Packaging - Huawei MU509 Series Hardware Manual

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide

6.5 Packaging

HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons.
Issue 09 (2014-03-06)
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5
9
8
7
6
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
323.90
4
1:2
56.08
13
89.74
14
123.40
15
157.06
16
190.72
17
224.38
18
258.04
19
291.70
20
Process Design
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10
* 30.40 0.10 All
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*6.60
21
3.50
22
22.42 0.15
12
Z
ESD PPE
Y
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