Control Interface Compatibility Design; Detailed Interface Differences - Huawei MU509 Hardware Migration Manual

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide

2.2 Control Interface Compatibility Design

2.2.1 Detailed Interface Differences

Table 2-1 Differences of the control interfaces
Pin No. Interface Name
11 Control WAKEUP_IN
71 WAKEUP_OUT
45 W_DISABLE
15 SLEEP_STATUS
70 USIM_DET
81 POWER_ON_OFF
100 RESIN_N
Figure 2-2 Maintaining the resistance in sleep mode
Issue 08 (2016-12-12)
MU509
[1]
CMOS 2.6 V
[2]
CMOS 2.6 V
GPIO
CMOS
2.6 V
[3]
Reserved
N
Y
Y
[1]: For ME909s, the pin can be used to wake up the module.

[2] and [3]: For ME909s, when the module is not in sleep mode, this pin's drive current is 4

mA. When the module is in sleep mode, this pin's output level is low and drive
current smaller than 0.1 mA. The resistance is maintained at 5–15 K, as shown in
Figure 2-2 . The output level may be changed if there is a stronger pull-up. It is
recommended that customers take Figure 2-4 and Figure 2-5 for reference to design
their circuit.
Module
(Modem)
BB Chip
R=5–15 K
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
MC509 MU609 ME209u
-526
CMOS 1.8 V
CMOS 1.8 V
CMOS Reserved
2.6 V
CMOS 1.8 V
N N N
Y Y Y
Y Y Y
LGA Interface Differences
ME909u MU709 ME909s
N Y Y
Y Y Y
Y Y Y
20