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1.1
Specifications
System
Form Factor
CPU
CPU Frequency
Chipset
Memory Type
Max. Memory Capacity
BIOS
Wake On LAN
Watchdog Timer
Power Requirement
Power Supply Type
Power Consumption (Typical)
Dimension (L x W x H)
Operating Temperature
Storage Temperature
Chapter 1 – Product Specifications
Intel SDM-L Module
8
/9
Generation Intel® Core™, Pentium®, and
th
th
Celeron® processors (Coffee Lake S, Coffee Lake
Refresh) TDP up to 35W
Up to 4.0 GHz
Intel® Chipsets H310/ Q370
DDR4 2666 SO-DIMM x 2 (non-ECC)
Up to 32GB
AMI BIOS
Yes
255 Levels
12V DC from the Docking Board through the
Edge Connector
AT/ATX
12V, 6.08A, estimate 72.96W with i7-9700TE at
100% loading
3.94" x 6.89" x 0.79" (100 mm x 175 mm x 20 mm)
32°F ~ 131°F (0°C ~ 55°C)
-40°F ~ 176°F (-40°C ~ 80°C)
2
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