Customer Pcb Design; Pcb Pad Design - Huawei MU509 Hardware Migration Manual

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Figure 3-1 Dimensions of Huawei 30 mm × 30 mm LGA modules (unit: mm)
MU509 MC509
ME909u
MU609
ME209u-526
MU509 MC509

3.2 Customer PCB Design

3.2.1 PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
Figure 3-2 The footprint design of Huawei 30 mm × 30 mm LGA modules (unit: mm)
MU509-b/MU509-c/MU509-g
/MC509
Issue 08 (2016-12-12)
MU709
ME909u ME209u-526
MU609/ME909u-521
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
Mechanical Specifications Compatibility
ME909s-120
MU709
MU609
Design Guide
ME909s-821
ME909s-821
ME909s-120
ME209u-526/ME909u-523/MU709
/ME909s/MU509-65
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