Huawei MU509 Series Hardware Manual page 70

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
Item
Damp heat
cycling
Thermal shock
Salty fog test
Stress
Sine vibration
Issue 09 (2014-03-06)
Test Condition

High temperature: 55ºC
 Low temperature: 25ºC

Humidity: 95%±3%

Operation mode: working
with service connected

Test duration: 6 cycles;
12 h+12 h/cycle
 Low temperature: –40º
 High temperature: 85ºC
 Temperature change
interval: < 20s

Operation mode: no
power

Test duration: 100 cycles;
15 min+15 min/cycle

Temperature: 35°C
 Density of the NaCl
solution: 5%±1%

Operation mode: no
power, no package
 Test duration:
Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h
 Frequency range: 5 Hz to
200 Hz
 Acceleration: 1 Grms
 Frequency scan rate: 0.5
oct/min
 Operation mode: working
with service connected

Test duration: 3 axial
directions. 2 h for each
axial direction.

Operation mode: working
with service connected
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Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard Sample
size
JESD22- 3 pcs/group
A101-B
JESD22- 3 pcs/group
A106-B
JESD22- 3 pcs/group
A107-B
JESD22- 3 pcs/group
B103-B
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
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