Huawei MU509 Series Hardware Manual page 78

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
Figure 6-2 Label for MU509-b, MU509-c and MU509-g
Figure 6-3 Label for HUAWEI MU509-1




Issue 09 (2014-03-06)
The picture mentioned above is only for reference.
The material and surface finishing and coatings which used have to make satisfied with the
RoHS directives.
The label must be heated up for 20s–40s and able to endure the high temperature of
260 °C.
For MU509-c module, the label in Figure 6-2 is the common label (there is the other label
specified for MU509-c).
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Process Design
78