HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Figure 6-3 MU739 label
18.1 mm
6.5 Packing System
HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons. To get the details about the packing system, please refer to
HUAWEI LGA Module Process Design Guide.
Issue 01 (2011-08-24)
R1.0X3
28.1 mm
The picture mentioned above is only for reference.
The silk-screen should be clear, without burrs, and dimension should be accurate.
The material and surface finishing and coatings which used have to make satisfied with the
EU WEEE and RoHS directives.
The label must be heated up for 20 s~40 s and able to endure the high temperature of
260°C. And the color of the material of the nameplate can't change.
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Mechanical Specifications
1.5X1.5 mm
2 mm
5.0 mm
7 mm
61