Emc And Esd Features - Huawei MU509 Series Hardware Manual

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
Item
Shock test
Stress
Drop test
ESD with DVK (or
embedded in the
host)
ESD
Groups ≥ 2

5.7 EMC and ESD Features

The following are the EMC design comments:




Issue 09 (2014-03-06)
Test Condition

Half-sine wave shock
 Peak acceleration: 30
Grms

Shock duration: 11 ms
 Operation mode: working
with service connected

Test duration: 6 axial
directions. 3 shocks for
each axial direction.

Operation mode: working
with service connected

0.8 m in height. Drop the
module on the marble
terrace with one surface
facing downwards, six
surfaces should be
tested.

Operation mode: no
power, no package

Contact Voltage: ±2 kV,
±4 kV
 Air Voltage : ±2 kV, ±4 kV,
±8 kV
 Operation mode: working
with service connected
Attention should be paid to static control in the manufacture, assembly,
packaging, handling and storage process to reduce electrostatic damage to
HUAWEI module.
RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustment on RF match circuit.
TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.
TVS should be added on the SIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF;
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Electrical and Reliability Features
Standard Sample
size
JESD-B1 3 pcs/group
04-C
IEC6006 3 pcs/group
8-2-32
IEC6100 2 pcs
0-4-2
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
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