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Control Unit
MC509-a
Huawei MC509-a Manuals
Manuals and User Guides for Huawei MC509-a. We have
2
Huawei MC509-a manuals available for free PDF download: Hardware Manual, Hardware Migration Manual
Huawei MC509-a Hardware Manual (78 pages)
CDMA LGA Module
Brand:
Huawei
| Category:
Control Unit
| Size: 1.69 MB
Table of Contents
Table of Contents
5
1 Introduction
8
2 Overall Description
9
About this Chapter
9
Function Overview
9
Circuit Block Diagram
11
Application Block Diagram
12
3 Description of the Application Interfaces
13
About this Chapter
13
LGA Interface
13
Power Interface
22
Overview
22
VBAT Interface
23
Output Power Supply Interface
24
Signal Control Interface
24
Overview
24
Input Signal Control Pins
25
Output Signal Control Pin
29
WAKEUP_IN Signal
33
WAKEUP_OUT Signal
33
UART Interface
34
Overview
34
Circuit Recommended for the UART Interface
35
USB Interface
36
RUIM Card Interface
37
Overview
37
Circuit Recommended for the RUIM Card Interface
38
Audio Interface
40
Analogue Audio
40
Digital Audio
41
General Purpose I/O Interface
43
JTAG Interface
43
RF Antenna Interface
44
Reserved Interface
44
NC Interface
44
4 RF Specifications
45
About this Chapter
45
Antenna Installation Guidelines
45
Operating Frequencies
45
Conducted RF Measurement
46
Test Environment
46
Test Standards
46
Conducted Rx Sensitivity and Tx Power
46
Conducted Receive Sensitivity
46
Conducted Transmit Power
47
Antenna Design Requirements
47
Antenna Design Indicators
47
Interference
50
CDMA Antenna Requirements
50
Radio Test Environment
51
5 Electrical and Reliability Features
52
About this Chapter
52
Extreme Working Conditions
52
Operating and Storage Temperatures and Humidity
53
Electrical Features of Application Interfaces
53
Power Supply Features
54
Input Power Supply
54
Power Consumption
54
Reliability Features
55
EMC and ESD Features
56
6 Mechanical Specifications
58
About this Chapter
58
Storage Requirement
58
Moisture Sensitivity
58
Dimensions and Interfaces
59
PCB Pad Design
61
Packaging
61
Label
63
Customer PCB Design
64
PCB Surface Finish
64
PCB Pad Design
65
Solder Mask
65
Requirements on PCB Layout
65
Assembly Processes
66
General Description of Assembly Processes
66
Stencil Design
66
Reflow Profile
67
Specification of Rework
69
Process of Rework
69
Preparations of Rework
69
Removing of the Module
69
Welding Area Treatment
70
Module Installation
70
Specifications of Rework
71
7 Certifications
72
About this Chapter
72
8 Safety Information
73
Interference
73
Medical Device
73
Area with Inflammables and Explosives
73
Traffic Security
74
Airline Security
74
Safety of Children
74
Environment Protection
74
Rohs Approval
74
Laws and Regulations Observance
74
Care and Maintenance
75
Emergency Call
75
Regulatory Information
75
FCC Statement
75
9 Appendix A Circuit of Typical Interfaces
76
10 Appendix B Acronyms and Abbreviations
77
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Huawei MC509-a Hardware Migration Manual (70 pages)
30 mm × 30 mm LGA Module
Brand:
Huawei
| Category:
Control Unit
| Size: 2.68 MB
Table of Contents
Table of Contents
5
1 Overview
7
2 LGA Interface Differences
19
LGA Interfaces
19
Control Interface Compatibility Design
20
Detailed Interface Differences
20
Control Interface Design Guide
21
Audio Interface Compatibility Design
27
Detailed Interface Differences
27
PCM Interface Design Guide
28
Analog Interface Design Guide
28
GPIO Interface Compatibility Design
29
Antenna Interface Compatibility Design
32
Detailed Interface Differences
32
Antenna Interface Design Guide
33
VCC_EXT Interface Compatibility Design
37
VBAT Interface Compatibility Design
38
Detailed Interface Differences
38
VBAT Interface Design Guide
38
JTAG Interface Compatibility Design
39
Detailed Interface Differences
39
JTAG Interface Design Guide
40
UART Interface Compatibility Design
41
Detailed Interface Differences
41
UART Interface Design Guide
42
USB Interface Compatibility Design
44
Detailed Interface Differences
44
USB Interface Design Guide
44
LED Interface Compatibility Design
46
Detailed Interface Differences
46
LED Interface Design Guide
46
ADC Interface Compatibility Design
47
3 Mechanical Specifications Compatibility Design Guide
48
Dimension Differences
48
Customer PCB Design
49
PCB Pad Design
49
Requirements on PCB Layout
50
Assembly Processes
50
General Description of Assembly Processes
50
Stencil Design
51
Reflow Profile
51
4 Appendix
53
5 Acronyms and Abbreviations
69
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