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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Engage Flex Pro-C
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sqcm
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
250W EPA92 RPOSL18
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
1
1
Page 1

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Summary of Contents for HP Engage Flex Pro-C

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 Figure 1 Remove the access panel Figure 2 Use T-15 screwdriver to loose the screw Figure 3 Remove the mail panel from the chassis Figure 4 Rotate up the ODD cage EL-MF877-00 Page 3 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 4 Figure 5 Disconnect SATA data cable from ODD Figure 6 Disconnect SATA power cable from ODD Figure 7 Remove SATA data/power cable from the hook Figure 8 Press the latch and push the ODD EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 5 Figure 9 Remove ODD from the ODD cage Figure 10 Disconnect SATA data cable from the HDD Figure 11 Disconnect SATA power cable from the HDD Figure 12 Press the latch and push the HDD EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 6 Figure 13 Remove HDD from the chassis Figure 14 Disconnect ODD SATA data cable from MB Figure 15 Disconnect HDD SATA data cable from MB Figure 16 Disconnect SATA power cable from MB EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 7 Figure 17 SATA cable go through the hole Figure 18 Disconnect PSU P3 cable from MB Figure 19 Disconnect PSU P1 cable from MB Figure 20 Disconnect PSU P2 cable from MB EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 8 Figure 21 Disconnect Power switch & LED cable from MB Figure 22 Disconnect USB3.1 cable from MB Figure 23 Use T-15 screwdriver to loose the screw of FIO Figure 24 Remove the FIO from the chassis EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 9 Figure 25 Disconnect the PS/2 & Audio cable from MB Figure 26 Use T-15 screwdriver to loose the screw of PS/2 & Audio and remove it from MB Figure 27 Remove memory from MB Figure 28 Disconnect speaker cable from MB EL-MF877-00 Page 9 Template Revision B...
  • Page 10 Figure 29 Use T-15 screwdriver to loose the screw of Figure 30 Remove the fan duct from MB speaker and remove it from chassis Figure 31 Use T-15 screwdriver to loose the screw of Figure 32 Press the latch heatsink and remove it from MB EL-MF877-00 Page 10 Template Revision B...
  • Page 11 Figure 33 Remove the CPU from MB Figure 34 Disconnect the fan cable from MB Figure 35 Remove the battery from MB Figure 36 Loose the latch EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 12 Figure 37 Use T-15 screwdriver to loose the screw of MB Figure 38 Remove the MB from chassis Figure 39 Remove the fan from chassis Figure 40 Remove the PSU along the rail EL-MF877-00 Page 12 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 13 Figure 41 Use PH1 screwdriver to loose the screw of fan Figure 42 separate the fan and fan duct and fan duct Figure 43 De-screw from the PSU's left side, use tool #1 Figure 44 De-screw from the PSU's right side, use tool #1 EL-MF877-00 Page 13 Template Revision B...
  • Page 14 Figure 45 De-screw from the PSU's left side, use tool #1 Figure 46 Remove the case top Figure 47 De-screw the PCBA from its 4 corners, use tool Figure 48 Remove the PCBA #1, then pull-up the connector of AC & Fan wire Figure 49 Cut-off the biggest electrolyte-capacitor from Figure 50 Select the large printed circuit board for treatment PCBA location C1 for treatment, use tool #2...

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Engage flex pro