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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
6.6 Customer PCB Design
6.6.1 PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.
6.6.2 PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
Figure 6-4 Design of the solder pads on customers' PCBs (Unit: mm)
6.6.3 Solder Mask
Non Solder Mask Defined (NSMD) is recommended. In addition, the solder mask of
the NSMD pad design is larger than the pad so the reliability of the solder joint can be
improved.
The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm–75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.
6.6.4 Requirements on PCB Layout
Issue 01 (2016-04-08)
To reduce deformation, a thickness of at least 1.0 mm is recommended.
Other devices must be located more than 3 mm (5 mm recommended) away from
the two parallel sides of the LGA module (rework requirement),and other sides
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Mechanical Specifications
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