Reliability Features - Huawei MU739 Hardware Manual

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Description

5.6 Reliability Features

Table 5-13 lists the test conditions and results of the mechanical reliability of the
MU739 module.
Table 5-13 Test conditions and results of the mechanical reliability of the MU739 module
Item
Low-temperature
storage
High-temperature
storage
Low-temperature
working
High-temperature
working
Damp heat cycling
Temperature shock
Issue 01 (2011-08-24)
Test Value
155
230
In idle mode, the module is registered to the network, USB bus is active, and no voice or

data call connection is ongoing.
The above values are the average of some test samples.

Test Condition
Temperature: –40ºC ± 2ºC
Test duration: 24 h
Temperature: 85ºC ± 2ºC
Test duration: 24 h
Temperature: - 30ºC ± 2ºC
Test duration: 24 h
Temperature: 75ºC ± 2ºC
Test duration: 24 h
High temperature: 55ºC ± 2ºC
Low temperature: 25ºC ± 2ºC
Humidity: 95%
Repetition times: 4
Test duration: 12 h + 12 h
Low temperature: - 40ºC ± 2ºC
High temperature: 85ºC ± 2ºC
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
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Electrical and Reliability Features
Units PCL Configuration
2 Up/1 Down
4 Up/1 Down
Standard
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
55