Welding Area Treatment; Module Installation - Huawei MC509 Series Hardware Manual

Cdma lga module

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HUAWEI MC509 Series CDMA LGA Module

Hardware Guide

Figure 6-8 Equipment used for rework

6.10.4 Welding Area Treatment

Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the

solder.

Step 2 Clean the pad and remove the flux residuals.

Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste

to the pad of the module by using the rework fixture and stencil or apply some solder

paste to the pad on the PCB by using a rework stencil.

Install the module precisely on the module and ensure the right installation direction

of the module and the reliability of the electrical connection with the PCB. It is

recommended that the module be preheated in order to ensure that the temperature

of all parts to be soldered is uniform during the reflow process. The solder quickly

reflows upon heating so the parts are soldered reliably. The solder joints undergo

proper reflow duration at a preset temperature to form a favorable Intermetallic

Compound (IMC).

Issue 02 (2013-05-06)

It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the

rework.



It is recommended that a special clamp be used to pick the module when the module is

installed on the pad after applied with some solder.



A special rework device must be used for the rework.

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Mechanical Specifications

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