HP OMEN X Disassembly Instructions Manual page 2

Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screwdriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dis-fasten D cover screw *10
2. Remove D cover
3. Dis-fasten centel hook screw *2
4. Pull out Battery cable
5. Dis-fasten battery screw *4
6. Remove Battery
7. Dis-fasten trunk assy screw *6
8. Remove Trunk assy
9. Dis-fasten Fan screw *3
10. Pull out Fan cable (Left side)
11. Remove Thermal Fan
12. Dis-fasten SSD screw *1(2)
13. Remove SSD
14. Dis-fasten Thermal module screw *11
15. Pull out Fan cable (Right side)
16. Remove Thermal module
17. Dis-fasten Speaker screw *2
18. Pull out Speaker cable
19. Remove Speaker -L & -R
20. Dis-fasten TP module screw *4
21. Pull out TP cable
22. Remove TP module
23. Pull out FFC/ Wire Cable ( DB, Audio, KB, BL,PW, HDD FFC , LCD/ LED/ DC cable Antenna Cable)
24. Remove HDD assy
25. Dis-fasten PCBA screw *7
26. Remove PCBA
27. Remove DC Cable
28. Dis-fasten Hinge Support BKT screw *12
29. Remove LED cable & Hinge support BKT
30. Dis-fasten Hinge screw *8
31. Remove Hinge support BKT
32. Dis-fasten Panel screw *4
33. Pull out LCD cable
34. Remove Panel
35. Dis-fasten Hinge BKT screw *6
EL-MF877-00
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Tool Size (if
applicable)
#1,#0
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