Label - Huawei MU509 Series Hardware Manual

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
The following figure shows the packaging.

6.6 Label

The label is made from deformation-resistant, fade-resistant, and
high-temperature-resistant material and is able to endure the high temperature of
260°C.
Issue 09 (2014-03-06)
 All materials used must meet eco-friendly requirements.
 According to the requirements and test methods specified in EIA 541, the surface resistance
must be not greater than 1 x 10
 Packaging materials must be resistant to temperature higher than or equal to 150°C.
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Copyright © Huawei Technologies Co., Ltd.
10 Ω and triboelectricity must be lower than 100 V.
Orient LGA modules in the specified
direction.
Module quantity per tray: 5 x 9 = 45
pcs/tray
6 trays in each vacuum package. Do
not place any modules on the tray at the
top of each package.
Total quantity per package: 5 x 45 = 225
pcs/vacuum package.
Use vacuum packages; one package
per carton; module quantity per carton:
5 x 45 = 225 pcs/carton.
Process Design
77