Table of Contents
Advertisement
HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
9
Appendix A Circuit of Typical Interface
LGA Interface
U101
MAIN_ANT
10 7
MA IN_ A N T
EA R_ O U T _ N
11 5
N C
EA R_ O U T _ P
11 1
N C
POWER_ON_OFF
SPK R_ O U T _ N
8 1
P OW E R_ O N_ OF F
SPK R_ O U T _ P
10 3
N C
4 7
N C
P C M _ SY N C
3 7
N C
P C M _CL K
RESIN_N
10 0
R ES IN_ N
P C M _D IN
P C M _D O U T
10 2
N C
10 4
N C
1 7
N C
1 6
MU509_MISC
N C
1 4
PS _H O L D
1 5
R ESE R VED
2 8
R ESE R VED
2 9
R ESE R VED
4 3
R ESE R VED
4 4
G P IO
4 5
G P IO
4 6
G P IO
5 1
G P IO
S I M _CL K
5 5
G P IO
S I M _D A T A
10 5
G P IO
10 9
G P IO
S IM _R ESET
11 3
G P IO
S IM _ V C C
6 0
N C
6 1
N C
9 3
J T A G _R T C K
4 2
J T A G _ T C K
8 7
J T A G _ T D I
U A R T _C T S
7 2
J T A G _ T D O
U A R T _DC D
3 0
J T A G _ T MS
U A R T _D SR
3 6
J T A G _ T R S T _ N
U A R T _D T R
U A R T _R IN G
2 3
N C
U A R T _R T S
2 4
N C
U A R T _R X
2 5
N C
U A R T _ T X
2 6
N C
2 7
N C
1 8
N C
1 9
N C
2 0
N C
2 1
N C
U SB _D M
2 2
N C
U SB _D P
10 1
L E D_ M O D E
9 1
L E D_ S T A T U S
8 2
N C
8 3
N C
4 1
M IC1_ N
4 0
M IC1_ P
3 9
M IC2_ N
W AKE U P _ IN
3 8
M IC2_ P
W AKE U P _ O U T
9 4
N C
V CC_ EX T 1
9 5
N C
V CC_ EX T 2
LGA120H-3030A
U101
4 8
G ND 1
G ND2 1
4 9
MU509_MISC
NOT USED
G ND2 2
5 0
G ND 3
G ND2 3
5 2
G ND 4
G ND2 4
5 3
NOT USED
G ND2 5
5 4
G ND 6
G ND2 6
5 6
G ND 7
G ND2 7
5 7
NOT USED
G ND2 8
5 8
G ND 9
G ND2 9
5 9
G ND1 0
G ND3 0
10 6
G ND1 1
G ND3 1
10 8
G ND1 2
G ND3 2
11 0
G ND1 3
G ND3 3
11 2
G ND1 4
G ND3 4
11 4
G ND1 5
G ND3 5
11 6
G ND1 6
G ND3 6
12 1
G ND1 7
G ND3 7
12 2
G ND1 8
G ND3 8
12 3
G ND1 9
G ND3 9
12 4
G ND2 0
G ND4 0
G ND4 1
LGA120H-3030A
Issue 01 (2016-04-08)
POWER SUPPLY
9 6
9 7
1
P1
2
P2
9 9
3
P3
9 8
4
P4
5
P5
5
8
6
S1
6
7
S2
7
8
M1
11 7
9
N C
M2
11 8
N C
11 9
N C
0
12 0
N C
6 7
N C
6 9
N C
6 8
N C
9
N C
1 0
N C
6 6
N C
9 0
8 9
7 0
N C
8 8
3 4
6 2
N C
6 3
N C
6 4
N C
6 5
N C
8 0
7 5
7 3
7 9
7 7
7 4
7 8
7 6
3
N C
2
NOTE:"**"means that this compent is not welded,but need to reserve component solder pad.
N C
4
N C
1
N C
USB_DM
8 5
USB_DP
8 6
8 4
N C
VBAT
1 2
VBAT
1 3
VBAT
3 3
N C
3 5
V C OI N
150U
150U
**150U
1 1
7 1
3 2
3 1
9 2
N C
12 5
12 6
12 7
12 8
12 9
13 0
13 1
13 2
13 3
13 4
13 5
13 6
13 7
13 8
13 9
14 0
14 1
14 2
14 3
14 4
14 5
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Appendix A Circuit of Typical Interface
C104
**1.8p
0
C106
100nF
0
4.7u
C105
**1.8p
150U
150U
150U
150U
150U
**150U
**150U
2.2U
USIM CARD
POWER_ON_OFF and RESIN_N
POWER_ON_OFF
S101
1
3
C130
33p
2
4
S102
1
3
2
4
C131
33p
HPA00615DRVR
6
IN
O U T
IL IM
1MEG
3
F A UL T
G ND 1
100nF
4
EN
1uF
RT8015AGQW
2.2u
G ND 2
1 1
PV DD 1
P G N D
6
5
PV DD 2
L X2
7
4
V D D
L X1
8
3
F B
G ND 1
22u 22u 1uF 100nF
9
2
22p
180K
C O MP
S HDN /R T
1 0
1
J102
1
4
P1
P4
2
5
P2
P5
3
6
P3
P6
D101
RF-INTERFACE
J103
0
R110
1
L103
2 3
RESIN_N
These are impedance matching circuit, t he specific
capacitance and inductance value needs to be
adjusted, based on the characteristic impedance of
the practical PCB.
5V_P
1
30K
2
5
7
MAIN_ANT
1.2n
72
Advertisement
Table of Contents
