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HUAWEI MU739 HSPA+ LGA Module Hardware Guide About This Document Summary This document provides information about the major functions, supported services, system architecture, and technical references of HUAWEI MU739 HSPA+ LGA Module. The following table lists the contents of this document. Chapter Details...
Introduction This document describes the hardware application interfaces and air interfaces that are provided when the HUAWEI MU739 HSPA+ LGA Module (hereinafter referred to as the MU739 module) is used. This document helps you to understand the interface specifications, electrical features and related product information of the MU739 module.
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU739 module and provides: Function Overview Circuit Block Diagram Application Block Diagram 2.2 Function Overview...
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Globe Certification Forum (GCF) PCS Type Certification Review Board (PTCRB) The certifications of different type of MU739 module are different because of sale markets. To get the details, please refer to ‘Chapter 7’. Huawei Proprietary and Confidential Issue 01 (2011-08-24)
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Overall Description 2.3 Circuit Block Diagram Figure 2-1 shows the circuit block diagram of the MU739 module. The application block diagram and major functional units of the MU739 module contain the following parts: Baseband controller ...
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Overall Description 2.4 Application Block Diagram Figure 2-2 Application block diagram of the MU739 module USB Interface The USB interface supports USB 2.0 high speed standard. USIM Interface The USIM interface provides the interface for a USIM card.
NC Interfaces 3.2 LGA Interface The MU739 module uses a 114-pin LGA as its external interface. For details about the module and dimensions of the LGA, see “6.2 Dimensions and Interfaces”. Huawei Proprietary and Confidential Issue 01 (2011-08-24)
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-1 shows the sequence of pins on the 114-pin signal interface of the MU739 module. Figure 3-1 Bottom view of sequence of LGA interface pins Power pads...
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HSIC_HOST_ACTIVE -0.3 Active: the host controller is switched on. Used to synchronize enumeration. HSIC Slave Wakeup, used by MU739 in L0 to indicate HSIC_SLAVE_WAKE that link can be switched to -0.3 L2 because MU739 has no data to transfer. General I/O pins. The...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Typical Reserved Reserve Reserved Reserve SIM_VCC power supply for USIM card - 1.8/2.9 HSIC_USB_STRB Inter-connect USB Strobe -0.3 HSIC_USB_DATA Inter-connect USB Data -0.3...
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Pin Name Description DC Characteristics (V) Normal Typical H: AP wakeup MU739. WAKEUP_IN -0.3 L: AP set MU739 to sleep mode. WAKEUP_OUT Module to wake up the AP -0.3 Used by CP in L0 to HSIC_SUSPEND_RE indicate that link can be -0.3...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Typical Ground Ground MAIN_ANT Main antenna Ground Ground Ground No connect Ground Ground AUX_ANT Diversity antenna Ground Ground No connect No connect...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Normal Typical Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground...
When the MU739 module is used for different applications, special attention should be paid to the design of the power supply. When the MU739 module transmits at the maximum power, the transient peak current may reach 2.0 A. In this case, the...
70 mA (typical value).The VCC_EXT1 pin can supply 1.8 V power. 3.4 Signal Control Interface 3.4.1 Overview The signal control part of the interface in the MU739 module consists of the following: Power on (ON1, ON2_N) pins Reset output pin (RESOUT_N) ...
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LED_STATUS -0.3 LED_MODE O Pin for network mode LED -0.3 H: AP wakeup MU739. WAKEUP_IN -0.3 L: AP set MU739 to sleep mode. WAKEUP_OUT O Module to wake up the AP -0.3 Indicates the sleep status of MU739 SLEEP_STATUS -0.3...
3.4.2 Input Signal Control Pins The MU739 module implements power-on and resets the hardware through the input signal control pins. The power-on and reset control parts of the interface of the MU739 module include ON1, ON2_N interfaces signal and the baseband reset interface signal RESIN_N and the system reset signal PWRDWN_N.
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces As the PWRDWN_N, RESIN_N signals are relatively sensitive, it is recommended that you install a 33 pF capacitor near these pins of the interfaces for filtering. In addition, when you design a circuit on the PCB of the interface board, it is recommended that the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge.
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RF OFF W_DISABLE_N PWRDWN_N . If the software of the MU739 module The PWRDWN_N pin is used to reset the system. fails responding, you can reset the hardware through the PWRDWN_N signal as shown in Figure 3-7 .When a low-level pulse is supplied through the PWRDWN_N pin for about 20 ms, the module will be put into the initial state.
MU739 doesn’t support hardware shut down, can only be powered off by software. WAKEUP_IN Signal The AP controls the sleep and wakeup status of the MU739 module through the WAKEUP_IN signal. If there is no external WAKEUP_IN signal, the wireless module keeps in the wakeup status by default.
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Blinking Once Each Time Figure 3-8 Status when the indictor blinks once each time Blinking Fast Figure 3-9 Status when the indictor blinks fast 100 ms Light on...
GPIO (with internal pull-up). 3.5 USB Interface The MU739 is compliant with USB 2.0 high speed protocol. The USB interface is powered from the USB_VBUS (3.3V/5V typical) supply. The USB input/output lines are compatible with the USB 2.0 VBAT signal specifications. Figure 3-14 shows the circuit of the USB interface.
USB data signal D- USB_VBUS Power supply for USB 3.3/5 According to USB protocol, for bus timing or electrical characteristics of MU739 USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0. Figure 3-14 Recommended circuit of USB interface The layout design of this circuit on the AP board should comply with the USB 2.0 high speed...
3.6.2 Circuit Recommended for the USIM Card Interface As the MU739 module is not equipped with a USIM card socket, you need to place a USIM card socket on the user interface board. The USIM card signals are transmitted outwards through the 114-pin LGA interface.
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SIM_DATA signal wires with a ground wire. The GND pin of the USIM card socket and the GND pin of the USIM card must be well connected to the power GND pin supplying power to the MU739 module. A 100 nF capacitor (0402 package is recommended so that larger capacitance ...
(TVS) diode is placed as close as possible to the USIM card socket, and the GND pin of the ESD protection component is well connected to the power GND pin that supplies power to the MU739 module. Figure 3-17 ESD protection circuit on the USIM card 3.7 Audio Interface...
O Word alignment I2S_WA1 -0.3 select The MU739 module has reserved audio interface in hardware, but the software couldn’t support this function right now. If you need, please contact us for more details about this information. 3.8 IPC Interface The IPC (Inter Processor Communications) interface includes HSIC interface and MIPI_HSI interface.
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description DC Characteristics (V) Typical HSIC Host Active; Inactive: the host controller is switched off; HSIC_HOST_ -0.3 Active: the host ACTIVE controller is switched on. Used to synchronize enumeration.
Hardware Guide Description of the Application Interfaces 3.8.2 MIPI_HSI interface MU739 support MIPI HSI (High-speed Synchronous Serial Interfaces), the maximum data rates can reach to156 Mbps for TX and 230 Mbps for RX. Table 3-11 IPC interface signals Pin Name...
Description of the Application Interfaces 3.10 JTAG Interface LGA MU739 module provides one JTAG interface (Joint Test Action Group). It is recommended that set the 5 pins related to JTAG interface as test points on the AP for tracing and debug.
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Description of the Application Interfaces 3.13 NC Interfaces The MU739 module has 12 NC pins. All of NC interfaces should not be connected. Please keep these pins open. Table 3-16 List of NC pins Pin No.
The instrument compensation needs to be set according to the actual cable conditions. 4.4.2 Test Standards Huawei modules meet all 3GPP test standards relating to both 2G and 3G. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed.
According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-3 lists the required ranges of the conducted transmit power of MU739. The tested values listed in the Test Value column must range from the minimum power to the maximum power.
In addition, the transmission cable from the antenna port of MU739 to the antenna is also part of the antenna. The cable loss increases with the cable length and the frequency. It is recommended that the cable loss be as low as possible, for example, U.FL-LP-088...
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Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 values are recommended for the antenna of MU739: S11 of the master antenna < – 6 dB Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation.
Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.
The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP), and TIS can be tested in a microwave testing chamber. Huawei has a complete set of OTA test environments (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certified by professional organizations and are applicable to testing at frequencies ranging from 380MHz to 6GHz.
EMC and ESD Features 5.2 Absolute maximum ratings Table 5-1 lists the absolute maximum ratings for the MU739 module. Using the MU739 module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute maximum ratings for the MU739 module...
°C storage Moisture [1]: When the MU739 module works at this temperature, all its RF indexes comply with the 3GPP TS 45.005 specifications. [2]: When the MU739 module works at this temperature, certain RF indexes do not comply with the 3GPP TS 45.005 specifications.
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Table 5-4 Electrical features of Digital Pins DPLUS, DMINUS (IC-USB) Note Minimum Parameter Description Maximum Unit Value Value 0.65 x High-level +0.3 DDP_USIM input voltage = 1.8 DDP_USIM DDP_USIM 0.35 *...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Note Parameter Description Minimum Maximum Unit Value Value VDD_IO12 = 1.2 V, High-level 0.75 * output VDD_IO12 voltage = -2.0 mA VDD_IO12 = 1.2 V, Low-level 0.25 * output...
Table 5-10 , Table 5-11 and Table 5-12 . The power consumption listed in this section is tested when the power supply of MU739 module is 3.8 V. Typical values are measured at room temperature, and minimum and maximum values are measured over the entire operating temperature range.
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Table 5-10 Averaged standby DC power consumption Description Bands Test Value Units Notes/Configuration Standby current consumption with Sleep mode activated-Suspend (assumes USB bus is fully suspended during measurements) HSPA+ / WCDMA UMTS DRX cycle = 8 (2.56 s)
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Description Band Test Value Units Power (dBm) Band II 1 dBm Tx Power (PCS 1900) 10 dBm Tx Power 24 dBm Tx Power Band IV 1 dBm Tx Power...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Description Test Value Units Configuration 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down GPRS1900 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down...
The above values are the average of some test samples. 5.6 Reliability Features Table 5-13 lists the test conditions and results of the mechanical reliability of the MU739 module. Table 5-13 Test conditions and results of the mechanical reliability of the MU739 module Item Test Condition Standard Low-temperature Temperature: –40ºC ±...
Drop test First case: 0.3 m in height. Drop the IEC60068 MU739 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested. Second case: 0.8 m in height. Drop the MU739 module on the marble terrace with one surface facing downwards twice.
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the following aspects of the MU739 module: Dimensions and Interfaces Customer PCB Pad Design Label Packing System 6.2 Dimensions and Interfaces Figure 6-1 shows the dimensions of MU739 in details.
6.3 Customer PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the customer PCB pad sizes be designed as the same as MU739’s LGA pads. For details, see Figure 6-2 . Figure 6-2 PCB pad design Unit:mm 6.4 Label...
260°C. And the color of the material of the nameplate can’t change. 6.5 Packing System HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. To get the details about the packing system, please refer to HUAWEI LGA Module Process Design Guide.
GCF and PTCRB 7.2 Certifications The certification of MU739 has not carried out, Table 7-1 shows certifications the MU739 will be implemented. For more demands, please contact us for more details about this information. Table 7-1 Product Certifications Certification...
7.3.2 WEEE WEEE stands for the Waste Electrical and Electronic Equipment Directive. The WEEE mark is on the nameplate of the product. Huawei has concluded recycling agreements with four professional recycling companies in Europe. According to the agreements, the companies are responsible for recycling all Huawei waste equipment in Europe.
The rate of recovery reaches 75% by an average weight per product. The reuse and recycling rate of components, materials, and substances reaches 65% by an average weight per product (the additional 10% is for energy recovery). Huawei Technical Support Department also declares the number and weight of the products delivered every year on the European Recycling Platform.
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Certifications Sale forbidden Inventory seizure Compulsory callback Fine Being accused or put into prison 7.4.3 Product Certification Test Items A product certification test consists of any or any combination of the following items: ...
The CE0682 mark issued by CETECOM, the UL mark issued by UL, and the GS mark issued by TUV Rheinland are three examples of NB certification marks. NB certification is used for Huawei modules in most cases. 7.4.6 Certification Types CE Certification According to the R&TTE Directive 1999/95/EC, all wireless equipment and...
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An FCCID consists of capital letters in English, digits, and symbols - only. No other character is allowed. For any Huawei product, the product model is used as the product number. For example, the FCC ID of the EM770W is QISEM770W.
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Certifications Comply with the following rules when making DGT marks: Comply with the Technical Specifications for Low-Power Radio-Frequency Devices and the Compliance Approval Regulations on Controlled Telecommunications Radio-Frequency Devices. Affix or print marks of appropriate size on the equipment bodies because the ...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Certifications 1885–1980 MHz and 2110–2170 MHz: The 3G mobile communication technologies are to be used. The A-tick mark is as follows: N14036 TELEC and JATE Certification (Japan) Telecom Engineer Center (TELEC) ...
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The complete IC certification or registration number is as follows: IC: XXXXXX-YYYYYYYY XXXXXX XXXXXX is the company number issued by the IC (Huawei: 6369A). YYYYYYYY YYYYYYYY is the unique product number (UPN) consisting of up to eight capital letters in English and/or digits.
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Certifications Applicant − Manufacturer − Equipment name − Equipment type − Place of manufacture − Remarks − Date of issue − Date of expiry − A network access license often is valid for three years. The Telecommunications...
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MIIT. In other words, completion of equipment type approval is one of the prerequisites for network access application. The relevant CMIIT ID should be marked on the nameplate of Huawei radio terminals according to article 4 in the Provisions on Management of Manufacture of Radio Transmission Equipment.
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China without a CCC certificate issued by designated certification bodies or without a CCC mark. CCC marks are classified into standard and non-standard marks. Huawei products use non-standard CCC marks. RoHS, REACH, JGPSSI, and Chinese Environmental Protection RoHS: the restriction of the use of certain hazardous substances in electrical and ...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Certifications The EU does not specify any RoHS mark. Huawei, however, designs the preceding RoHS mark to distinguish between environment-friendly and environment-unfriendly products. For Huawei RoHS marks, any color is acceptable. REACH: Regulation (EC) No. 1907/2006 of the European Parliament and of the ...
In the case of certification of the laptops installed with Huawei modules, the relevant test reports of Huawei modules can be directly used in accordance with the following rules: The conductivity test data in the Huawei RF test report can be directly used by the laptop manufacturer.
The laptop manufacturer should test antennas of the laptops if the antenna − gain of the laptop is higher than that used in the certification test of Huawei modules. The laptop manufacturer should test the compliance of the laptops with EMC and ...
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Certifications The test system defined by the GCF requires thorough conformance tests of terminals. The test system consists of indoor and outdoor tests. Outdoor tests mean field testing of terminals in actual networks. Outdoor tests ...
MID, a smartphone, etc. Overall-System GCF Certification Huawei modules pass the GCF certification before being released to the market. Huawei performs 2000 to 3000 test items for each type of modules. The major tests are as follows: Protocol conformance test ...
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SIM/USIM interface with appropriate test instruments in accordance with the relevant 3GPP protocol requirements. Huawei provides a test report of the product to be certified for the customers who require the GCF certification. The test report is issued by an organization designated for GCF certification.
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DOC to the GCF website. Overall-System PTCRB Certification Huawei modules pass the PTCRB certification before being released to the market. Huawei performs 2000 to 3000 test items for each type of modules. The major tests are as follows: Protocol conformance test ...
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Discuss test details with the test organization. Provide the test organization with the test report of Huawei modules and the modifications of the integrated equipment. The test organization then can determine the detailed test items and determine the test schedule accordingly.
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Safety Information Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security Observe local laws and regulations while using the wireless device. To prevent ...
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Safety Information 8.10 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.11 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.
The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons. Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment Huawei Proprietary and Confidential Issue 01 (2011-08-24)
HUAWEI MU739 HSPA+ LGA Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface LGA Module and ANT Interface J201 J202 100PF MAIN_ANT AUX_ANT 100PF C212 C213 M201 MU739 HSIC_HOST_WAKEUP HSIC_HOST_WAKEUP VBAT_PA HSIC_SUSPEND_REQUEST VBAT_PA_DCDC HSIC_SUSPEND_REQUEST...
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HUAWEI MU739 HSPA+ LGA Module Hardware Guide Appendix A Circuit of Typical Interface Choose one power on signal(ON1 or ON2_N) High edge active ON1: ON2_N: Low level active V_ON1 ON2_N VBAT_PMU VBAT_PMU V_ON1 VBAT ON signal from AP R303 220K...
HUAWEI MU739 HSPA+ LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion European Conformity Coding Scheme Circuit Switched Data Direct Current Direct memory access External Bus Unit Electronic Industries Association Electromagnetic Compatibility...
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HUAWEI MU739 HSPA+ LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Inter Processor Communications International Standards Organization I2C Sound Liquid Crystal Polyester Low-Dropout Light-Emitting Diode Land Grid Array Multi-chip Package MIPI Mobile Industry Processor Interface...