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4. Outline
4-1) Outline dimensions and Pin information
TG5032CGN / SGN
4-2) Soldering pattern
Example of patterning design indicated as follows. In an actual design, please consider mounting density, the reliability of
soldering, etc. and check whether performance is optimal.
Soldering pattern of TG5032CGN / SGN
Please set By-pass capacitor
(0.1μF) near the Vcc pad
1.35
0.70
To GND
#9
#8
#7
#10
1.20
#1
#2
#3
2.50
12/21 Page
Unit: mm
OE pin = "H" or "open": Specified frequency output.
OE pin = "L" : Output is high impedance.
Do not connect "N.C." pin with any other leads (also mutually)
If OE Function does not use,
We recommended connecting OE (#3 pin) to Vcc (#9 pin)
(
unit : mm)
#6
#5
To maintain stable operation, provide a 0.1 μF
#4
by-pass capacitor at a location as near as
possible to the power source terminal of the
crystal product (between Vcc - GND).
Connections
Pin
VC-TCXO
TCXO
1
V
N.C.
C
2
N.C.
3
OE
4
GND
5
N.C.
6
OUT
7
N.C.
8
N.C.
9
V
CC
10
N.C.
No.: TG5032xGN_AE_Ver. 1.06
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