Specification Of Rework; Process Of Rework - Huawei MU509 Series Hardware Manual

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
Figure 6-6 Reflow profile
Table 6-2 Reflow parameters
Temperature Zone
Preheat zone
(40°C–150°C)
Soak zone
(150°C–200°C)
Reflow zone (> 217°C)
Cooling zone

6.9 Specification of Rework

6.9.1 Process of Rework

Issue 09 (2014-03-06)
Time
60s–120s
(t1–t2): 60s–120s
(t3–t4): 30s–90s
Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s
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Process Design
Key Parameter
Heating rate: 0.5°C/s–2°C/s
Heating rate: < 1.0°C/s
Peak reflow temperature:
230°C–250°C
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