Specification Of Rework; Process Of Rework; Preparations Of Rework; Removing Of The Module - Huawei MC509 Series Hardware Manual

Cdma lga module

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HUAWEI MC509 Series CDMA LGA Module

Hardware Guide

6.10 Specification of Rework



The solder is molten and reflowed through heating during the module removing

process. The heating rate must be quick but controllable in order to melt all the solder

joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,

and their solder joints against heating or mechanical damages.

Issue 02 (2013-05-06)

Remove barrier or devices that can't stand high temperature before rework.

If the device to be reworked is beyond the storage period, bake the device

according to Table 6-1 .



The LGA module has many solder pads and the pads are large. Therefore, common

soldering irons and heat guns cannot be used in the rework. Rework must be done using

either infrared heating rework stations or hot air rework stations. Infrared heating rework

stations are preferred, because they can heat components without touching them. In

addition, infrared heating rework stations produce less solder debris and less impact on

modules, while hot air rework stations may cause shift of other components not to be

reworked.



It is proposed that a special clamp is used to remove the module.

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Mechanical Specifications

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