Sanyo TPM2770 Service Manual page 6

Mini b/w. television with am/em radio & digital alarm clock
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INSTRUCTIONS FOR HANDLING CHIPS
ABOUT CHIPS
Some
resistors
and
capacitors
are
provided
with
lead
wires,
while
others
are
not. The latter are called chips
because
of their configurations.
Unlike those with
lead
wires, they can be mounted
directly on the circuit board
as they as supplied in the package form. The chip resistor
is formally
called the fixed thick film chip resistor, and
the chip capacitor the monolithic ceramic chip capacitor,
and
the chip transistor
the microminiature
silicon chip
transistor.
CAUTION AND REMARKS
1.
2;
. Complete
Use only a pencil-tip soldering iron of less than 30W.
Keep the temperature of the soldering iron at 270 + 10
deg. C (518 + 18 deg. F) for soldering the chip resistors
and capacitors.
At 250 + 10 deg. C (482 + 18 deg. F) for soldering the
chip transistors.
soldering
work
in
less
than
3. seconds.
Excessive application of heat may damage electrode or
body of the element.
. The resistor chip is colored in black on the front surface
and white at the bottom. The front surface should face
upward when the chip is placed on the circuit board.
. The capacitor chip can be placed without regard to side.
NOTE:
Capacitors
are
colored
in three
colors
and
classified as follows.
a) Temperature compensation ceramic capacitors.
0.5 - 30pF : colored in white
11-510pF
: colored in Gray
b) Hi-K ceramic capacitors.
220 - 47000pF : colored in Brown
. The transistor chips have terminals as illustrated below.
Base _____
. Do not re-use the chip part once removed. Electrodes on
both sides or body itself might have been damaged due
to the
heat
applied
to the element
while removing.
Re-usage
may
cause
another
defect.
Re-usage
of
transistors
may
be possible provided
they have been
removed in good condition during the servicing.
TOOLS
REQUIRED
FOR SERVICING
1.
Pencil-tip soldering iron with temperature control.
* pencil-tip less than 3mm diameter (1/8'')
2. Solder.
* 0.7 - 1.0mm diameter (1/32" - 3/64")
3. Braided wire.
4.
A pair of tweezers, needle nose pliers or the like,
—6—
REMOVAL OF CHIP ELEMENTS
1. Apply
heat at the terminals with a soldering iron and
absorb melting solder with braided wire. (See Figure 8)
. Hold the chip with a pair of tweezers and turn it gently
while unsoldering
it at the terminals by applying heat
with a soldering iron. (See Figure 9)
. The
circuit
board
base
needs
to be cleaned
of any
remaining
solder with the braided
wire and soldering
iron.
* The removed chips cannot be used again.
Figure 8
Figure 9
MOUNTING CHIP ELEMENTS
1. Place the chip at its correct position on the pattern of
the printed circuit board and soider it.
* The soldering iron should not touch the body of the
chip element.
* Apply solder to the chip element as illustrated below.
2. Allow the chip to cool off after it has been soldered.
.
Solder
Chip Element
Chip Element
Solder
a
Solder
re
8
Aaa
8
.
WLIO:
x
O
(Incorrect)
(Correct)
P.C.B.

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