU509 and other 30 mm × 30 mm LGA modules. Table 2-12 Differences of the antenna interface in pad size and function...
  • Page 34 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Figure 2-17 The matching network for MAIN_ANT To implement 50 Ω impedance, the designer should adjust the components G_C1, G_L1, G_L2 and G_C2 shown in the preceding figure as required.
  • Page 35 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences MU509-b/MU509-c/MU509-g MU609/ME909u-521 ME209u-526/ME909u-523/MU709/ME909s /MC509 /MU509-65 RF Pad Design Take pin 107 for example: ME209u-526/ME909u-523/MU709 MU609/ME909u-521 MU509-b/MU509-c/MU509-g/MC509 /ME909s/MU509-65 HUAWEI Proprietary and Confidential Issue 08 (2016-12-12) Copyright © HUAWEI Technologies Co., Ltd.
  • Page 36 RF Interface for Module Migration Design  MU509/MC509, MU609/ME909u-521, and ME209u-526/ME909u- 523/MU709/ME909s/MU509-65 modules need to be compatible. We recommend that the RF interface design follow the design of MU509/MC509.  MU609/ME909u-521 and ME209u-526/ME909u-523/MU709/ME909s/MU509-65 modules need to be compatible. We recommend the RF interface design follow the design of MU609/ME909u-521.

  • Page 37: Vcc_Ext Interface Compatibility Design

     2.6 VCC_EXT Interface Compatibility Design Because the signal level of MC509 and MU509 is different from MU609, MU709, ME209u-526, ME909u and ME909s, there are two output supplies as for reference level. One is VCC_EXT2 (2.6 V), the other is VCC_EXT1 (1.8 V).

  • Page 38: Vbat Interface Compatibility Design

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences 2.7 VBAT Interface Compatibility Design 2.7.1 Detailed Interface Differences The VBAT voltage ranges from 3.3 V to 4.2 V, and it ranges from 3.2 V to 4.2 V for ME909s, with a typical value being 3.8 V.

  • Page 39: Jtag Interface Compatibility Design

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Figure 2-19 Recommended power circuit of MU509/MU609/ME209u- 526/ME909u/MU709/ME909s module Figure 2-20 Recommended power circuit of MC509 module Module (DCE) VBAT VBAT 10 μF 100 nF 220 μF 2.8 JTAG Interface Compatibility Design...

  • Page 40: Jtag Interface Design Guide

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Interface Name MC509 MU509 MU609 ME209u- ME909u MU709 ME909s JTAG_TDO JTAG_TDI JTAG_RTC CMOS 1.8 V Reserved CMOS 1.8 V PS_HOLD CMOS 1.8 V CMOS 1.8 V...

  • Page 41: Uart Interface Compatibility Design

    Figure 2-21 Circuit of the JTAG interface 2.9 UART Interface Compatibility Design 2.9.1 Detailed Interface Differences Please note that the different signal level of UART between MU509/MC509 and MU609/ME209u-526/ME909u/MU709/ME909s. The signal level of MU509/MC509 is CMOS 2.6 V and MU609/MU709/ME209u-526/ME909u/ME909s is CMOS 1.8 V.

  • Page 42: Uart Interface Design Guide

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Table 2-16 Differences of the UART interface Interface Name MU509 MC509 MU609 MU709 ME209u-526 ME909u ME909s UART UART0_DSR CMOS 2.6 V CMOS 1.8 V CMOS 1.8 UART0_RTS CMOS 2.6 V...
  • Page 43 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Figure 2-22 The recommended connection of the UART0 interface in the module (DCE) with the host (DTE) Figure 2-23 The recommended connection of the UART1 interface in the module (DCE)

  • Page 44: Usb Interface Compatibility Design

    2.10 USB Interface Compatibility Design 2.10.1 Detailed Interface Differences Please note that only MU609, MU709, ME209u-526, ME909u and ME909s support USB 2.0 High Speed. MC509 and MU509 do not support USB 2.0 High Speed. Table 2-17 Differences of the USB interface Interface...
  • Page 45 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences Figure 2-25 Recommended circuit of USB interface Requirements for USB signal layout and traces: USB_DM and USB_DP are required to control the differential imped ance 90 Ω.

  • Page 46: Led Interface Compatibility Design

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences "**" means do not install at first, but C1, C2 and C3 need to reserve the capacitor pads in order to deal with filter common and differential mode interference.

  • Page 47: Adc Interface Compatibility Design

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide LGA Interface Differences 2.12 ADC Interface Compatibility Design Table 2-19 Differences of ADC signal Pin No. Interface Name MU509 MC509 MU609 ME209u- ME909u MU709 ME909s ADC_1 ADC_2 [1]: The ME909u-523 module provides two ADC interfaces. ME909u-521 does not support ADC interface at present (the firmware does not support these features yet).

  • Page 48: Mechanical Specifications Compatibility Design Guide

    Design Guide 3.1 Dimension Differences Table 3-1 shows the dimension differences of Huawei 30 mm × 30 mm LGA modules. It is recommended that the reserved height is 2.65 mm ± 0.20 mm (height of MC509, which is the highest of Huawei 30 mm × 30 mm LGA modules) for compatibility design.

  • Page 49: Customer Pcb Design

    To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: Figure 3-2 The footprint design of Huawei 30 mm × 30 mm LGA modules (unit: mm) MU509-b/MU509-c/MU509-g MU609/ME909u-521...

  • Page 50: Requirements On Pcb Layout

    HUAWEI 30 mm × 30 mm LGA Module Mechanical Specifications Compatibility Hardware Migration Guide Design Guide Please note that the differences of PCB pad among 30 mm × 30 mm LGA modules.  The pin 49, pin 53 and pin 57 of MU709, ME209u-526, ME909u-523 and ME909s/MU509-65 are empty.

  • Page 51: Stencil Design

    HUAWEI 30 mm × 30 mm LGA Module Mechanical Specifications Compatibility Hardware Migration Guide Design Guide 3.3.2 Stencil Design It is recommended that the stencil for the 30 mm × 30 mm LGA modules be 0.12 mm in thickness. For the stencil design, see Figure 3-4 .
  • Page 52 HUAWEI 30 mm × 30 mm LGA Module Mechanical Specifications Compatibility Hardware Migration Guide Design Guide Figure 3-5 Reflow profile ° C 235° C<Tmax<245° C 60s~100s 45s~80s Table 3-2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone (40° C–...

  • Page 53: Appendix

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix Appendix Table 4-1 Definition of LGA Interfaces MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level...
  • Page 54 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 55 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 56 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 57 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 58 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 59 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 60 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 61 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 62 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 63 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 64 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition...
  • Page 65 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix MU509 MC509 MU609 ME909u-521 ME909u-523/ME209u-526 MU709 ME909s Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Signal Level Definition Definition Definition Definition Definition Definitio Definition The NC pins are not connected, therefore, before you deal with these pins, please refer to the corresponding hardware guide.
  • Page 66 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix Figure 4-2 Top view of sequence of MU509-b/MU509-c/MU509-g and MC509 interface pins HUAWEI Proprietary and Confidential Issue 08 (2016-12-12) Copyright © HUAWEI Technologies Co., Ltd.
  • Page 67 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix Figure 4-3 Top view of sequence of MU609/ME909u-521 interface pins HUAWEI Proprietary and Confidential Issue 08 (2016-12-12) Copyright © HUAWEI Technologies Co., Ltd.
  • Page 68 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Appendix Figure 4-4 Top view of sequence of MU709/ME209u-526/ME909u-523/ME909s/ MU509-65 interface pins HUAWEI Proprietary and Confidential Issue 08 (2016-12-12) Copyright © HUAWEI Technologies Co., Ltd.

  • Page 69: Acronyms And Abbreviations

    HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Acronyms and Abbreviations Acronyms and Abbreviations Acronym or Abbreviation Expansion Auxiliary CDMA Code Division Multiple Access CMOS Complementary Metal Oxide Semiconductor Coding Scheme Direct Current Data Communication Equipment Down Link...
  • Page 70 HUAWEI 30 mm × 30 mm LGA Module Hardware Migration Guide Acronyms and Abbreviations Acronym or Abbreviation Expansion Long Term Evolution Not Connected Power Amplifier Printed Circuit Board Radio Frequency RUIM Removable User Identity Module Short Message Service Transient Voltage Suppressor...

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