Customer Pcb Design; Pcb Surface Finish; Pcb Pad Design; Solder Mask - Huawei MU509 Series Hardware Manual

Hsdpa lga module

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HUAWEI MU509 Series HSDPA LGA Module

Hardware Guide

6.7 Customer PCB Design

The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG).

Organic Solderability Preservative (OSP) may also be used, ENIG preferred.

To achieve assembly yields and solder joints of high reliability, it is recommended that

the PCB pad size be designed as follows:

Figure 6-4 Design of the solder pads on customers' PCBs (unit: mm)

NSMD is recommended. In addition, the solder mask of the NSMD pad design is

larger than the pad so the reliability of the solder joint can be improved.

The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side

of the solder mask must be 50 µm–75 µm larger than the pad. The specific size

depends on the processing capability of the PCB manufacturer.

Issue 09 (2014-03-06)

Huawei Proprietary and Confidential

Process Design

Table of Contents

Mu509-b Mu509-1 Mu509-c Mu509-g